• 検索結果がありません。

IGBT NGTB75N65FL2WG

N/A
N/A
Protected

Academic year: 2022

シェア "IGBT NGTB75N65FL2WG"

Copied!
12
0
0

読み込み中.... (全文を見る)

全文

(1)

IGBT NGTB75N65FL2WG

This Insulated Gate Bipolar Transistor (IGBT) features a robust and cost effective Field Stop (FS) Trench construction, and provides superior performance in demanding switching applications, offering both low on state voltage and minimal switching loss.

Features

• Extremely Efficient Trench with Field Stop Technology

T

Jmax

= 175 ° C

• Soft Fast Reverse Recovery Diode

• Optimized for High Speed Switching

5 m s Short−Circuit Capability

• These are Pb−Free Devices

Typical Applications

• Solar Inverters

• Uninterruptible Power Supplies (UPS)

Welding

ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Collector−emitter Voltage VCES 650 V

Collector Current

@ TC = 25°C

@ TC = 100°C

IC

10075

A

Diode Forward Current

@ TC = 25°C

@ TC = 100°C

IF

10075

A

Diode Pulsed Current

TPULSE Limited by TJ Max IFM 200 A

Pulsed Collector Current, Tpulse Limited by TJmax

ICM 200 A

Short−circuit Withstand Time VGE = 15 V, VCE = 400 V, TJ≤ +150°C

tSC 5 ms

Gate−emitter Voltage VGE ±20 V

Transient Gate−emitter Voltage V

(TPULSE = 5 ms, D < 0.10) ±30

Power Dissipation

@ TC = 25°C

@ TC = 100°C

PD

595265

W

Operating Junction Temperature

Range TJ −55 to +175 °C

Storage Temperature Range Tstg −55 to +175 °C Lead temperature for soldering, 1/8″

from case for 5 seconds TSLD 260 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

TO−247 CASE 340AM

75 A, 650 V V

CEsat

= 1.70 V

E

off

= 1.0 mJ

Device Package Shipping ORDERING INFORMATION

NGTB75N65FL2WG TO−247

(Pb−Free) 30 Units / Rail 75N65FL2 = Specific Device Code A = Assembly Location

Y = Year

WW = Work Week G = Pb−Free Package

MARKING DIAGRAM

75N65FL2 AYWWG G

E C

G C E

(2)

THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal resistance junction−to−case, for IGBT RqJC 0.28 °C/W

Thermal resistance junction−to−case, for Diode RqJC 0.62 °C/W

Thermal resistance junction−to−ambient RqJA 40 °C/W

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)

Parameter Test Conditions Symbol Min Typ Max Unit

STATIC CHARACTERISTIC Collector−emitter breakdown voltage,

gate−emitter short−circuited VGE = 0 V, IC = 500 mA V(BR)CES 650 − − V

Collector−emitter saturation voltage VGE = 15 V, IC = 75 A

VGE = 15 V, IC = 75 A, TJ = 175°C VCEsat 1.50

− 1.75

2.30 2.00

− V

Gate−emitter threshold voltage VGE = VCE, IC = 350 mA VGE(th) 4.5 5.5 6.5 V Collector−emitter cut−off current, gate−

emitter short−circuited VGE = 0 V, VCE = 650 V

VGE = 0 V, VCE = 650 V, TJ = 175°C ICES

− −

− 0.1

4.0 mA

Gate leakage current, collector−emitter

short−circuited VGE = 20 V , VCE = 0 V IGES − − 200 nA

DYNAMIC CHARACTERISTIC Input capacitance

VCE = 20 V, VGE = 0 V, f = 1 MHz

Cies − 7500 − pF

Output capacitance Coes − 300 −

Reverse transfer capacitance Cres − 190 −

Gate charge total

VCE = 480 V, IC = 50 A, VGE = 15 V

Qg − 310 − nC

Gate to emitter charge Qge − 60 −

Gate to collector charge Qgc − 150 −

SWITCHING CHARACTERISTIC, INDUCTIVE LOAD Turn−on delay time

TJ = 25°C VCC = 400 V, IC = 75 A

Rg = 10 W VGE = 0 V/ 15 V

td(on) − 110 − ns

Rise time tr − 48 −

Turn−off delay time td(off) − 270 −

Fall time tf − 70 −

Turn−on switching loss Eon − 2.2 − mJ

Turn−off switching loss Eoff − 1.1 −

Total switching loss Ets − 3.3 −

Turn−on delay time

TJ = 150°C VCC = 400 V, IC = 75 A

Rg = 10 W VGE = 0 V/ 15 V

td(on) − 100 − ns

Rise time tr − 50 −

Turn−off delay time td(off) − 280 −

Fall time tf − 100 −

Turn−on switching loss Eon − 2.8 − mJ

Turn−off switching loss Eoff − 1.6 −

Total switching loss Ets − 4.4 −

DIODE CHARACTERISTIC

Forward voltage VGE = 0 V, IF = 75 A

VGE = 0 V, IF = 75 A, TJ = 175°C VF 1.50

− 2.20

2.40 2.90

− V

Reverse recovery time TJ = 25°C

IF = 75 A, VR = 400 V diF/dt = 200 A/ms

trr − 80 − ns

Reverse recovery charge Qrr − 0.40 − mC

Reverse recovery current Irrm − 8 − A

Reverse recovery time TJ = 175°C

IF = 75 A, VR = 400 V diF/dt = 200 A/ms

trr − 143 − ns

Reverse recovery charge Qrr − 1.45 − mC

Reverse recovery current Irrm − 16 − A

(3)

Figure 1. Output Characteristics Figure 2. Output Characteristics VCE, COLLECTOR−EMITTER VOLTAGE (V) VCE, COLLECTOR−EMITTER VOLTAGE (V)

8 6

5 4 3 2 1 0

Figure 3. Output Characteristics Figure 4. Typical Transfer Characteristics VCE, COLLECTOR−EMITTER VOLTAGE (V) VGE, GATE−EMITTER VOLTAGE (V)

10 5

0

Figure 5. VCE(sat) vs. TJ TJ, JUNCTION TEMPERATURE (°C)

175 150 125 100 75 50 25 0

IC, COLLECTOR CURRENT (A) IC, COLLECTOR CURRENT (A)

VCE, COLLECTOR−EMITTER VOLTAGE (V)

7 VGE = 20 V

to 13 V TJ = 25°C

9 V 8 V7 V

8 6

5 4 3 2 1 IC, COLLECTOR CURRENT (A)

7 TJ = 150°C

9 V 8 V 7 V

8 6

5 4 3 2 1 0

IC, COLLECTOR CURRENT (A)

7 TJ = −55°C

9 V

8 V TJ = 25°C

TJ = 150°C

200

VGE = 20 V to 15 V

VGE = 20 V to 13 V

1 2 3 4 6 7 8 9

−75 −50 −25 2.50

2.00

1.50

1.00

0.50 0

IC = 75 A IC = 50 A IC = 25 A

Figure 6. Typical Capacitance VCE, COLLECTOR−EMITTER VOLTAGE (V)

90 80 50

40 30 20 10 0 100,000

C, CAPACITANCE (pF)

100 Cies

Coes Cres

70 60 10 V

11 V

10 V 11 V

7 V

10 V 11 V

11 12 13

TJ = 25°C 120

120 100 80 60 40 20 0

10,000 1000

100

10 1 100

80 60 40 20

0 0

200 180 160 140

120 100 80 60 40 20 0 200 180 160 140

120 100 80 60 40 20 0 200 180 160 140

140 160

13 V

(4)

TYPICAL CHARACTERISTICS

Eon Figure 7. Diode Forward Characteristics

VF, FORWARD VOLTAGE (V) 3.0 2.5 2.0 1.5 1.0 0.5 0 70

IF, FORWARD CURRENT (A)

TJ = 25°C TJ = 150°C

60 50 40 30 20 10 0

Figure 8. Typical Gate Charge QG, GATE CHARGE (nC)

150 100 50 00

2 4 6 8 12 14 16

VGE, GATE−EMITTER VOLTAGE (V)

200 10

VCE = 400 V

VCE = 400 V VGE = 15 V

IC = 75 A

Figure 9. Switching Loss vs. Temperature TJ, JUNCTION TEMPERATURE (°C)

140 120 100 80 60 40 20 0

SWITCHING LOSS (mJ)

160 VCE = 400 V VGE = 15 V IC = 75 A Rg = 10 W Eoff

Figure 10. Switching Time vs. Temperature TJ, JUNCTION TEMPERATURE (°C)

140 120 100 80 60 40 20 0 100 1000

SWITCHING TIME (ns)

160 VCE = 400 V VGE = 15 V IC = 75 A Rg = 10 W tr

td(on)

Figure 11. Switching Loss vs. IC IC, COLLECTOR CURRENT (A)

45 35 25 15 6

SWITCHING LOSS (mJ)

VCE = 400 V VGE = 15 V TJ = 150°C Rg = 10 W

Eoff

Figure 12. Switching Time vs. IC IC, COLLECTOR CURRENT (A) 100

1000

SWITCHING TIME (ns) VCE = 400 V

VGE = 15 V TJ = 150°C Rg = 10 W

3.5 4.0 250

Eon

tf td(off)

10

tr td(on)

tf

td(off)

55 65 75 85 1015 25 35 45 55 65 75 85

3.0

300 350

2.5 2.0 1.5 1.0 0.5 0

95 105 5

4 3 2 1

0 95 105

(5)

Eon

Eoff

Eoff

Figure 13. Switching Loss vs. Rg Rg, GATE RESISTOR (W)

45 35 25 15 5

SWITCHING LOSS (mJ)

VCE = 400 V VGE = 15 V TJ = 150°C IC = 75 A

55 65 75 85

Figure 14. Switching Time vs. Rg Rg, GATE RESISTOR (W)

45 35 25 15 5

SWITCHING TIME (ns)

10,000

55 65 75 85

1000

Figure 15. Switching Loss vs. VCE VCE, COLLECTOR−EMITTER VOLTAGE (V)

550 500 450 400 350

SWITCHING LOSS (mJ)

650 600 VGE = 15 V TJ = 150°C IC = 75 A Rg = 10 W

Figure 16. Switching Time vs. VCE VCE, COLLECTOR−EMITTER VOLTAGE (V)

SWITCHING TIME (ns)

1000

100

Figure 17. Safe Operating Area VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)

1000 100

10 0.11

1 10 100 1000

50 ms 100 ms

1 ms dc operation

Single Nonrepetitive Pulse TC = 25°C Curves must be derated linearly with increase in temperature

Figure 18. Reverse Bias Safe Operating Area VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)

1 10 100 1000

VGE = 15 V, TC = 150°C

1000 100

10 1

Eon

tr

td(on)

tf td(off) VCE = 400 V

VGE = 15 V TJ = 150°C IC = 75 A

100

10

VGE = 15 V TJ = 150°C IC = 75 A Rg = 10 W

tr td(on)

tf td(off)

10 14

12 10 8 6 4 2 0

6

5 4 3 2 1

0150 200 250 300 150200 250 300 350 400 450 500 550 600650

(6)

TYPICAL CHARACTERISTICS

Figure 19. trr vs. diF/dt (VR = 400 V) diF/dt, DIODE CURRENT SLOPE (A/m)

700 500

300 100 trr, REVERSE RECOVERY TIME (ns)

150

TJ = 25°C, IF = 75 A

900 1100 1300

Figure 20. Qrr vs. diF/dt (VR = 400 V) diF/dt, DIODE CURRENT SLOPE (A/m)

700 500

300

Q, REVERSE RECOVERY CHARGE (mrr 100

C) 3.0

900 1100 1300 2.0

Figure 21. Irm vs. diF/dt (VR = 400 V) diF/dt, DIODE CURRENT SLOPE (A/m)

500 300

I, REVERSE RECOVERY CURRENT (A)rm 100

50

900 1100 1300

700

Figure 22. VF vs. TJ TJ, JUNCTION TEMPERATURE (°C)

25 0

−25

−50

−75 75 100 125 150 200

VF, FORWARD VOLTAGE (V)

3.5

2.5 0.5 0

1.0 130

110

90

70 50

40

30

20

10 0

TJ = 175°C, IF = 75 A

TJ = 25°C, IF = 75 A TJ = 175°C, IF = 75 A

1.0 2.5

TJ = 25°C, IF = 75 A TJ = 175°C, IF = 75 A

50 175

1.5 2.0 3.0

IF = 50 A

IF = 25 A IF = 75 A 1.5

(7)

Figure 23. IGBT Transient Thermal Impedance ON−PULSE WIDTH (s)

1 0.1

0.01 0.0001

1

SQUARE−WAVE PEAK R(t) (°C/W)

0.00001 50% Duty Cycle 20%

10%

5%

2%

Single Pulse

RqJC = 0.282

Junction

C1 C2 R1 R2

Duty Factor = t1/t2

Peak TJ = PDM x ZqJC + TC

Case

Cn Rn 0.1

0.01

0.001

0.0001

0.001

Ri (°C/W) Ci (J/°C) 0.0270 0.0037 0.0243 0.0225 0.0554 0.1121 0.0409

0.0130 0.0445 0.0571 0.0892 0.7725

0.000001

Figure 24. Diode Transient Thermal Impedance ON−PULSE WIDTH (s)

SQUARE−WAVE PEAK R(t) (°C/W) 50% Duty Cycle

20%

10%

5%

2%

Single Pulse 1

RqJC = 0.622

Junction Case

C1 C2

R1 R2 Rn

Duty Factor = t1/t2 Peak TJ = PDM x ZqJC + TC

Cn

1 0.1

0.01 0.0001

0.000001 0.00001 0.001

Ri (°C/W) Ci (J/°C) 0.000156 0.006394

0.1

0.01

0.001

0.007900 0.008527 0.025491 0.022800 0.121738 0.363338

0.001266 0.003708 0.003923 0.013870 0.008214 0.275226

(8)

Figure 25. Test Circuit for Switching Characteristics

(9)

Figure 26. Definition of Turn On Waveform

(10)

Figure 27. Definition of Turn Off Waveform

(11)

CASE 340AM ISSUE C

DATE 07 SEP 2021

XXXX = Specific Device Code A = Assembly Location Y = Year

WW = Work Week G = Pb−Free Package

*This information is generic. Please refer to device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.

GENERIC MARKING DIAGRAMS*

XXXXXXXXX XXXXXXXXX

AYWWG XXXXXXXXX

AYWWG

98AON77284F DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1 TO−247

(12)

information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

参照

関連したドキュメント

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,

Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees,