Linear Regulator - Wide Input Voltage Range,
Ultra-Low Iq, High PSRR, Adjustable Output Voltage
10mA
The NCP786A is high−performance linear regulator, offering a very wide operating input voltage range of up to 450 V DC, with an output current of up to 10 mA. Ideal for high input voltage applications such as industrial and home metering, home appliances. The NCP786A family offers ± 3% initial accuracy, extremely high−power supply rejection ratio and ultra−low quiescent current. The NCP786A family is optimized for high−voltage line and load transients, making them ideal for harsh environment applications. The output voltage can be set by resistor divider in range from 1.27 V up to 15 V. DFN6 5x6 Pb−free package with high allowable power dissipation keep small footprint at space sensitive applications.
Features
• Wide Input Voltage Range:
DC: Up to 450 V
AC: 85 V to 260 V (half−wave rectifier and 4.7 mF capacitor)
• 10 mA Guaranteed Output Current
• Ultra Low Quiescent Current: Typ. 10 m A (V
OUT≤ 15 V)
• ± 5% Accuracy Over Full Load, Line and Temperature Variations
• Ultra−high PSRR: 70 dB at 60 Hz, 90 dB at 100 kHz
• Stable with Ceramic Output Capacitor 2.2 mF MLCC
• Thermal Shutdown and Current Limit Protection
• Available in DFN6 5x6 Package
• This is a Pb−Free Device
Typical Applications• Industrial Applications, Home Appliances
• Home Metering / Network Application
• Off−line Power Supplies
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See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.
ORDERING INFORMATION MARKING DIAGRAM
DFN6 5x6 ST SUFFIX CASE 506DV
(Note: Microdot may be in either location) (Top View)
786A XXX ALLYYWWG
G 786A = Specific Device Marking XXX = Voltage Version
(see page 7) A = Assembly Location LL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package
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Figure 1. Typical Applications VOUT
GND
1
ADJ GND NC VIN
GND NCP786
DFN6 5x6 EP Vin = (55 – 450) V
2
3
4 EP
6
NC 5 VOUT = (1.275 – 15.0) V / 10mA VIN
CIN
VOUT
COUT R1
R2
2.2 mF 4.7 mF
Figure 2. Simplified Internal Block Diagram
ADJ
+−
+− VREF
1.27V
VIN
VOUT
GND
Thermal Shutdown
Current Limit
Table 1. PIN FUNCTION DESCRIPTION
Pin No. Pin Name Description
1 VIN Supply Voltage Input. Connect 4.7 mF capacitor from VIN to GND.
2 NC Not connected.
3 NC Not connected.
4 GND Ground connection.
5 VOUT Regulator Output. Connect 2.2 mF or higher MLCC capacitor from VOUT to GND.
6 ADJ ADJ pin for output voltage setting via resistors divider.
EP EP EP should be connected to GND potential.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) VIN −0.3 to 700 V
Output Voltage VOUT −0.3 to 18 V
Maximum Junction Temperature TJ(MAX) 125 °C
Table 2. ABSOLUTE MAXIMUM RATINGS
Storage Temperature TSTG −55 to 150 °C
ESD Capability, Human Body Model (All pins except HV pin no.1) (Note 2) ESDHBM 2000 V
ESD Capability, Machine Model (Note 2) ESDMM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. Peak 650 V max 1 ms non repeated for 1 s
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) Latch−up Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal Characteristics, DFN6
Thermal Resistance, Junction−to−Air JEDEC 51.3, One side, 600 sq mm PCB
RqJA 82 °C/W
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Table 4. ELECTRICAL CHARACTERISTICS NCP786A Adj. (−40°C ≤ TJ ≤ 85°C; VIN = 340 V; IOUT = 100 mA, CIN = 4.7 mF, COUT = 10 mF, unless otherwise noted. Typical values are at TJ = +25°C.) (Note 3)
Parameter Test Conditions Symbol Min Typ Max Unit
Operating Input Voltage DC VIN 55 450 V
Maximum output voltage −40°C ≤ TJ≤ 85°C, Iout = 100 mA,
55 V ≤ Vin ≤ 450 V Voutmax 15 V
Reference Voltage Accuracy TJ = 25°C, Iout = 100 mA, 55 V ≤ Vin ≤ 450 V VREF −3% 1.275 +3% V −40°C ≤ TJ ≤ 85°C, Iout = 100 mA,
55 V ≤ Vin ≤ 450 V VREF −5% 1.275 +5% V
Line Regulation VIN = 55 V to 450 V, Iout = 100 mA RegLINE −0.5 0.1 +0.5 %
Load Regulation IOUT = 100 mA to 10 mA, Vin = 55 V RegLOAD −1.0 0.7 +1.0 %
Maximum Output Current 55 V ≤ Vin ≤ 450 V, (Note 4) IOUT 11 mA
Quiescent Current IOUT = 0, 55 V ≤ Vin ≤ 450 V IGND 10 15 mA
Ground current 55 V ≤ Vin ≤ 450 V, (Note 4)
0 < IOUT≤ 10 mA 25 mA
ADJ Pin current 150 nA
Power Supply Rejection Ratio Vin = 340 VDC +1 Vpp modulation,
Iout = 100 mA f = 1 kHz PSRR 65 dB
Noise f = 10 kHz to 1 MHz Vin = 340 VDC, Iout = 1 mA,
COUT = 10 mF VNOISE 150 mVrms
Thermal Shutdown Temperature
(Note 5) Temperature increasing from TJ = +25°C TSD 145 °C
Thermal Shutdown Hysteresis
(Note 5) Temperature falling from TSD TSDH − 10 − °C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at TJ = TA = 25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
4. Respect to Safe Operating Area 5. Guaranteed by design
TYPICAL CHARACTERISTICS
Figure 3. Output Voltage vs. Input Voltage Figure 4. Output Voltage vs. Temperature
INPUT VOLTAGE (V) TEMPERATURE (°C)
400 350 300 250 200 150 100 1.27250
1.273 1.274 1.275 1.276 1.277 1.278 1.279
80 60
40 20 0
−20 1.272−40
1.273 1.274 1.275 1.276 1.277 1.278 1.279
Figure 5. Quiescent Current vs. Input Voltage Figure 6. Output Voltage vs. Output Current
INPUT VOLTAGE (V) OUTPUT CURRENT (mA)
400 350 300 250 200 150 100 350 4 5 6 7 8 9 10
7 6 5 4 3 2 1 1.2660 1.268 1.270 1.272 1.274 1.276 1.278
Figure 7. Noise Density vs. Frequency FREQUENCY (kHz)
1000 100
10 1
0.1 00.01
5 10 15 20 25
OUTPUT VOLTAGE (V) OUTPUT VOLTAGE (V)
QUIESCENT CURRENT (mA) OUTPUT VOLTAGE (V)
NOISE DENSITY (mV√Hz)
450 TA = 85°C
TA = 25°C
TA = 0°C
TA = −40°C NCP786A Adj. VOUT(nom) = 1.275 V
CIN = 4.7 mF, COUT = 10 mF IOUT = 100 mA
450
VIN = 55 V VIN = 150 V VIN = 250 V VIN = 350 V VIN = 450 V
10 9 8 VIN = 55 V
VIN = 75 V VIN = 100 V VIN = 150 V VIN = 200 V VIN = 250 V VIN = 300 V VIN = 350 V
NCP786A Adj. TA = 25°C CIN = 4.7 mF, COUT = 10 mF VOUT(nom) = 1.275 V
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APPLICATION INFORMATION
Figure 8. Typical Application Schematics
NCP786A
C
inC
outR
1R
2Vout = 1.275 V – 15 V / 10 mA IN
GND OUT
ADJ Vin = (55 – 450) Vdc
C
inC
outR
1R
2Vout = 1.275 V – 15 V / 10 mA Vin = (85 – 265) Vac
C
inC
outR
1R
2Vout = 1.275 V – 15 V / 10 mA Vin = (85 – 265) Vac
NC NC
EP
NCP786A
GND NC
EP
IN OUT
NC ADJ
NCP786A
GND NC
EP OUT IN
ADJ NC
Input Decoupling (C1)
A 4.7 mF capacitor either ceramic or electrolytic is recommended and should be connected close to the input pin of NCP786A. Higher value 4.7 mF is necessary to keep the input voltage above the required minimum input voltage at full load for AC voltage as low as 85 V with half wave rectifier. The capacitor 2.2 mF or 1 mF could be acceptable for DC input voltage or AC input voltage 235 V ±20%.
There must be assured minimum Input Voltage more than 55 V at input pin of NCP786A regulator in order to keep stable desired output voltage with guaranteed parameters.
Output Decoupling (C2)
The NCP786A Regulator does not require any specific Equivalent Series Resistance (ESR). Thus capacitors exhibiting ESRs ranging from a few m W up to 0.5 W can be used safely. The minimum decoupling value is 2.2 m F. The regulator accepts ceramic chip capacitors as well as tantalum devices or low ESR electrolytic capacitors. Larger values improve noise rejection and especially load transient response.
Layout Recommendations
Please be sure that the V
INand GND lines are sufficiently wide. When the impedance of these lines is high, there is a chance to pick up noise or to cause the malfunction of regulator.
Set external components, especially the output capacitor, as close as possible to the circuit, and make leads as short as possible.
Thermal
As power across the NCP786A increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design layout and used package. Mounting pad
configuration on the PCB, the board material, and also the
ambient temperature affect the rate of temperature rise for
the part. This is stating that when the NCP786A has good
thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation applications.
Output Voltage
The output voltage can be set by using a resistor divider as shown in Figure 1 in range from 1.275 V up to 15 V. The appropriate resistor divider can be found by solving the equation below.
VOUT+1.275
ǒ
1)R1R2Ǔ
)ǒ
IADJ R1Ǔ
(eq. 1)The recommended current through the resistor divider is from 1 mA to 3 mA in order to keep negligible ADJ pin consumption. In this case we can simplify Equation 1 to:
VOUT+1.275
ǒ
1)R1R2
Ǔ
(eq. 2)ORDERING INFORMATION
Part Number Output Voltage Marking Package Shipping†
NCP786AMNADJTBG Adjustable ADJ DFN6 5x6
(Pb−Free) 1000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
DFN6 5x6, 1.27P CASE 506DV
ISSUE O
DATE 12 OCT 2016 SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20 AND 0.25 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
5. FOR DEVICE OPN CONTAINING W OPTION, DETAIL B ALTERNATE B−1 AND DETAIL A ALTERNATE A−1 CONSTRUCTIONS ARE NOT APPLICABLE.
TOP VIEW
SIDE VIEW D
E A B
PIN ONE
DIM MINMILLIMETERSNOM A 0.80 0.90 A1 −−− −−−
b 0.30 0.40
D 5.00
D2 4.10 4.20
E 6.00
E2 1.75 1.85
e 1.27 BSC
K 0.25 −−−
L 0.45 0.55
0.08 C
0.10 C DETAIL A
MAX 1.00 0.05 0.50 4.30 1.95
−−−
0.65
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
4.90 5.10
5.90 6.10
RECOMMENDED
A = Assembly Location LL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”, may or may not be present.
GENERIC MARKING DIAGRAM*
XXXXXXXX XXXXXXXX ALLYYWWG
G
(Note: Microdot may be in either location) DETAIL A
L
ALTERNATE TERMINAL CONSTRUCTIONS
L
ÉÉÉ
ÉÉÉ ÇÇÇ
DETAIL B
MOLD CMPD EXPOSED Cu
ALTERNATE CONSTRUCTIONS
ÉÉÉ
ÉÉÉ ÇÇÇ
A1
A3
ALTERNATE B−1 ALTERNATE B−2 ALTERNATE A−1 ALTERNATE A−2
A3 0.20 REF
e2 3.81 BSC
ÉÉ
ÉÉ
REFERENCE
SEATING PLANE
A3 A
A1 C
0.20 6.30
3.81 0.60
1.95
6X
PITCH
DIMENSIONS: MILLIMETERS
1
5.30 4.41
1.27 PITCH
0.756X
2
6 3
PACKAGE OUTLINE
BOTTOM VIEW
1 e2 2
10X
D2 K
E2 b
A 0.10 C B 0.05 C
L
DETAIL A NOTE 3
e
6X
3 6
NOTE 4
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.
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