Medium-Power Plastic PNP Silicon Transistors
These medium−power, high−performance plastic devices are designed for driver circuits, switching, and amplifier applications.
Features
• Low Saturation Voltage − V CE(sat) = 0.6 Vdc (Max) @ I C = 1.0 A
• Excellent Power Dissipation, P D = 30 W @ T C = 25 _ C
• Excellent Safe Operating Area
• Gain Specified to I C = 1.0 A
• Complement to NPN 2N4921, 2N4922, 2N4923
• Pb−Free Package is Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage
2N4918 2N4919 2N4920
V
CEO40 60 80
Vdc
Collector − Base Voltage
2N4918 2N4919 2N4920
V
CBO40 60 80
Vdc
Emitter − Base Voltage V
EBO5.0 Vdc
Collector Current − Continuous
(Note 1) I
C(Note 2) 1.0
3.0 Adc
Base Current I
B1.0 Adc
Total Power Dissipation @ T
A= 25°C
Derate above 25°C P
D30
0.24 W
W/°C Operating and Storage Junction
Temperature Range T
J, T
stg−65 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. The 1.0 A max I
Cvalue is based upon JEDEC current gain requirements. The 3.0 A max value is based upon actual current−handling capability of the device (See Figure 5).
2. Indicates JEDEC Registered Data for 2N4918 Series.
THERMAL CHARACTERISTICS (Note 3)
Characteristic Symbol Max Unit
Thermal Resistance,
Junction−to−Case
qJC4.16 °C/W
3. Recommend use of thermal compound for lowest thermal resistance.
3.0 A, 40−80 V, 30 W GENERAL PURPOSE POWER TRANSISTORS
TO−225 CASE 077
STYLE 1 http://onsemi.com
xx = 18, 19, 20
Y = Year
WW = Work Week MARKING DIAGRAM
See detailed ordering and shipping information on page 2 of this data sheet.
ORDERING INFORMATION YWW
2N 49xx
FRONT VIEW BACK VIEW
1 2 3 3 2 1
4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (T
C= 25_C unless otherwise noted)
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Characteristic
ÎÎÎÎÎÎÎÎÎÎ
Symbol
ÎÎÎÎÎÎ
Min
ÎÎÎÎÎÎÎÎ
Max
ÎÎÎÎÎÎ
Unit
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
OFF CHARACTERISTICS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector−Emitter Sustaining Voltage (Note 4)
(I
C= 0.1 Adc, I
B= 0) 2N4918
2N4919 2N4920
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
V
CEO(sus) ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
40 60 80
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
−
−
−
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector Cutoff Current
(V
CE= 20 Vdc, I
B= 0) 2N4918
(V
CE= 30 Vdc, I
B= 0) 2N4919
(V
CE= 40 Vdc, I
B= 0) 2N4920
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
I
CEOÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
−
−
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
0.5 0.5 0.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
mAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector Cutoff Current
(V
CE= Rated V
CEO, V
BE(off)= 1.5 Vdc)
(V
CE= Rated V
CEO, V
BE(off)= 1.5 Vdc, T
C= 125_C
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
I
CEXÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
−
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
0.1 0.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
mAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector Cutoff Current (V
CB= Rated V
CB, I
E= 0)
ÎÎÎÎÎ
ÎÎÎÎÎ
I
CBO ÎÎÎÎÎÎ
−
ÎÎÎÎÎÎÎÎ
0.1
ÎÎÎÎÎÎ
mAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Emitter Cutoff Current (V
BE= 5.0 Vdc, I
C= 0)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
I
EBOÎÎÎ
ÎÎÎ
ÎÎÎ
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
1.0
ÎÎÎ
ÎÎÎ
ÎÎÎ
mAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ON CHARACTERISTICS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Current Gain (Note 4) (I
C= 50 mAdc, V
CE= 1.0 Vdc) (I
C= 500 mAdc, V
CE= 1.0 Vdc) (I
C= 1.0 Adc, V
CE= 1.0 Vdc)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
h
FE ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
40 30 10
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
− 150
−
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
−
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector−Emitter Saturation Voltage (Note 4) (I
C= 1.0 Adc, I
B= 0.1 Adc)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
V
CE(sat) ÎÎÎÎÎÎ
ÎÎÎ
−
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
0.6
ÎÎÎÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Base−Emitter Saturation Voltage (Note 4) (I
C= 1.0 Adc, I
B= 0.1 Adc)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
V
BE(sat) ÎÎÎÎÎÎ
ÎÎÎ
−
ÎÎÎÎÎÎÎÎ
ÎÎÎÎ
1.3
ÎÎÎÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Base−Emitter On Voltage (Note 4)
(I
C= 1.0 Adc, V
CE= 1.0 Vdc)
ÎÎÎÎÎÎÎÎÎÎ
V
BE(on)ÎÎÎ
ÎÎÎ
−
ÎÎÎÎ
ÎÎÎÎ
1.3
ÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SMALL−SIGNAL CHARACTERISTICS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Current−Gain − Bandwidth Product (I
C= 250 mAdc, V
CE= 10 Vdc, f = 1.0 MHz)
ÎÎÎÎÎÎÎÎÎÎ
f
T ÎÎÎÎÎÎ
3.0
ÎÎÎÎÎÎÎÎ
−
ÎÎÎÎÎÎ
MHz
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Output Capacitance (V
CB= 10 Vdc, I
E= 0, f = 100 kHz)
ÎÎÎÎÎÎÎÎÎÎ
C
ob ÎÎÎÎÎÎ
−
ÎÎÎÎÎÎÎÎ
100
ÎÎÎÎÎÎ
pF
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Small−Signal Current Gain (I
C= 250 mAdc, V
CE= 10 Vdc, f = 1.0 kHz)
ÎÎÎÎÎÎÎÎÎÎ
h
fe ÎÎÎÎÎÎ
25
ÎÎÎÎÎÎÎÎ
−
ÎÎÎÎÎÎ
− 4. Pulse Test: PW [ 300 ms, Duty Cycle [ 2.0%
ORDERING INFORMATION
Device Package Shipping
†2N4918 TO−225 500 Unit / Bulk
2N4919 TO−225 500 Unit / Bulk
2N4920 TO−225 500 Unit / Bulk
2N4920G TO−225
(Pb−Free) 500 Unit / Bulk
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifi-
cations Brochure, BRD8011/D.
40
30
20
10
0 25 50 75 100 125 150
Figure 1. Power Derating T
C, CASE TEMPERATURE ( ° C)
P D , POWER DISSIP A TION (W A TTS)
Figure 2. Switching Time Equivalent Test Circuit
5.0
10
Figure 3. Turn−On Time I
C, COLLECTOR CURRENT (mA)
V
CC= 30 V I
C/I
B= 20
t, TIME (s) μ
2.0 1.0 0.7 0.5 0.3 0.2 0.1
0.05 20 30 50 70 100 200 700 1000
V
int
1V
BE(off)APPROX 9.0 V
TURN-OFF PULSE t
3t
2APPROX
-11 V
V
CCSCOPE R
BC
jd<<C
eb+4.0 V
t
1< 15 ns 100 < t
2< 500 m s t
3< 15 ns
DUTY CYCLE ≈ 2.0%
V
inR
C0.07
3.0 T
J= 25 ° C
T
J= 150 ° C I
C/I
B= 10, UNLESS NOTED
V
CC= 60 V V
CC= 30 V
V
CC= 30 V V
BE(off)= 0
300 500 0
0 V
inAPPROX -11 V
RB and RC varied to obtain desired current levels
t
rV
BE(off)= 2.0 V V
CC= 60 V
t
dFigure 4. Thermal Response t, TIME (ms)
1.0
0.01 0.01 0.7 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02
0.02 0.03
r(t) , TRANSIENT THERMAL RESIST ANCE (NORMALIZED)
0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50 100 200 300 500 1000
q
JC(t) = r(t) q
JCq
JC= 4.16 ° C/W MAX
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t
1T
J(pk)- T
C= P
(pk)q
JC(t)
P
(pk)t
1t
2DUTY CYCLE, D = t
1/t
2D = 0.5
0.2 0.05 0.01 SINGLE PULSE 0.1
10
1.0
Figure 5. Active−Region Safe Operating Area V
CE, COLLECTOR-EMITTER VOLTAGE (VOLTS) 5.0
2.0 1.0
0.5
0.1 2.0 3.0 5.0 10 20 30 50 70 100
I C 0.2
, COLLECT OR CURRENT (AMP)
T
J= 150 ° C
dc
5.0 ms 100 m s
7.0 PULSE CURVES APPLY BELOW
RATED V
CEO1.0 ms
SECOND BREAKDOWN LIMITED BONDING WIRE LIMITED THERMALLY LIMIT @ T
C= 25 ° C
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I C − V CE operation i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
The data of Figure 5 is based on T J(pk) = 150 _ C; T C is variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T J(pk) v 150 _ C. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown.
t μ s , ST ORAGE TIME (s) ′ t μ f, F ALL TIME (s)
5.0
10
Figure 6. Storage Time I
C, COLLECTOR CURRENT (mA) 2.0
1.0 0.5 0.3 0.2 0.1 0.05
20 30 50 70 500 700 1000
t
s′ = t
s- 1/8 t
f0.07
100 3.0
0.7
200 300 T
J= 25 ° C T
J= 150 ° C I
C/I
B= 20
5.0
10
Figure 7. Fall Time I
C, COLLECTOR CURRENT (mA) 2.0
1.0 0.5 0.3 0.2 0.1 0.05
20 30 50 70 500 700 1000
0.07
100 3.0
0.7
200 300 T
J= 25 ° C T
J= 150 ° C
I
C/I
B= 10
I
C/I
B= 20
I
C/I
B= 10
I
B1= I
B2V
CC= 30 V
I
B1= I
B2TYPICAL DC CHARACTERISTICS
R BE , EXTERNAL BASE-EMITTER RESIST ANCE (OHMS) V CE , COLLECT OR-EMITTER VOL TAGE (VOL TS) 1000
2.0
Figure 8. Current Gain I
C, COLLECTOR CURRENT (mA)
10 3.0 5.0 10 20 30 200 300 500 2000
500
200 100 70
Figure 9. Collector Saturation Region 1.0
0.2
I
B, BASE CURRENT (mA)
0 0.3 0.5 1.0 2.0 5.0 10 20 50 200
0.8
0.6
0.4
0.2
I
C= 0.1 A
T
J= 25 ° C
0.25 A 0.5 A 1.0 A 700
300
h FE , DC CURRENT GAIN
T
J= 150 ° C
25 ° C -55 ° C
V
CE= 1.0 V
50 30 20
50 100 1000 3.0 30 100
10
80
Figure 10. Effects of Base−Emitter Resistance T
J, JUNCTION TEMPERATURE ( ° C)
30 60 90 120 150
10
710
510
410
3V
CE= 30 V I
C= 10 I
CESI
C= 2x I
CESI
C≈ I
CESI
CESVALUES OBTAINED FROM FIGURE 13 10
61.5
2.0
I
C, COLLECTOR CURRENT (mA)
5.0 10 20 30 50 100 200 300 2000
1.2
0.9
0.6
0.3
0
T
J= 25 ° C
V
BE(sat)@ I
C/I
B= 10
V
CE(sat)@ I
C/I
B= 10
VOL TAGE (VOL TS)
Figure 11. “On” Voltage
3.0 500 1000
V
BE@ V
CE= 2.0 V
10
210
110
010
-1, COLLECT OR CURRENT (A) μ
I C 10
-2V
CE= 30 V T
J= 150 ° C
100 ° C
25 ° C I
C= I
CES10
4+2.5
T
J= -55 ° C to +100 ° C
TURE COEFFICIENTS (mV/ C) ° +2.0
+1.5
+0.5 0 -0.5 -1.0
-1.5 q
VBFOR V
BE* q
VCFOR V
CE(sat)T
J= 100 ° C to 150 ° C
*APPLIES FOR I
C/I
B< hFE@VCE + 1.0V
2
+1.0
TO−225 CASE 77−09
ISSUE AD
DATE 25 MAR 2015
STYLE 1:
PIN 1. EMITTER 2., 4. COLLECTOR
3. BASE
STYLE 6:
PIN 1. CATHODE 2., 4. GATE
3. ANODE
STYLE 2:
PIN 1. CATHODE 2., 4. ANODE
3. GATE
STYLE 3:
PIN 1. BASE 2., 4. COLLECTOR
3. EMITTER
STYLE 4:
PIN 1. ANODE 1 2., 4. ANODE 2 3. GATE
STYLE 5:
PIN 1. MT 1 2., 4. MT 2 3. GATE
STYLE 7:
PIN 1. MT 1 2., 4. GATE
3. MT 2
STYLE 8:
PIN 1. SOURCE 2., 4. GATE
3. DRAIN
STYLE 9:
PIN 1. GATE 2., 4. DRAIN
3. SOURCE
STYLE 10:
PIN 1. SOURCE 2., 4. DRAIN
3. GATE
YWW XX XXXXXG
Y = Year
WW = Work Week XXXXX = Device Code G = Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”, may or may not be present.
GENERIC MARKING DIAGRAM*
SCALE 1:1
DIM MIN MAX MILLIMETERS
D 10.60 11.10 E 7.40 7.80 A 2.40 3.00 b 0.60 0.90
P 2.90 3.30 L1 1.27 2.54 c 0.39 0.63
L 14.50 16.63 b2 0.51 0.88
Q 3.80 4.20 A1 1.00 1.50
e 2.04 2.54
E
1 2 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. NUMBER AND SHAPE OF LUGS OPTIONAL.
2X 2X
Q
D
L1 P
b2
b
e c
L A1
A FRONT VIEW BACK VIEW
FRONT VIEW SIDE VIEW
1 2 3 3 2 1
4
PIN 4 BACKSIDE TAB
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
98ASB42049B DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
TO−225
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems