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Field Stop Trench IGBT With Soft Fast Recovery Diode

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Soft Fast Recovery Diode

650 V, 120 A

FGY120T65SPD-F085

Features

• Very Low Saturation Voltage : V CE(sat) = 1.5 V(Typ.) @ I C = 120 A

• Maximum Junction Temperature : T J = 175 ° C

• Positive Temperature Co−efficient

• Tight Parameter Distribution

• High Input Impedance

• 100% of the Parts are Dynamically Tested

• Short Circuit Ruggedness > 6 m s @ 25 ° C

• Copacked with Soft, Fast Recovery Extremefast Diode

• AEC−Q101 Qualified and PPAP Capable

• This is a Pb−Free Device Benefits

• Very Low Conduction and Switching Losses for a High Efficiency Operation in Various Applications

• Rugged Transient Reliability

• Outstanding Parallel Operation Performance with Balance Current Sharing

Low EMI

Applications

• Traction Inverter for HEV/EV

• Auxiliary DC/AC Converter

• Motor Drives

• Other Power−train Applications Requiring High Power Switch

www.onsemi.com

See detailed ordering and shipping information on page 2 of this data sheet.

ORDERING INFORMATION MARKING DIAGRAM

TO−247−3LD CASE 340CU G C E

$Y&Z&3&K FGY120T 65SPD

$Y = ON Semiconductor Logo

&Z = Assembly Plant Code

&3 = Data Code (Year & Week)

&K = Lot

FGY120T65SPD= Specific Device Code C

E

G

(2)

www.onsemi.com 2

ABSOLUTE MAXIMUM RATINGS

Symbol Description Ratings Units

V

CES

Collector to Emitter Voltage 650 V

VG

ES

Gate to Emitter Voltage ± 20 V

Transient Gate to Emitter Voltage ±30 V

I

C

Collector Current (Note 1) @ T

C

= 25°C 240 A

Collector Current @ T

C

= 100 ° C 220 A

I

Nominal

Nominal Current 120 A

I

CM

Pulsed Collector Current 378 A

I

F

Diode Forward Current (Note 1) @ T

C

= 25°C 240 A

Diode Forward Current @ T

C

= 100 ° C 188 A

P

D

Maximum Power Dissipation @ T

C

= 25°C 882 W

Maximum Power Dissipation @ T

C

= 100°C 441 W

SCWT Short Circuit Withstand Time @ T

C

= 25°C 6 ms

dV/dt Voltage Transient Ruggedness (Note 2) 10 V/ns

T

J

Operating Junction Temperature −55 to +175 ° C

T

stg

Storage Temperature Range −55 to +175 °C

T

L

Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 s 300 °C 1. Limited by bondwire

2. V

CC

= 400 V, V

GE

= 15 V, I

CE

= 378 A, Inductive Load

THERMAL CHARACTERISTICS

Symbol Parameter Typ. Max. Units

R

θJC

(IGBT) Thermal Resistance, Junction to Case − 0.17 °C/W

R

θJC

(Diode) Thermal Resistance, Junction to Case − 0.32 °C/W

R

θJA

Thermal Resistance, Junction to Ambient − 40 °C/W

PACKAGE MARKING AND ORDERING INFORMATION

Device Marking Device Package Pacing Type Qty per Tube

FGY120T65SPD FGY120T65SPD−F085 TP−247 Tube 30ea

(3)

ELECTRICAL CHARACTERISTICS OF THE IGBT T

J

= 25 °C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max. Units

OFF CHARACTERISTICS

BV

CES

Collector to Emitter Breakdown Voltage V

GE

= 0 V, I

C

= 1 mA 650 − − V DBV

CES

DT

J

Temperature Coefficient of Breakdown

Voltage V

GE

= 0 V, I

C

= 1 mA − 0.6 − V/°C

I

CES

Collector Cut−Off Current V

CE

= V

CES

, V

GE

= 0 V − − 40 μA

I

GES

G−E Leakage Current V

GE

= V

GES

, V

CE

= 0 V − − ± 250 nA

ON CHARACTERISTICS

V

GE(th)

G−E Threshold Voltage I

C

= 120 mA, V

CE

= V

GE

4.2 5.4 6.2 V

V

CE(sat)

Collector to Emitter Saturation Voltage I

C

= 120 A

,

V

GE

= 15 V − 1.5 1.85 V I

C

= 120 A

,

V

GE

= 15 V, T

J

= 175°C − 1.8 − V DYNAMIC CHARACTERISTICS

C

ies

Input Capacitance V

CE

= 30 V

,

V

GE

= 0 V,

f = 1 MHz − 6810 − pF

C

oes

Output Capacitance − 440 − pF

C

res

Reverse Transfer Capacitance − 50 − pF

R

G

Internal Gate Resistance f = 1 MHz − 3 − W

SWITCHING CHARACTERISTICS

T

d(on)

Turn−On Delay Time V

CC

= 400 V, I

C

= 120 A, R

G

= 5 W, V

GE

= 15 V,

Inductive Load, T

J

= 25°C

− 53 − ns

T

r

Rise Time − 134 − ns

T

d(off)

Turn−Off Delay Time − 102 − ns

T

f

Fall Time − 115 − ns

E

on

Turn−On Switching Loss − 6.8 − mJ

E

off

Turn−Off Switching Loss − 3.5 − mJ

E

ts

Total Switching Loss − 10.3 − mJ

T

d(on)

Turn−On Delay Time V

CC

= 400 V, I

C

= 120 A, R

G

= 5 W, V

GE

= 15 V,

Inductive Load, T

J

= 175°C

− 50 − ns

T

r

Rise Time − 133 − ns

T

d(off)

Turn−Off Delay Time − 109 − ns

T

f

Fall Time − 138 − ns

E

on

Turn−On Switching Loss − 9.8 − mJ

E

off

Turn−Off Switching Loss − 4.0 − mJ

E

ts

Total Switching Loss − 13.8 − mJ

Q

g

Total Gate Charge V

CE

= 400 V, I

C

= 120 A, V

GE

= 15 V − 162 243 nC

Q

ge

Gate to Emitter Charge − 49 − nC

Q

gc

Gate to Collector Charge − 47 − nC

(4)

www.onsemi.com 4

ELECTRICAL CHARACTERISTICS OF THE DIODE T

J

= 25°C unless otherwise noted

Symbol Parameter Test Conditions Min. Typ. Max Units

V

FM

Diode Forward Voltage I

F

= 120 A T

J

= 25 ° C − 1.3 1.6 V

T

J

= 175°C − 1.2 −

E

rec

Reverse Recovery Energy V

CE

= 400V, I

F

= 120 A,

dI

F

/dt = 1000 A/μs T

J

= 25°C − 450 − μJ

T

J

= 175°C − 3000 −

T

rr

Diode Reverse Recovery Time T

J

= 25°C − 123 − ns

T

J

= 175°C − 240 −

Q

rr

Diode Reverse Recovery Charge T

J

= 25°C − 2.8 − μC

T

J

= 175°C − 12.2 −

(5)

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 1. Typical Output Characteristics Figure 2. Typical Output Characteristics

Figure 3. Typical Saturation Voltage

Characteristics Figure 4. Transfer Characteristics

Figure 5. Saturation Voltage vs. Case

Temperature at Variant Current Level Figure 6. Saturation Voltage vs. V

GE

0 2 4 6 8

0 60 120 180 240 300 360

20V TC = 25oC

15V 12V10V VGE = 8V

C o lle ct or C u rre nt , I

C

[A]

Collector−Emitter Voltage, V

CE

[V] 0 0 2 4 6 8

60 120 180 240 300 360

20V TC = 175oC

12V15V VGE = 8V10V

C o lle ct or C u rre nt , I

C

[A]

Collector−Emitter Voltage, V

CE

[V]

0 1 2 3 4 5

0 60 120 180 240 300 360

Common Emitter VGE = 15V TC = 25oC TC = 175oC

C olle ct or C urre nt , I

C

[A]

Collector−Emitter Voltage, V

CE

[V]

0 3 6 9 12

0 40 80 120 160

Common Emitter VCE = 20V TC = 25oC TC = 175oC

C o lle ct or C u rre nt , I

C

[A]

Gate−Emitter Voltage,V

GE

[V]

25 50 75 100 125 150 175

1.0 1.5 2.0 2.5 3.0

IC = 240A

IC = 60A IC = 120A Common Emitter

VGE = 15V

Col lector

Emitter Voltage, V

CE

[V]

Collector−EmitterCase Temperature, T

C

[

o

C]

6 8 10 12 14

0 2 4 6 8 10

IC = 240A IC = 120A

IC = 60A

Common Emitter TC = −40oC

Col lector

Emitter Voltage

,

V

CE

[V]

Gate−Emitter Voltage, V

GE

[V]

(6)

www.onsemi.com 6

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Figure 7. Saturation Voltage vs. V

GE

Figure 8. Saturation Voltage vs. V

GE

Figure 9. Capacitance Characteristics Figure 10. Gate charge Characteristics

Figure 11. SOA Characteristics Figure 12. Turn off Switching SOA Characteristics

6 8 10 12 14

0 2 4 6 8 10

IC = 120A

IC = 240A

IC = 60A

Common Emitter TC = 25oC

Col lector

Emitter Voltage

,

V

CE

[V]

Gate−Emitter Voltage, V

GE

[V]

6 8 10 12 14

0 2 4 6 8 10

IC = 240A IC = 120A

IC = 60A

Common Emitter TC = 175oC

Col lector

Emitter Voltage

,

V

CE

[V]

Gate−Emitter Voltage, V

GE

[V]

0.1 1 10

10 100 1000 10000

Common Emitter VGE = 0V, f = 1MHz TC = 25oC

Cres Coes Cies

Capacitance [pF]

Collector−Emitter Voltage, V

CE

[V]

30 0 0 50 100 150 200

3 6 9 12 15

VCC = 390V VCC = 325V Common Emitter

TC = 25oC

VCC = 260V

Gate

Emitter Voltage, V

GE

[V]

Gate Charge, Q

g

[nC]

1 10 100 1000

0.01 0.1 1 10 100 1000

10 ms DC Single Nonrepetetitive

Pulse TC = 25oC Curves must be derated linearly with increase in temperature

10ms 100ms

C o lle ct or C u rre nt , I

c

[A]

Collector−Emitter Voltage, V

CE

[V]

1

10

100 1000

1 10 100 1000

C olle ct or C urre nt , I

C

[A]

Collector−Emitter Voltage, V

CE

[V]

1 ms

Safe Operating Area VGE = 15V, T <= 175C oC

10

(7)

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Figure 13. Turn−on Characteristics vs. Gate

Resistance Figure 14. Turn−off Characteristics vs. Gate Resistance

Figure 15. Turn−on Characteristics

vs. Collector Current Figure 16. Turn−off Characteristics vs. Collector Current

Figure 17. Switching Loss vs Gate Resistance Figure 18. Switching Loss vs Collector Current

0 10 20 30 40 50

10 100

Common Emitter VCC = 400V, VGE = 15V IC = 120A

TC = 25oC TC = 175oC td(on)

tr

Switching Time [ns]

Gate Resistance, R

G

[

W

] 200

0 10 20 30 40 50

10 100 1000

Common Emitter VCC = 400V, VGE = 15V IC = 120A

TC = 25oC TC = 175oC

td(off)

tf

Switching Time [ns]

Gate Resistance, R

G

[

W

]

0 40 80 120 160 200

1 10 100 1000

Common Emitter VGE = 15V, RG = 5W TC = 25oC TC = 175oC

tr

td(on)

Switching Time [ns]

Collector Current, I

C

[A]

0 40 80 120 160 200

10 100 1000

Common Emitter VGE = 15V, RG = 5W TC = 25oC TC = 175oC

td(off) tf

Switching Time [ns]

Collector Current, I

C

[A]

0 20 40 60 80 100 120

0.1 1 10 100

Common Emitter VGE = 15V, RG = 5W TC = 25oC

TC = 175oC Eon

Eoff

Swi tchi ng Loss [mJ]

Collector Current, I

C

[A]

0 10 20 30 40 50

1 10

Common Emitter VCC = 400V, VGE = 15V IC = 120A

TC = 25oC TC = 175oC Eon

Eoff

Switching Loss [mJ]

Gate Resistance, R

G

[

W

]

50

(8)

www.onsemi.com 8

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Figure 19. Forward Characteristics Figure 20. Reverse Current

Figure 21. Stored Charge Figure 22. Reverse Recovery Time

Figure 23. Collector to Emitter Breakdown Voltage vs. Junction Temperature

0.0 0.5 1.0 1.5 2.0 2.5

0.1 1 10 100

TC = 125oC TC = 25oC

360

TC = 175oC

Forward Voltage, V

F

[V]

Forward Current, I

F

[A]

200 400 600

0.01 0.1 1 10 100 1000 10000

650 50

TC = 125oC

TC = 25oC TC = 175oC

Reverse Voltage, V

R

[V]

Reverse Current, I

R

[

m

A]

0 20 40 60 80 100 120

0 50 100 150 200 250 300

di/dt = 1000A/ms di/dt = 500A/ms

di/dt = 500A/ms

TC = 25oC TC = 175oC di/dt = 1000A/ms

Reverse Recovery Ti me, t

rr

[ns]

Forward Current, I

F

[A]

0 20 40 60 80 100 120

100 1000 10000 20000

di/dt = 500A/ms di/dt = 1000A/ms

di/dt = 500A/ms

TC = 25oC TC = 175oC di/dt = 1000A/ms

Stored Recovery Charge, Q

rr

[nC]

Forward Current, I

F

[A]

−80 −40

0 40 80 120 160 200

600 650 700 750 800

IC = 1mA

COLLECTOR TO EMITTER BRE AKDOWN V O LTAGE , BV

CES

[V]

T

J

, JUNCTION TEMPERATURE (

o

C)

(9)

TYPICAL PERFORMANCE CHARACTERISTICS (continued)

Figure 24. Transient Thermal Impedance of IGBT

Figure 25. Transient Thermal Impedance of Diode

(10)

TO−247−3LD CASE 340CU

ISSUE B

DATE 28 OCT 2021

XXXX = Specific Device Code A = Assembly Site Code Y = Year

WW = Work Week ZZ = Assembly Lot Code

*This information is generic. Please refer to device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.

GENERIC MARKING DIAGRAM*

AYWWZZ XXXXXXXXX XXXXXXXXX

98AON13773G DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1 TO−247−3LD

onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.

© Semiconductor Components Industries, LLC, 2018

www.onsemi.com

(11)

information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of

onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of

onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of

onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of

onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of

onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of

onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of