SMPS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode

IGBT with Anti-Parallel Hyperfast Diode

600 V

HGTG20N60A4D

The HGTG20N60A4D is a MOS gated high voltage switching device combining the best features of MOSFETs and bipolar transistors. This device has the high input impedance of a MOSFET and the low on−state conduction loss of a bipolar transistor. The much lower on−state voltage drop varies only moderately between 25 ° C and 150 ° C. The IGBT used is the development type TA49339. The diode used in anti−parallel is the development type TA49372.

This IGBT is ideal for many high voltage switching applications operating at high frequencies where low conduction losses are essential. This device has been optimized for high frequency switch mode power supplies .

Formerly Developmental Type TA49341.

Features

• >100 kHz Operation 390 V, 20 A

• 200 kHz Operation 390 V, 12 A

• 600 V Switching SOA Capability

• Typical Fall Time 55 ns at T

= 125 ° C

• Low Conduction Loss

• Temperature Compensating Saber ™ Model

• This is a Pb−Free Device

EC G www.onsemi.com

MARKING DIAGRAM

See detailed ordering and shipping information on page 8 of this data sheet.

ORDERING INFORMATION G

E C

TO−247−3LD SHORT LEAD CASE 340CK JEDEC STYLE

COLLECTOR (FLANGE)

$Y = ON Semiconductor Logo

&Z = Assembly Plant Code

&3 = Numeric Date Code

&K = Lot Code

20N60A4D = Specific Device Code

$Y&Z&3&K 20N60A4D

ABSOLUTE MAXIMUM RATINGS (TC = 25°C unless otherwise specified)

Parameter Symbol HGTG20N60A4D Unit

Collector to Emitter Voltage BVCES 600 V

Collector Current Continuous At T_C = 25°C

At TC = 110°C

I_C25 IC110

7040 A

A

Collector Current Pulsed (Note 1) I_CM 280 A

Diode Continuous Forward Current IFM110 20 A

Diode Maximum Forward Current I_FM 80 A

Gate to Emitter Voltage Continuous V_GES ±20 V

Gate to Emitter Voltage Pulsed V_GEM ±30 V

Switching Safe Operating Area at T_J = 150°C, (Figure 2) SSOA 100 A at 600 V

Power Dissipation Total at TC = 25°C PD 290 W

Power Dissipation Derating T_C > 25°C 2.32 W/°C

Operating and Storage Junction Temperature Range TJ, TSTG −55 to 150 °C

Maximum Lead Temperature for Soldering T_L 260 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

1. Pulse width limited by maximum junction temperature.

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)

Parameter Symbol Test Condition Min Typ Max Unit

Collector to Emitter Breakdown Voltage BVCES I_C = 250 mA, VGE = 0 V 600 − − V Collector to Emitter Leakage Current I_CES V_CE = 600 V T_J = 25°C − − 250 mA

TJ = 125°C − − 2.0 mA

Collector to Emitter Saturation Voltage V_CE(SAT) I_C = 20 A, V_GE = 15 V T_J = 25°C − 1.8 2.7 V

T_J = 125°C − 1.6 2.0 V

Gate to Emitter Threshold Voltage VGE(TH) I_C = 250 mA, VCE = 600 V 4.5 5.5 7.0 V

Gate to Emitter Leakage Current I_GES V_GE = ±20 V − − ±250 nA

Switching SOA SSOA T_J = 150°C, RG = 3 W, VGE = 15 V,

L = 100 mH, V_CE = 600 V 100 − − A

Gate to Emitter Plateau Voltage VGEP IC = 20 A, VCE = 300 V − 8.6 − V

On−State Gate Charge Q_g(ON) I_C = 20 A, V_CE = 300 V V_GE = 15 V − 142 162 nC

V_GE = 20 V − 182 210 nC

Current Turn−On Delay Time t_d(ON)I IGBT and Diode at T_J = 25°C, ICE = 20 A,

V_CE = 390 V, V_GE = 15 V, RG = 3 W, L = 500 mH, Test Circuit Figure 24

− 15 − ns

Current Rise Time t_rI − 12 − ns

Current Turn−Off Delay Time td(OFF)I − 73 − ns

Current Fall Time t_fI − 32 − ns

Turn−On Energy (Note 3) E_ON1 − 105 − mJ

Turn−On Energy (Note 3) E_ON2 − 280 350 mJ

Turn−Off Energy (Note 2) E_OFF − 150 200 mJ

Current Turn−On Delay Time td(ON)I IGBT and Diode at T_J = 125°C, ICE = 20 A,

V_CE = 390 V, V_GE = 15 V, R_G = 3 W, L = 500 mH,

− 15 21 ns

Current Rise Time t_rI − 13 18 ns

Current Turn−Off Delay Time t_d(OFF)I − 105 135 ns

Current Fall Time t_fI − 55 73 ns

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified) (continued)

Parameter Symbol Test Condition Min Typ Max Unit

Diode Forward Voltage VEC IEC = 20 A − 2.3 − V

Diode Reverse Recovery Time t_rr I_EC = 20 A, dI_EC/dt = 200 A/ms − 35 − ns

I_EC = 1 A, dI_EC/dt = 200 A/ms − 26 − ns

Thermal Resistance Junction To Case R_qJC IGBT − − 0.43 °C/W

Diode − − 1.9 °C/W

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

2. Turn−Off Energy Loss (E_OFF) is defined as the integral of the instantaneous power loss starting at the trailing edge of the input pulse and ending at the point where the collector current equals zero (I_CE = 0 A). All devices were tested per JEDEC Standard No. 24−1 Method for Measurement of Power Device Turn−Off Switching Loss. This test method produces the true total Turn−Off Energy Loss.

3. Values for two Turn−On loss conditions are shown for the convenience of the circuit designer. EON1 is the turn−on loss of the IGBT only. EON2

is the turn−on loss when a typical diode is used in the test circuit and the diode is at the same T_J as the IGBT. The diode type is specified in Figure 20.

TYPICAL PERFORMANCE CURVES

40 300 500

100

60

20 0 80 100

40 120

50

25 0 100 200 300 700

5 10 20 30 50 t, SHORT CIRCUIT WITHSTAND SC TIME (ms)

15 13

ICE, DC COLLECTOR CURRENT (A)

T_C, CASE TEMPERATURE (°C) 100

75 125 150

VGE = 15 V

ICE, COLLECTOR TO EMITTER CURRENT (A)

V_CE, COLLECTOR TO EMITTER VOLTAGE (V) 600 500 400

ISC, PEAK SHORT CIRCUIT CURRENT (A)

10 11 12 14

ICE, COLLECTOR TO EMITTER CURRENT (A) VGE, GATE TO EMITTER VOLTAGE (V) fMAX, OPERATING FREQUENCY (kHz)

T_C V_GE 75°C 15 V

fMAX1 = 0.05 / (td(OFF)I + td(ON)I) fMAX2 = (PD − PC) / (EON2 + EOFF) PC = CONDUCTION DISSIPATION (DUTY FACTOR = 50%) RØJC = 0.43°C/W, SEE NOTES

TJ = 125°C, R^G = 3 W, L = 500 mH, V^CE = 390 V

Figure 1. DC COLLECTOR CURRENT vs.

CASE TEMPERATURE

Figure 2. MINIMUM SWITCHING SAFE OPERATING AREA

Figure 3. OPERATING FREQUENCY vs.

COLLECTOR TO EMITTER CURRENT Figure 4. SHORT CIRCUIT WITHSTAND TIME

TJ = 150°C, RG = 3 W, VGE = 15 V, L = 100 mH

20

0 80

40 60 100

PACKAGE LIMIT

DIE CAPABILITY

40 0

2 10

100 250 350 450 14

4 6 8 12

150 200 300 400

tSC

ISC

VCE = 390 V, RG = 3 W, TJ = 125°C

TYPICAL PERFORMANCE CURVES

4 8 20 24 36

8 14 16 18 20 22

12 10

600

0 100 400

200 500 700 800

300 1000

600 800

400 1200

0 200 1400

0 20 40 80

60 100

ICE, COLLECTOR TO EMITTER CURRENT (A) 00

1.2

EON2, TURN−ON ENERGY LOSS (mJ)

15

10 20

0 E, TURN−OFF ENERGY LOSS (mJ)OFF

td(ON)I, TURN−ON DELAY TIME (ns) trI, RISE TIME (ns)

ICE, COLLECTOR TO EMITTER CURRENT (A)

V_CE, COLLECTOR TO EMITTER VOLTAGE (V) V_CE, COLLECTOR TO EMITTER VOLTAGE (V)

I_CE, COLLECTOR TO EMITTER CURRENT (A) I_CE, COLLECTOR TO EMITTER CURRENT (A)

I_CE, COLLECTOR TO EMITTER CURRENT (A) I_CE, COLLECTOR TO EMITTER CURRENT (A) 1.6 2.0

0.4 0.8

35

30 40

25

15

10 20

5 25 30 35 40

DUTY CYCLE < 0.5%, VGE = 15 V PULSE DURATION = 250 ms

TJ = 150°C T_J = 125°C

TJ = 25°C

TJ = 125°C, VGE = 12 V, VGE = 15 V

TJ = 25°C, VGE = 12 V, VGE = 15 V

TJ = 125°C, VGE = 12 V or 15 V

TJ = 25°C, VGE = 12 V or 15 V RG = 3 W, L = 500 mH, VCE = 390 V RG = 3 W, L = 500 mH, VCE = 390 V

TJ = 125°C or TJ = 25°C, VGE = 12 V RG = 3 W, L = 500 mH, VCE = 390 V RG = 3 W, L = 500 mH, VCE = 390 V

TJ = 25°C or TJ = 125°C, VGE = 15 V TJ = 25°C or TJ = 125°C, VGE = 12 V

TJ = 25°C or TJ = 125°C, VGE = 15 V

Figure 5. COLLECTOR TO EMITTER ON−STATE

VOLTAGE Figure 6. COLLECTOR TO EMITTER ON−STATE VOLTAGE

Figure 7. TURN−ON ENERGY LOSS vs.

COLLECTOR TO EMITTER CURRENT

Figure 8. TURN−OFF ENERGY LOSS vs.

COLLECTOR TO EMITTER CURRENT

Figure 9. TURN−ON DELAY TIME vs. COLLECTOR

TO EMITTER CURRENT Figure 10. TURN−ON RISE TIME vs. COLLECTOR TO EMITTER CURRENT

20 40 80

60

100 DUTY CYCLE < 0.5%, VGE = 12 V PULSE DURATION = 250 ms

TJ = 150°C T_J = 125°C

TJ = 25°C

2.4 2.8 3.2 0 0.4 0.8 1.2 1.6 2.0 2.4 2.8

15

10 20

0 25 30 35 40

12 16 28 32

15

10 20

5 25 30 35 40

TYPICAL PERFORMANCE CURVES

0 0.2 0.4 0.6 1.0 1.8

0.8 1.4 1.2 1.6 0 80 120 160 200 240

40

16 32 24 48 64

40 56 80 72

80

60 70 120

100 110

90

7 11

6

2 14

00 20

4 10

80 100 6

8 12 16

50 125

25 0.1

10 1

3 10 tfI, FALL TIME (ns)VGE, GATE TO EMITTER VOLTAGE (V)

ETOTAL, TOTAL SWITCHING ENERGY LOSS (mJ) ETOTAL, TOTAL SWITCHING ENERGY LOSS (mJ)

td(OFF)I, TURN−OFF DELAY TIME (ns)

I_CE, COLLECTOR TO EMITTER CURRENT (A)

VGE, GATE TO EMITTER VOLTAGE (V) QG, GATE CHARGE (nC)

RG, GATE RESISTANCE (W) DUTY CYCLE < 0.5%, VCE = 10 V

PULSE DURATION = 250 ms

VGE = 12 V, VGE = 15 V, TJ = 125°C

VGE = 12 V, VGE = 15 V, TJ = 25°C

RG = 3 W, L = 500 mH, VCE = 390 V, VGE = 15 V E_TOTAL = E_ON2 + E_OFF

Figure 11. TURN−OFF DELAY TIME vs.

COLLECTOR TO EMITTER CURRENT Figure 12. FALL TIME vs. COLLECTOR TO EMITTER CURRENT

Figure 13. TRANSFER CHARACTERISTIC Figure 14. GATE CHARGE WAVEFORMS

Figure 15. TOTAL SWITCHING LOSS vs.

CASE TEMPERATURE Figure 16. TOTAL SWITCHING LOSS vs.

GATE RESISTANCE TC, CASE TEMPERATURE (°C)

RG = 3 W, L = 500 mH, VCE = 390 V

I_CE, COLLECTOR TO EMITTER CURRENT (A)

ICE, COLLECTOR TO EMITTER CURRENT (A)

TJ = −55°C TJ = 125°C

TJ = 25°C

I_G(REF) = 1 mA, R_L = 15 W, TJ = 25°C

V_CE = 600 V V_CE = 400 V

V_CE = 200 V

ICE = 30 A

ICE = 20 A I_CE = 10 A

100 1000

100

75 150

9

8 10 12 40 60 120 140 160

TJ = 125°C, VGE = 12 V or 15 V

TJ = 25°C, VGE = 12 V or 15 V RG = 3 W, L = 500 mH, VCE = 390 V

15

10 20

5 25 30 35 40 5 10 15 20 25 30 35 40

TJ = 125°C L = 500 mH, VCE = 390 V, VGE = 15 V ETOTAL = EON2 + EOFF

I_CE = 30 A ICE = 20 A I_CE = 10 A

TYPICAL PERFORMANCE CURVES

0 40

10 20 30 50

60

40

20

0 80

50 90

70

C, CAPACITANCE (nF)

0 20 100

0 1 2 4 5

3

8 10 11 12 13

0.5

0 0 20

300 700

200 900

VCE, COLLECTOR TO EMITTER VOLTAGE (V)trr, RECOVERY TIMES (ns)

trr, RECOVERY TIMES (ns) Qrr, REVERSE RECOVERY CHARGE (nc)

V_GE, GATE TO EMITTER VOLTAGE (V)

V_EC, FORWARD VOLTAGE (V) I_EC, FORWARD CURRENT (A)

di_EC/dt, RATE OF CHANGE OF CURRENT (A/ms) Figure 17. CAPACITANCE vs. COLLECTOR TO

EMITTER VOLTAGE Figure 18. COLLECTOR TO EMITTER ON−STATE VOLTAGE vs. GATE TO EMITTER VOLTAGE

Figure 19. DIODE FORWARD CURRENT vs.

FORWARD VOLTAGE DROP Figure 20. RECOVERY TIMES vs.

FORWARD CURRENT

Figure 21. RECOVERY TIMES vs. RATE OF

CHANGE OF CURRENT Figure 22. STORED CHARGE vs. RATE OF CHANGE OF CURRENT

di_EC/dt, RATE OF CHANGE OF CURRENT (A/ms) V_CE, COLLECTOR TO EMITTER VOLTAGE (V)

IEC, FORWARD CURRENT (A)

600 800 1000

500

400 200 300 400 500 600 700 800 900 1000

1.0 1.5 2.0 2.5 4 8 12 16

9 14 15 16

dIEC/dt = 200 A/ms

125°C trr

125°C tb 125°C ta

25°C trr

25°C tb 25°C ta

IEC/dt = 20 A, VCE = 390 V

125°C tb 125°C ta

25°C ta

25°C tb

40 60 80

C_IES

C_OES C_RES

FREQUENCY = 1 MHz

1.7 1.8 2.0

1.9 2.1

2.2 DUTY CYCLE < 0.5%, TJ = 25°C PULSE DURATION = 250 ms,

I_CE = 30 A I_CE = 20 A

I_CE = 10 A

0 3.0 10 15 20 25

5 30

125°C

25°C DUTY CYCLE < 0.5%

PULSE DURATION = 250 ms

30

10

600

0

800 VCE = 390 V

125°C, ICE = 20 A

125°C, ICE = 10 A

25°C, ICE = 20 A

25°C, ICE = 10 A 200

400

TYPICAL PERFORMANCE CURVES

t1, RECTANGULAR PULSE DURATION (s) ZqJC, NORMALIZED THERMAL RESPONSE

Figure 23. IGBT NORMALIZED TRANSIENT THERMAL RESPONSE, JUNCTION TO CASE

10⁻² 10⁻¹ 10⁰

10⁻⁵ 10⁻⁴ 10⁻³ 10⁻² 10⁻¹ 10⁰

SINGLE PULSE 0.1

0.2 0.5

0.05

0.01 0.02

t₁

t₂ P_D

DUTY FACTOR, D = t1 / t2 PEAK TJ = (PD x Z_qJC x R_qJC) + TC

TEST CIRCUIT AND WAVEFORMS

+

−

HGTG20N60A4D

DUT

DIODE TA49372

t_fI

t_d(OFF)I trI

t_d(ON)I 10%

90%

10%

90%

V_CE

I_CE V_GE

E_OFF E_ON2

VDD = 390 V L = 500 mH

RG = 3 W

Figure 24. INDUCTIVE SWITCHING TEST CIRCUIT Figure 25. SWITCHING TEST WAVEFORMS

HANDLING PRECAUTIONS FOR IGBTs

Insulated Gate Bipolar Transistors are susceptible to gate−insulation damage by the electrostatic discharge of

energy through the devices. When handling these devices, care should be exercised to assure that the static charge built in the handler’s body capacitance is not discharged through the device. With proper handling and application procedures, however, IGBTs are currently being extensively used in production by numerous equipment manufacturers in military, industrial and consumer applications, with virtually no damage problems due to electrostatic discharge.

IGBTs can be handled safely if the following basic precautions are taken:

1. Prior to assembly into a circuit, all leads should be kept shorted together either by the use of metal shorting springs or by the insertion into conductive material such as “ECCOSORBD t LD26” or equivalent.

2. When devices are removed by hand from their carriers, the hand being used should be grounded by any suitable means − for example, with a metallic wristband.

3. Tips of soldering irons should be grounded.

4. Devices should never be inserted into or removed from circuits with power on.

5. Gate Voltage Rating − Never exceed the

gate−voltage rating of V

. Exceeding the rated V

can result in permanent damage to the oxide layer in the gate region.

6. Gate Termination − The gates of these devices are essentially capacitors. Circuits that leave the gate open− circuited or floating should be avoided.

These conditions can result in turn−on of the device due to voltage buildup on the input capacitor due to leakage currents or pickup.

7. Gate Protection - These devices do not have an internal monolithic Zener diode from gate to emitter. If gate protection is required an external Zener is recommended.

OPERATING FREQUENCY INFORMATION

Operating frequency information for a typical device (Figure 3) is presented as a guide for estimating device performance for a specific application. Other typical frequency vs collector current (I

) plots are possible using the information shown for a typical unit in Figures 6, 7, 8, 9 and 11. The operating frequency plot (Figure 3) of a typical device shows f

or f

; whichever is smaller at each point. The information is based on measurements of a typical device and is bounded by the maximum rated junction temperature.

f

is defined by f

= 0.05 / (t

+ t

).

Deadtime (the denominator) has been arbitrarily held to 10% of the on−state time for a 50% duty factor. Other definitions are possible. t

and t

are defined in Figure 25. Device turn−off delay can establish an additional frequency limiting condition for an application other than T

. t

is important when controlling output ripple under a lightly loaded condition.

f

is defined by f

= (P

− P

) / (E

+ E

).

The allowable dissipation (P

) is defined by P

= (T

− T

) / R

. The sum of device switching and conduction losses must not exceed P

. A 50% duty factor was used (Figure 3) and the conduction losses (P

) are approximated by P

= (V

x I

) / 2.

E

and E

are defined in the switching waveforms shown in Figure . E

is the integral of the instantaneous power loss (I

x V

) during turn−on and E

is the integral of the instantaneous power loss (I

x V

) during turn−off. All tail losses are included in the calculation for E

; i.e., the collector current equals zero (I

= 0).

ORDERING INFORMATION

Part Number Package Brand Shipping

HGTG20N60A4D TO−247 20N60A4D 450 Units / Tube

NOTE: When ordering, use the entire part number.

TO−247−3LD SHORT LEAD CASE 340CK

ISSUE A

DATE 31 JAN 2019

XXXX = Specific Device Code A = Assembly Location Y = Year

WW = Work Week ZZ = Assembly Lot Code

*This information is generic. Please refer to device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.

GENERIC MARKING DIAGRAM*

AYWWZZ XXXXXXX XXXXXXX

E

D

L1 E2

(3X) b (2X) b2

b4

(2X) e

Q

L

0.25 ^M B A ^M A

A1 A2 A

c

B

D1 P1

S P

E1

D2

1 2 3 2

DIM MILLIMETERS MIN NOM MAX A 4.58 4.70 4.82 A1 2.20 2.40 2.60 A2 1.40 1.50 1.60 b 1.17 1.26 1.35 b2 1.53 1.65 1.77 b4 2.42 2.54 2.66 c 0.51 0.61 0.71 D 20.32 20.57 20.82

D1 13.08 ~ ~

D2 0.51 0.93 1.35 E 15.37 15.62 15.87

E1 12.81 ~ ~

E2 4.96 5.08 5.20

e ~ 5.56 ~

L 15.75 16.00 16.25 L1 3.69 3.81 3.93

P 3.51 3.58 3.65 P1 6.60 6.80 7.00 Q 5.34 5.46 5.58 S 5.34 5.46 5.58

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

98AON13851G DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1 TO−247−3LD SHORT LEAD

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