立命館大学理工学研究所紀要: 第73号

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立命館大学

理工学研究所紀要

第73号

MEMOIRS

OF THE

INSTITUTE

OF

SCIENCE & ENGINEERING

RITSUMEIKAN UNIVERSITY

KUSATSU, SHIGA, JAPAN

NO. 73

2014

ISSN 0370-4254 CODEN:RDRKAJ

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理工学研究所紀要第73号 2014 目次＜一般論文＞ 1. 代数体上の平方剰余の相互法則 ……… 石井秀則 …… 1 2. エポキシ樹脂研磨パッドの粘弾性と研磨特性 ……… 谷泰弘・張宇・村田順二 …… 5 3. 電着工具用の部分Ni被覆ダイヤモンド砥粒の開発 ……… 張宇・谷泰弘・村田順二 …… 15 4. ワイヤ擦過援用ウェットエッチングによるシリコンインゴットの切断の基礎的検討 ……… 谷泰弘・張宇・村田順二 …… 27 5. 言語コミュニケーション論における「希望学」─「分かり合う」ことは可能か： W.V.O. Quine, D. Davidson, R. Rortyの議論を出発点に

……… 山中司 …… 37

6. Formation of Forsterite Grains and Direct Observation of The Sublimation of Crystal Formation Grain

……… 墻内千尋 …… 45 7. 敷葉（しきば）工法とその起源 ……… 奥田昌男・中根洋治・可児幸彦・西村勝広・早川清 …… 53 8. 遺跡から知る切盛土工 ……… 西村勝広・可児幸彦・奥田昌男・中根洋治・早川清 …… 63 9. オペレーションズリサーチエクセルソルバーで解く線形計画法１ ……… 林芳樹 …… 71 大型研究装置成果報告書 ……… 79 理工学研究所記事 ……… 125

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୅਺ମ্ͷฏํ৒༨ͷ૬ޓ๏ଇ

ੴҪलଇ

=======================================================================

Quadratic reciprocity law over number ¿elds

Hidenori Ishii

Quadratic reciprocity law, which was ¿rst proved by C.F. Gauss [1], can be viewed as a relation of two quadratic Dirichelet characters. The author has given a proof by virtue of the functional equation of Dedekind zeta function of biquadratic number ¿elds. [3], In this paper, similar argument as in [3] will be applied to relative biquadratic extensions of number ¿elds. Then we will show a generalization of quadratic reciprocity law over number ¿elds.

Keywors ; Qadratic reciprocity, quadratic extension of number ¿elds, functioal equation of Dedekind zeta function, Hecke characters of the ideal class group

E-mail: [email protected]

==========================================================================

໋ཱؗେֶཧ޻ֶ෦਺ཧՊֶՊ

Department of Mathematical Sciences, Ritsumeikan University,

Kusatsu, Shiga, 525-8577, Japan

1

立命館大学理工学研究所紀要第73号 2014年

Memoirs of the Institute of Science and Engineering, Ritsumeikan University, Kusatsu, Shiga, Japan. No. 73, 2014

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1 ংจ

࣍ͷฏํ৒༨ͷ૬ޓ๏ଇ͸ 1801 ೥ʹ Gauss[1] ͕࠷ॳͷূ໌Λ༩͔͑ͯΒɺΨ΢εࣗ਎΋ؚΊɺ ଟ͘ͷ਺ֶऀʹΑΓɺ໿ 240 ͷผূ໌͕༩͑ΒΕ͖ͯͨɻcf.Lemmermeyer[4] ఆཧʢฏํ৒༨ͷ૬ޓ๏ଇʣɹ p ͱ q ͸૬ҟͳΔحૉ਺ͱ͢Δɻ͜ͷͱ͖ p q q p = (−1)p−12 q−1 2 ͕੒Γཱͭɻ ஶऀ͸ [3] ʹ͓͍ͯɺL= Q(√p∗,√q∗) ͱ͠ɺL ͷσσΩϯτɾθʔλؔ਺ζL(s) Λྨମ࿦Λ༻͍ͯ෼ ղ͠ɺؔ਺౳ࣜΛద༻͢Δ͜ͱʹΑͬͯɺฏํ৒༨ͷ૬ޓ๏ଇΛূ໌ͨ͠ɻ͜͜Ͱɺɹ p∗= (−1)p−1 2 p, q∗= (−1)q−12 q Ͱ͋Δɻ͜ͷํ๏͸ɺ༗ཧ਺ମͷಛघੑΛ࢖Θͳ͍ͷͰҰൠͷ୅਺ମ্ͷ৔߹ʹ֦ு ͕ՄೳͰ͋ͬͨɻຊ࿦จʹ͓͍ͯ͸ɺF Λ୅਺ମͱ͠ɺF ͷ 2 ͱૉͳ૬ҟͳΔૉΠσΞϧ p,q ʹର ͠ɺ_χ_p,χ_q_{ΛͦΕͧΕɺಋख p,q ͷΠσΞϧྨࢦඪͰɺҐ਺͕̎ͷ΋ͷͱ͢Δɻ͜ͷͱ͖ɺ͕࣍੒} Γཱͭɻ ఆཧ 1. χp(q) = χq(p)

2 ؔ਺౳ࣜʹ͍ͭͯ

K ͸୅਺ମͱ͠ɺ࣮ૉ఺ͷݸ਺ɺڏૉ఺ͷݸ਺ΛͦΕͧΕɺr1,r2ͱ͢Δɻ·ͨɺm ͸ K ͷ੔Π σΞϧͱ͢Δɻm Λ๏ͱ͢Δݪ࢝తྨࢦඪ χ ͕ ∀α ≡ 1 mod m ʹରͯ͠ɺ χ((α)) = ν αν |αν| uν ͜͜Ͱɺੵ͸࣮ૉ఺Λ૸Δɻ_α_ν͸࣮ૉ఺_{ν ʹରԠ͢Δ α ͷڞ໾Ͱ͋Δɻu}_ν_{= 0, 1} ͜ͷͱ͖ɺ ΛK(s, χ) = (|dK|N(m)) s 2 ν π−s+uν 2 Γ(s+ uν 2 ) (2(2π)−sΓ(s))r2_L(s, χ) ͱ͓͘ɻ͜͜Ͱɺੵ͸࣮ૉ఺Λ૸ΔɻdK͸ K ͷ൑ผࣜͰ͋ΔɻL(s, χ) ͸ Hecke ͷ̡ؔ਺Ͱɺ L(s, χ) = n χ(n)N(n)−s ͱ͘ʹɺ_{χ = 1 ͷͱ͖͸ L(s, 1) = ζ}_K(s) ͸ K ͷσσΩϯτθʔλͰ͋Δ͜ͱʹ஫ҙ͢ΔɻΛK(s) = Λ(s, 1) ͱॻ͘ɻ࣍ʹɺΨ΢ε࿨ W(χ) ʹ͍ͭͯઆ໌͢Δɻ χ∞(α) = ν αν |αν| u_ν

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ͱ͓͘ɻ͜͜Ͱɺੵ͸࣮ૉ఺Λ૸Δɻ χf(α) = χ((α))χ∞(α)−1 ͱ͢ΔɻK ͷڞ໾ࠩੵ d ʹରͯ͠ɺdmc = (b) ͱͳΔΑ͏ʹɹ੔ΠσΞϧ c, (c, m) = 1 ΛͱΓɺ W(χ) = χ∞(b) χ(c) α χf(α)e2πitr(α/b) ʹΑͬͯɺΨ΢ε࿨ W(χ) Λఆٛ͢Δɻ(cf. Miyake.[5]) Hecke[2] ͸࣍ͷؔ਺౳ࣜΛূ໌ͨ͠ɻ ఆཧʢHecke) Λ(1 − s, χ) = T(χ)Λ(s, χ) T (χ) = i−uW(χ)/N(m)1/2 u= ν u_ν

3 ఆཧ̍ͷূ໌

F ͸ n ࣍୅਺ମͱ͠ɺF ͷҟͳΔحૉΠσΞϧp,q ʹର͠ɺχ1= χp,χ2 = χqΛͦΕͧΕɺಋख p,q ͷྨࢦඪͰɺҐ਺͕̎ͷ΋ͷͱ͢Δɻχ1,χ2ʹରԠ͢Δ F ͷ 2 ֦࣍େମΛͦΕͧΕɺK1,K2ͱ ͠ɺͦͷ߹੒ମΛ L ͱ͢ΔɻL ͸ F ্ͷ (2,2) ܕΞʔϕϧ֦େମͰ͋Γɺ͋ͱ̍ͭͷ 2 ࣍தؒମΛ K3ͱ͠ɺK3ʹରԠ͢ΔྨࢦඪΛɹχ3ͱ͢Δͱɺχ3= χ1χ2Ͱ͋Δɻྨମ࿦ʹΑΓɺζL͸࣍ͷΑ͏ ʹ෼ղ͢Δɻ ζL(s)= ζF(s) 3 i=1 L(s, χi). ͜ΕΑΓɺ_χ3= χ1χ2ͳΒͼʹɺ|dL| = |dF|43i=1N(mi) ʢmi͸χiͷಋखʣʹ஫ҙͯ͠ɺ ΛL(s)= ΛF(s) 3 i=1 Λ(s, χi). ͕ಘΒΕΔɻ_χ_i͸Ґ਺͕̎ͳͷͰɺ_χ_i_{= χ}_iͰ͋Δɻͦ͜Ͱɺ_Λ_L(1− s) = ΛL(s) ͷ྆ลʹ୅ೖͯ͠ɺ 3 i=1 W(χi)= 3 i=1 N(mi)1/2 ͕Θ͔Δɻm1= p, m2= q ͸ޓ͍ʹૉͳͷͰɺm3= pqɺ·ͨɺ W(χ1χ2)= χ1(q)χ2(p)W(χ1)W(χ2) W(χi)2= |W(χi)|2= N(mi) (i= 1, 2) χ1(q)χ2(p) = 1 ͜ΕͰɺఆཧ͕̍ূ໌͞Εͨɻ 3 代数体上の平方剰余の相互法則 −3−

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ࢀߟจݙ

[1] Gauss, C. F. Disquisiones arithmeticae, Lipsiae (Leipzig): Gerhard Fleischer (1801)

[2] Hecke, E. ¨Uber eine neue Art von Zetafunktionen und ihre Beziehungen zur Verteilung der Primzahlen. Math.Z.,1(1918), 357-376;4(1920),11-21.

[3] Ishii, H. Functional equations and the law of quadratic reciprocity, Mem. Inst. Sci. Eng. Ritsumeikan Univ.No.57(1998)1-3.

[4] Lemmermeyer,H. Reciprocity Laws From Euler to Eisenstein, , Springer-Verlag(2000).. [5] Miyake, T. Modular forms, Springer-Verlag(1989).

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࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ⢓ᙎᛶ࡜◊☻≉ᛶ

㇂ Ὀᘯ

1)

_{㸪ᙇ Ᏹ}

1)

_{㸪ᮧ⏣㡰஧}

2)

᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

Relationship between polishing performance and viscoelasticity of epoxy

resin polishing pads

Yasuhiro TANI

1)

_{, Yu ZHANG}

1)

_and

_{Junji MURATA}

2)

Polishing performances of glass using epoxy resin polishing pads from the aspect of their mechanical properties are described. Material removal rates are independent to the hardness of the epoxy resin pads. The different types of epoxy resin pads are produced by varying the composition of the resin and the curing agent. Dynamic mechanical analysis (DMA) of the epoxy and conventional urethane resin polishing pads was conducted to investigate the relationship between the material removal rates and the mechanical properties of the epoxy resin polishing pads. DMA measurement indicates that the epoxy resin polishing pads showed a significant difference in the storage and loss modulus compared to the conventional urethane pads. Moreover, the epoxy resin pads showed a higher loss tangent (tan į) than the urethane resin polishing pad. From the investigation of the relationship between the material removal rates and tan į of the polishing pads, the strong positive correlation between the material rate and tan į is observed. Finally, the dependence of polishing conditions on the material removal rate by the epoxy and urethane resin pads is evaluated. It is found that the difference in the material removal rate between the epoxy and urethane resin pads becomes larger under a condition of a low abrasive concentration and a high rotation rate.

Key Words : Polishing, Abrasive Grain, Polishing Pad, Epoxy Resin, Cerium Oxide, Glass, Viscoelasticity

E-mail㸸[email protected] (Y. Zhang)

᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

1)

_{❧࿨㤋኱Ꮫ⌮ᕤᏛ㒊ᶵᲔᕤᏛ⛉}

2)

_{㏆␥኱Ꮫ⌮ᕤᏛ㒊ᶵᲔᕤᏛ⛉}

1)

_{Department of Mechanical Engineering, Ritsumeikan University,}

Kusatsu, Shiga, 525-8577, Japan

2)

_{Department of Mechanical Engineering, Kinki University,}

Higashiosaka, Osaka, 577-8502, Japan

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⥴ ゝ ࢞ࣛࢫࡢ㙾㠃◊☻࡟ከ⏝ࡉࢀ࡚࠸ࡿ◊☻ᮦ㸪㓟໬ࢭ࣒ࣜ࢘ࡣ᫖௒ࡢࣞ࢔࢔࣮ࢫ౪⤥୙㊊ࡢᙳ㡪ࢆཷࡅ㸪ᅜෆ࡟ ࠾ࡅࡿ౯᱁ࡀ㧗㦐ࡋ࡚࠸ࡿ㸬ࡇࡢࡼ࠺࡞≧ἣࡢ࡞࠿㸪࢞ࣛࢫ◊☻࡟࠾ࡅࡿ㓟໬ࢭ࣒ࣜ࢘◒⢏ࡢ౑⏝㔞ࢆపῶࡍࡿ ࡇ࡜ࡸ௚ࡢ◒⢏࡟௦᭰ࡍࡿྲྀࡾ⤌ࡳࡀ⏘Ꮫᐁ࡟࠾࠸࡚㐍ࡵࡽࢀ࡚࠸ࡿ㸦㡲⏣㸪2012㸧㸦ᒣᓮ௚㸪2011㸧㸦ụ⏣௚㸪 2011㸧㸬➹⪅ࡽࡣ㸪ࡑࡢྲྀࡾ⤌ࡳ࡜ࡋ࡚᪂つ㧗ᶵ⬟◊☻ᮦࡸ◊☻ᕤලࡢ㛤Ⓨࢆ⾜ࡗ࡚࠸ࡿ㸬㸦୍ᘕ✑௚㸪2009 ࡞ ࡝㸧ࡑࡢ୍ࡘ࡟ᚑ᮶ࡢ࢘ࣞࢱࣥᶞ⬡࡟௦ࢃࡾ࢚࣏࢟ࢩᶞ⬡ࢆ᥇⏝ࡋࡓከᏍ㉁࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡀ࠶ࡿ㸬ከ Ꮝ㉁࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡣࢫ࣮ࣛࣜ࡟ᑐࡍࡿぶ࿴ᛶࡀ㧗ࡃ㸪స⏝◒⢏ᩘࡀྥୖࡍࡿࡇ࡜࠿ࡽ㸪ᚑ᮶ࡢከᏍ㉁ ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚ 2 ಸ⛬ᗘࡢ◊☻⬟⋡ࡀᚓࡽࢀࡿࡇ࡜ࡀࢃ࠿ࡗ࡚࠸ࡿ㸬ࡲࡓ㸪⾲㠃⢒ࡉࡸ࠺ࡡࡾ࡞࡝ࡢ ௙ୖࡆ㠃ရ㉁ࡢྥୖࡀ☜ㄆࡉࢀ࡚࠸ࡿ㸬ࡉࡽ࡟㸪ࢪࣝࢥࢽ࢔◒⢏࡜࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࢆే⏝ࡍࡿࡇ࡜࡟ࡼ ࡾ㸪㓟໬ࢭ࣒ࣜ࢘◒⢏ࡢ᏶඲࡞௦᭰ࢆᐇ⌧ࡋ࡚࠸ࡿ㸦ᮧ⏣௚㸪2011㸧㸬◊☻ࣃࢵࢻࡀ◊☻≉ᛶ࡟୚࠼ࡿせᅉ࡟ࡣ㸪 ࢫ࣮ࣛࣜ࡟ᑐࡍࡿぶ࿴ᛶ௨እ࡟ࣃࢵࢻࡢᶵᲔⓗ≀ᛶࡀᣲࡆࡽࢀࡿ㸬ࡋ࠿ࡋ㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢᶵᲔⓗ≉ ᛶ࡜◊☻≉ᛶࡢ㛵ಀ࡟ࡘ࠸࡚ࡣ᫂ࡽ࠿࡟࡞ࡗ࡚࠸࡞࠸㸬ࡑࡇ࡛㸪ᮏሗ࡛ࡣ㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢᶵᲔⓗ࡞ ≀ᛶࡀ◊☻≉ᛶ࡟୚࠼ࡿᙳ㡪ࢆㄪᰝࡋࡓ㸬ࡲࡎ㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࢆ⏝࠸࡚࢞ࣛࢫࡢ◊☻≉ᛶホ౯ࢆ⾜࠸㸪 ◊☻ࣃࢵࢻࡢ◳ᗘࡀ◊☻≉ᛶ࡟ཬࡰࡍᙳ㡪࡟ࡘ࠸࡚ホ౯ࢆ⾜ࡗࡓ㸬ḟ࡟㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ⢓ᙎᛶࢆື ⓗᶵᲔศᯒ㸦Dynamic Mechanical Analysis, DMA㸧࡟ࡼࡾホ౯ࡋ㸪◊☻ࣃࢵࢻࡢ⢓ᙎᛶ࡜◊☻≉ᛶ࡜ࡢ㛵ಀࢆㄪ࡭ ࡓ㸬᭱ᚋ࡟㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ◊☻≉ᛶࡢຍᕤ᮲௳౫Ꮡᛶࢆホ౯ࡋ㸪ᚑ᮶ࡢ࢘ࣞࢱࣥᶞ⬡◊☻ࣃࢵࢻ࡜ ࡢẚ㍑ࢆ⾜࠺ࡇ࡜࡛㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻ࡟㐺ࡋࡓ౑⏝᪉ἲࡢ᳨ウࢆ⾜ࡗࡓ㸬 ࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ◳ᗘ࡜◊☻≉ᛶࡢ㛵ಀ ࡲࡎ㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻ㸦௨ୗ㸪࢚࣏࢟ࢩࣃࢵࢻ࡜ࡍࡿ㸧ࡢ◳ᗘࡀ◊☻≉ᛶ࡟୚࠼ࡿᙳ㡪࡟ࡘ࠸࡚ホ౯ Fig. 1 Schematic view of polishing experiment

Table 1 Experimental condition

Workpiece Abrasives

Material Soda-lime glass Material CeO2

Dimension 20 mm×t10 mm Average diameter (D50) 1.2 ȝm

Surface roughness 0.4 ȝmRa Product name SHOROX A-10

Polishing condition Slurry

Polishing machine 200 mm single-sided Base fluid Deionized water

Polishing pressure, P 20 kPa Abrasive concentration, C 3.0 wt%

Rotation rate, R 90 rpm Supply rate, S 25 mL/min

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ࢆ⾜ࡗࡓ㸬ホ౯ࡋࡓ◊☻ࣃࢵࢻࡣ◳ᗘ㸦A ࢹ࣓࣮ࣗࣟࢱ◳ᗘ㸧ࡀ␗࡞ࡿ࢚࣏࢟ࢩࣃࢵࢻ㸪࡞ࡽࡧ࡟ẚ㍑ᑐ㇟࡜ࡋ ࡚ᕷ㈍ࡢከᏍ㉁࢘ࣞࢱࣥᶞ⬡◊☻ࣃࢵࢻ㸦஑㔜㟁Ẽ㸪KSP-66A㸪௨ୗ㸪࢘ࣞࢱࣥࣃࢵࢻ࡜ࡍࡿ㸧࡛࠶ࡿ㸬࢚࣏࢟ ࢩࣃࢵࢻࡢ◳ᗘࡢ㐪࠸ࡣ㸪◊☻ࣃࢵࢻෆ࡟ྵࡲࢀࡿẼᏍ⋡࠾ࡼࡧᶞ⬡⤌ᡂࡢᕪ࡟ࡼࡿࡶࡢ࡛࠶ࡿ㸬ᅗ 1 ࠾ࡼࡧ⾲ 1 ࡟◊☻ᐇ㦂⿦⨨࠾ࡼࡧ◊☻᮲௳ࢆ♧ࡍ㸬◊☻ᶵ࡟ࡣ㸪ᐃ┙ᚄ 200 mm ࡢ∦㠃⢭ᐦࣛࢵࣆࣥࢢ⿦⨨㸦ࢼࣀࣇ࢓ࢡ ࢱ㸪NF-300㸧ࢆ⏝࠸ࡓ㸬ᕤస≀ࡣࢯ࣮ࢲ࢞ࣛࢫ࡛࠶ࡾ㸪 3 Ⅼࡢᕤస≀ࢆ┤ᚄ 90 mm ࡢ࣮࣡ࢡ࣍ࣝࢲ࡟ᑐࡋ㸪୰ ᚰ࠿ࡽ༙ᚄ 35 mm ࡢ఩⨨࡟➼㛫㝸࡛㈞௜ࡅࡓ㸬ᕤస≀⾲㠃ࡣ㸪๓ฎ⌮࡜ࡋ࡚⢏ᗘ#2000 ࡢ⥳ⰍⅣ໬⌛⣲㸦GC㸧◒ ⢏ࢆ⏝࠸ࡓࣛࢵࣆࣥࢢ࡟ࡼࡾ⾲㠃⢒ࡉࢆ⣙ 0.4 mRa ࡟ຍᕤࡋࡓ㸬◊☻ࣃࢵࢻࡢ⾲㠃ࡣ㸪ࣀ࣮ࢬ༙ᚄ 0.5 mm ࡢࢲ ࢖ࣖࣔࣥࢻࣂ࢖ࢺࢆ⏝࠸࡚㸪ษ㎸ࡳ㔞 150 m㸪ࣂ࢖ࢺ㏦ࡾ㏿ᗘ 0.5 mm/s㸪ࣃࢵࢻᅇ㌿㏿ᗘ 100 rpm ࡢ᮲௳࡛ษ๐ 㸦ࣇ࢙࢖ࢩࣥࢢ㸧ࢆ⾜ࡗࡓ㸬ࡑࡢᚋ㸪⢏ᗘ#100 ࡢࢲ࢖ࣖࣔࣥࢻ㟁╔◒▼ࢆ⏝࠸࡚㸪ࢻࣞࢵࢧ/ࣃࢵࢻᅇ㌿㏿ᗘ 90 rpm ࡢ᮲௳࡛ࢻࣞࢵࢩࣥࢢࢆ 10 ศ㛫⾜ࡗࡓ㸬◊☻⬟⋡ࡣຍᕤ๓ᚋࡢᕤస≀ࡢ㉁㔞ᕪ࡟ࡼࡗ࡚⟬ฟࡋࡓ㸬◊☻ᚋᕤస≀ ࡢ⾲㠃⢒ࡉࡣ㸪఩┦ࢩࣇࢺᖸ΅㢧ᚤ㙾㸦Zygo, NewView 7300㸧࡟ࡼࡾ 0.70 × 0.52 mm ࡢ㡿ᇦࢆ ᐃࡋ㸪࢝ࢵࢺ࢜ ࣇ್ 0.08 mm ࡢ㧗ᇦࣇ࢕ࣝࢱࢆ㐺⏝ࡋ࡚㸪⟬⾡ᖹᆒ⢒ࡉ Raࢆ⟬ฟࡋࡓ㸬 ᅗ 2 ࡟◊☻ࣃࢵࢻࡢ◳ᗘ࡜◊☻≉ᛶࡢ㛵ಀࢆ♧ࡍ㸬࢚࣏࢟ࢩࣃࢵࢻ࡟ࡼࡿ◊☻⬟⋡ࡣ㸪ࣃࢵࢻ◳ᗘ࡟㛵ࢃࡽࡎ ࡯ࡰ୍ᐃࡢ್ࢆ♧ࡋ㸪࠸ࡎࢀࡶᚑ᮶ࡢ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚ 70 %⛬ᗘ㧗࠸್ࢆ♧ࡍࡇ࡜ࡀศ࠿ࡗࡓ㸬୍᪉㸪 ௙ୖࡆ㠃⢒ࡉࡣ࢚࣏࢟ࢩࣃࢵࢻࡢ◳ᗘ࡟౫Ꮡࡋ࡚࠾ࡾ㸪◳ᗘࡀᑠࡉࡃ࡞ࡿ࡟ࡘࢀ࡚ࡼࡾඃࢀࡓ௙ୖࡆ㠃⢒ࡉࡀᚓ ࡽࢀࡓ㸬ࡇࢀࡣ㌾㉁࡞◊☻ࣃࢵࢻ࡛ࡣ◒⢏ࡀࣃࢵࢻ࡟ỿࡳ㎸ࡴࡓࡵ㸪◊☻ࣃࢵࢻࡢ◒⢏ಖᣢᛶࡀྥୖࡋ㸪స⏝◒ ⢏ᩘࡀቑຍࡋࡓࡇ࡜࡟ࡼࡿ࡜⪃࠼ࡽࢀࡿ㸬ࡲࡓ㸪ࣃࢵࢻ◳ᗘࡀపࡃ࡞ࡿ࡜◒⢏ษࡾ㎸ࡳ῝ࡉࡣᑠࡉࡃ࡞ࡿࡓࡵ㸪 ࡇࢀ࡟ࡼࡗ࡚ࡶ⾲㠃⢒ࡉࡣᨵၿࡉࢀࡿ㸬୍᪉㸪◊☻⬟⋡ࡣస⏝◒⢏ᩘࡢቑຍ࡜ษࡾ㎸ࡳ῝ࡉࡢపୗࡀ┦ẅࡉࢀࡿ ࡇ࡜࡟ࡼࡾ㸪ࣃࢵࢻ◳ᗘ࡟ࡼࡽࡎ࡯ࡰ୍ᐃ࡜࡞ࡗࡓ࡜⪃࠼ࡽࢀࡿ㸬 ௨ୖࡼࡾ㸪࢚࣏࢟ࢩࣃࢵࢻࡢ◳ᗘࡣ◊☻⬟⋡࡟ᙳ㡪ࢆ୚࠼࡞࠸ࡇ࡜ࢃ࠿ࡗࡓ㸬ࡋ࠿ࡋ㸪ᮏᐇ㦂࡛౑⏝ࡋࡓ◊☻ ࣃࢵࢻࡣ㸪ᶞ⬡ཎᩱ࠾ࡼࡧࡑࡢ㓄ྜẚ㸪ẼᏍ⋡࡞࡝㸪」ᩘࡢࣃ࣓࣮ࣛࢱࡀ␗࡞ࡗ࡚࠸ࡿࡓࡵ㸪᭱ࡶ◊☻≉ᛶ࡟ᐤ ୚ࡍࡿせ⣲ࢆᢳฟࡍࡿࡇ࡜ࡣᅔ㞴࡛࠶ࡿ㸬ࡑࡇ࡛㸪ᶞ⬡ࡢ㓄ྜẚࡢࡳࢆኚ໬ࡉࡏࡓ࢚࣏࢟ࢩࣃࢵࢻࢆస〇ࡋ㸪ࡑ

Fig. 2 Material removal rate and surface roughness by the urethane and epoxy resin pads as a function of pad hardness

Table 2 Composition and hardness of epoxy resin polishing pads

Pad resin type Epoxy Urethane

Product code A B C D E KSP66A

Prepolymer (wt%) 60.4 57.0 54.8 52.1 50.5

-Curing agent-X (wt%) 12.6 11.2 10.2 9.1 8.4

-Curing agent-Y (wt%) 27.0 31.8 35.0 38.8 41.1

-Hardness (type D durometer) 77.5 72.0 64.5 57.5 48.5 30.0

エポキシ樹脂研磨パッドの粘弾性と研磨特性

(12)

ࡢᶵᲔⓗ≉ᛶࢆ DMA ࢆ⏝࠸࡚ホ౯ࡋ㸪◊☻≉ᛶ࡜ࡢ㛵ಀࢆホ౯ࡍࡿࡇ࡜࡜ࡋࡓ㸬 ࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ⢓ᙎᛶࡢホ౯ ࢚࣏࢟ࢩᶞ⬡ࡣ୺๣࡜◳໬๣ࡢ✀㢮ࡸ㓄ྜẚࢆኚ໬ࡉࡏࡿࡇ࡜࡛㸪✀ࠎࡢᶵᲔⓗ≉ᛶࢆ᭷ࡍࡿ◳໬≀ࢆస〇ࡍ ࡿࡇ࡜ࡀ࡛ࡁࡿ㸬ࡑࡇ࡛㸪୺๣࠾ࡼࡧ◳໬๣ࡢ✀㢮ࡣྠ୍࡜ࡋ㸪㓄ྜẚࢆኚ໬ࡉࡏࡓ࢚࣏࢟ࢩࣃࢵࢻࢆస〇ࡋ㸪 DMA ࠾ࡼࡧ◊☻≉ᛶࡢホ౯ࢆᐇ᪋ࡋࡓ㸬స〇ࡋࡓ࢚࣏࢟ࢩࣃࢵࢻࡢ୺๣࡜◳໬๣ࡢ㓄ྜẚ㸪࡞ࡽࡧ࡟◳ᗘࢆ⾲ 2 ࡟♧ࡍ㸬౑⏝ࡋࡓ࢚࣏࢟ࢩᶞ⬡୺๣ࡣࣅࢫࣇ࢙ࣀ࣮ࣝ A ᆺࡢᾮ≧ᶞ⬡㸦୕⳻໬Ꮫ㸦ᰴ㸧㸪jer834㸧࡛࠶ࡾ㸪࢚࣏࢟ ࢩᙜ㔞ࡣ 230 g/eq ࡛࠶ࡿ㸬◳໬๣ࡣ࢔࣑ࣥ⣔࡛࠶ࡾ㸪άᛶỈ⣲ᙜ㔞ࡀ 60 g/eq㸦X ࡜ࡍࡿ㸬JEFFAMINE D-230㸪 Huntsman corp.㸧࠾ࡼࡧ 514 g/eq㸦Y ࡜ࡍࡿ㸬JEFFAMINE D-2000㸧ࡢ஧✀㢮࡛࠶ࡿ㸬࢚࣏࢟ࢩᶞ⬡୺๣㸪◳໬๣ ࢆΰྜ㸦࠸ࡎࢀࡶᙜ㔞㓄ྜ㸧ࡋ㸪150 °C ࡛ 3 ᫬㛫ຍ⇕ࢆ⾜࠺ࡇ࡜࡛㸪┤ᚄ 200 mm㸪ཌࡉ⣙ 5mm ࡢ෇┙≧◳໬≀ ࢆᚓࡓ㸬ᮏ◊✲࡛ࡣ㸪࢚࣏࢟ࢩࣃࢵࢻࡢᶞ⬡⤌ᡂ࡟ࡼࡿᙳ㡪ࡢࡳࢆホ౯ᑐ㇟࡜ࡍࡿࡓࡵ㸪ẼᏍ๣ࡣῧຍࡏࡎ↓Ẽ Ꮝࡢࣃࢵࢻࢆస〇ࡋࡓ㸬㛤Ⓨࡋࡓ࢚࣏࢟ࢩࣃࢵࢻࡣ◳໬๣ Y ࡢቑຍ࡟క࠸㸪◳ᗘࡀపୗࡍࡿࡇ࡜ࡀศ࠿ࡿ㸬

ḟ࡟㸪㛤Ⓨࡋࡓ࢚࣏࢟ࢩࣃࢵࢻࡢ DMA ホ౯ࢆ࣓࣮ࣞ࢜ࢱ 㸦HR-2㸪TA Instruments - Waters LLC㸧ࢆ⏝࠸࡚⾜ࡗ ࡓ㸬 ᐃ᮲௳ࡣ㸪ᘬᙇࡾ࣮ࣔࢻ࡛᪼ ㏿ᗘࡣ 5 °C /min ࡜ࡋ㸪࿘Ἴᩘ 1 Hz㸪ධຊṍ 0.05 %࡜ࡋࡓ㸬ࡲࡓ㸪ヨ㦂∦ ࡜ࡋ࡚ 10 × 50 mm㸪ཌࡉ 1.5 mm ࡟ษࡾฟࡋࡓ࢚࣏࢟ࢩࣃࢵࢻࢆ⏝࠸ࡓ㸬ᐇ㦂⿦⨨㸪 ᐃཎ⌮ࢆᅗ 3 ࡟♧ࡍ㸬 ࢚࣏࢟ࢩᶞ⬡ࡸ࢘ࣞࢱࣥᶞ⬡⤌ᡂ≀ࡢࡼ࠺࡞㧗ศᏊయࡣ㸪⢓ᙎᛶ࡜࠸ࢃࢀࡿᙎᛶᅛయ࡜⢓ᛶᾮయࡢ୧᪉ࡢᛶ㉁ ࢆ♧ࡍ㸬ࡑࡇ࡛ᘬᙇࡾไᚚࡉࢀ࡚࠸ࡿヨ㦂∦࡟ࢧ࢖ࣥἼࡢࡡࡌࡾṍࡳࢆධຊࡋ㸪 ᐃࡉࢀࡿᛂຊ࡜ධຊṍࡳࡢ఩ ┦ᕪį ࢆ⏝࠸࡚⢓ᙎᛶࢆホ౯ࡍࡿ㸬᏶඲ᙎᛶయࡢ఩┦ᕪ į ࡣ 0 °࡜࡞ࡾ㸪᏶඲⢓ᛶయࡢ఩┦ᕪ į ࡣ 90 °࡜࡞ࡿ㸬㧗 ศᏊࡢࡼ࠺࡞⢓ᙎᛶయࡢ఩┦ᕪį ࡣ 0 ࠿ࡽ 90 °ࡢ㛫࡜࡞ࡿ㸬ࡲࡎ㸪᫬㛫ⓗ࡞㐜ࢀࢆᣢࡗࡓṍࡳ࡜ᛂຊࡣᘧ㸦1㸧࡟ ♧ࡉࢀࡿࡼ࠺࡟」⣲ᙎᛶ⋡G*࡛⾲ࡉࢀࡿ㸬 G* = ı0 / İ0 (1) ḟ࡟㸪⢓ᙎᛶయ࡟ධຊࡉࢀࡓṍࡳ࡜ྠ఩┦ࡢᛂຊᡂศ࡛࠶ࡿ㈓ⶶᙎᛶ⋡G’࠾ࡼࡧ㸪ṍࡳࡼࡾ ʌ/2 ࡔࡅ఩┦ࡀ㐍ࢇ ࡔᛂຊᡂศ࡛࠶ࡿᦆኻᙎᛶ⋡G”ࡣࡑࢀࡒࢀᘧ㸦2㸧㸪㸦3㸧ࡢࡼ࠺࡟♧ࡉࢀࡿ㸬

(a) Appearance of DMA apparatus (b) Measurement principle of DMA Fig. 3 Experimental setup of dynamic mechanical analysis (DMA)

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G’ = G* cos į (2) G’’ = G* sin į (3) ࡲࡓ㸪ᦆኻṇ᥋ tan į ࡣᦆኻᙎᛶ⋡࡜㈓ⶶᙎᛶ⋡ࡢẚ࡛࠶ࡾ㸪ᘧ㸦4㸧࡟♧ࡉࢀࡿ㸬 tan į = G’’ / G’ (4) ᦆኻṇ᥋ tan į ࡢ್ࡀ኱ࡁ࠸≀㉁ࡣṍࡳ࡜ᛂຊࡢ఩┦ᕪࡀ኱ࡁ࠸ࡓࡵ࡟㸪ᛂ⟅ࡀ㐜ࢀࡿࡇ࡜࡜࡞ࡿ㸬୍᪉㸪tan į ࡢ್ࡀప࠸≀㉁ࡣ఩┦ᕪࡀᑠࡉ࠸ࡓࡵ࡟ᛂ⟅ࡀ᪩࠸ࡇ࡜ࢆព࿡ࡋ࡚࠸ࡿ㸬ࡲࡓ㸪tan į ࡀ᭱኱࡜࡞ࡿ ᗘࡣ࢞ࣛࢫ ㌿⛣ ᗘTg࡜ᐃ⩏ࡉࢀࡿ㸦Charns, et al., 2005㸧㸬 స〇ࡋࡓ࢚࣏࢟ࢩࣃࢵࢻࡢ DMA ホ౯⤖ᯝࢆᅗ 4 ࡟♧ࡍ㸬࢚࣏࢟ࢩࣃࢵࢻࡣ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚ DMA ≉ᛶࡀ኱ࡁࡃ␗࡞ࡿࡇ࡜ࡀศ࠿ࡿ㸬ලయⓗ࡟ࡣ㸪࢚࣏࢟ࢩࣃࢵࢻࡣᚑ᮶ࡢ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚㞺ᅖẼ ᗘ 㸦TDMA㸧ࡢୖ᪼࡟క࠸㸪㈓ⶶᙎᛶ⋡࡜ᦆኻᙎᛶ⋡ࡀ኱ࡁࡃపୗࡍࡿ㸦ᅗ 4㸦a㸧㸪㸦b㸧㸧㸬ࡲࡓ㸪ᅗ 4㸦c㸧࡟♧ࡍࡼ ࠺࡟㸪࢚࣏࢟ࢩࣃࢵࢻࡢ tan į ࡣᖖ ௜㏆࡛࢘ࣞࢱࣥࣃࢵࢻࡼࡾࡶ኱ࡁ࡞್ࢆ♧ࡍࡇ࡜ࡶศ࠿ࡿ㸬ྛ࢚࣏࢟ࢩࣃࢵ ࢻ࡟╔┠ࡍࡿ࡜㸪࢚࣏࢟ࢩᶞ⬡ࡢ◳໬๣ Y ࡢቑຍ㸦AЍCЍE ࡢ㡰㸧࡜ඹ࡟ Tgࡀప ഃ࡟⛣ືࡋ࡚࠸ࡿ㸬ࡇࢀࡣ㸪 άᛶỈ⣲ᙜ㔞ࡢ኱ࡁ࠸◳໬๣ Y ࡢቑຍ࡟ࡼࡾ㸪ᶞ⬡◳໬≀ෆࡢᯫᶫᐦᗘࡀపୗࡋ㸪ศᏊ㙐ࡢὶືᛶࡀ኱ࡁࡃ࡞ࡗ ࡓࡓࡵ࡛࠶ࡿ㸬୍᪉㸪࢘ࣞࢱࣥࣃࢵࢻࡣ ᗘ࡟ࡼࡗ࡚㈓ⶶᙎᛶ⋡ࡸᦆኻᙎᛶ⋡ࡀ࡯ࡰኚ໬ࡋ࡞࠸ࡇ࡜ࡀศ࠿ࡗࡓ㸬 4. ࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ⢓ᙎᛶ࡜◊☻⬟⋡ ๓❶࡛㏙࡭ࡓࡼ࠺࡟㸪࢚࣏࢟ࢩࣃࢵࢻࡣᚑ᮶ࡢ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚⢓ᙎᛶࡀ኱ࡁࡃ␗࡞ࡿࡇ࡜ࡀศ࠿ࡗ ࡓ㸬ࡑࡇ࡛㸪࢚࣏࢟ࢩࣃࢵࢻࡢ⢓ᙎᛶ࡜◊☻≉ᛶࡢ㛵ಀࢆㄪᰝࡍࡿ࡭ࡃ㸪࢚࣏࢟ࢩࣃࢵࢻࡢ◊☻⬟⋡ࡢホ౯ࢆ⾜ ࡗࡓ㸬ᐇ㦂᮲௳ࡣ⾲ 1 ࡜ྠᵝ࡛࠶ࡿ㸬౑⏝ࡋࡓ◊☻ࣃࢵࢻࡣ⾲ 2 ࡟♧ࡋࡓ࢚࣏࢟ࢩࣃࢵࢻ C ࠾ࡼࡧ E ࡛࠶ࡿ㸬࢚ ࣏࢟ࢩࣃࢵࢻࡢ⢓ᙎᛶࡣ ᗘ࡟ࡼࡗ࡚኱ࡁࡃኚ໬ࡋࡓࡀ㸪ࡑࡢ◊☻≉ᛶ࡬ࡢᙳ㡪ࢆㄪ࡭ࡿࡓࡵ㸪◊☻ ᗘࢆ 11㸪 22㸪33 °C ࡜ࡋ࡚◊☻≉ᛶࢆホ౯ࡋࡓ㸬ᅗ 5 ࡟♧ࡍࡼ࠺࡟㸪ᐃ┙࡜ࢫ࣮ࣛࣜࢆᜏ Ỉ࡛෭༷㸪ࡲࡓࡣࣄ࣮ࢱ࡟ࡼ ࡗ࡚ຍ⇕ࢆ⾜࠸࡞ࡀࡽ◊☻ࢆ⾜ࡗࡓ㸬ࡲࡓ㸪◊☻ࣃࢵࢻࡢ⾲㠃 ᗘTps㸦°C㸧ࢆ㉥እ⥺ᨺᑕ ᗘィ㸦㸦ᰴ㸧ᇼሙ〇 సᡤ㸪IT-540E㸧࡟ࡼࡾ ᐃࡋࡓ㸬ࣃࢵࢻ⾲㠃࡜ᕤస≀ࡀ᥋ゐࡋ࡚࠸ࡿⅬ࡟࠾࠸࡚ࡣ㸪ᦶ᧿⇕ࡀⓎ⏕ࡋࣃࢵࢻ⾲㠃 ࡢ ᗘࡀቑ኱ࡋ࡚࠸ࡿ࡜⪃࠼ࡽࢀࡿ㸦ᮡᮏ௚㸪1994㸧㸬ࣃࢵࢻ⾲㠃ࡢ ᐃⅬ࡟࠾ࡅࡿ ᗘ Tps࡟ᑐࡋ㸪◊☻Ⅼ࡛ࡢ ᗘୖ᪼ࢆĮ㸦°C㸧࡜ᐃ⩏ࡋࡓ㸬 ᅗ 6 ࡟ྛ◊☻ ᗘ࡟ࡼࡿ◊☻≉ᛶࡢホ౯⤖ᯝࢆ♧ࡍ㸬࢘ࣞࢱࣥࣃࢵࢻࡣ◊☻ ᗘ Tps࡟ᑐࡋ࡚㸪◊☻⬟⋡ࡢኚ

(a) Storage modulus (b) Loss modulus (c) tan į Fig. 4 Dynamic viscoelastic properties of the urethane and epoxy resin pads as a function of temperature

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໬ࡣᑡ࡞ࡃ࡯ࡰ୍ᐃ࡛࠶ࡗࡓ㸬ࡇࢀࡣ㸪๓❶࡛♧ࡋࡓࡼ࠺࡟㸪࢘ࣞࢱࣥࣃࢵࢻࡢ⢓ᙎᛶࡀ ᗘ࡟ࡼࡗ࡚࡯࡜ࢇ࡝ ኚ໬ࡋ࡞࠸ࡓࡵ࡛࠶ࢁ࠺㸬ࡲࡓ㸪࢞ࣛࢫࡢ◊☻≉ᛶ࡟ᙳ㡪ࢆ୚࠼ࡿせᅉ࡜ࡋ࡚ࢫ࣮ࣛࣜࡢ ᗘࡶᣲࡆࡽࢀࡿ㸦Kim, et al., 2005㸧ࡀ㸪ᮏᐇ㦂࡛ࡢ ᗘࡢ⠊ᅖ࡛ࡣ㸪ࡑࡢᙳ㡪ࡣࢃࡎ࠿࡛࠶ࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬ࡑࢀ࡟ᑐࡋ㸪࢚࣏࢟ࢩࣃ ࢵࢻࡣ㸪◊☻⬟⋡ࡀ◊☻ ᗘ Tps࡟ࡼࡗ࡚኱ࡁࡃኚ໬ࡋࡓ㸬ࡲࡓ㸪࠸ࡎࢀࡢ◊☻ ᗘ࡟࠾࠸࡚ࡶ㸪࢚࣏࢟ࢩࣃࢵ ࢻࡣ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚㧗࠸◊☻⬟⋡㸪ඃࢀࡓ௙ୖࡆ㠃⢒ࡉࡀᚓࡽࢀࡿࡇ࡜ࡀศ࠿ࡿ㸬࢚࣏࢟ࢩࣃࢵࢻ C ࡣ 22 °C㸪࢚࣏࢟ࢩࣃࢵࢻ E ࡣ 11 °C ࡟࠾࠸࡚᭱኱ࡢ◊☻⬟⋡ࢆ♧ࡋࡓ㸬ࡇࡢࡼ࠺࡟㸪ᶞ⬡ࡢ⤌ᡂ࡟ࡼࡗ࡚࢚࣏࢟ ࢩࣃࢵࢻࡢ◊☻⬟⋡࡟኱ࡁ࡞ᕪࡀ⌧ࢀࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬 ࡑࡇ࡛㸪DMA ࡟ࡼࡾᚓࡽࢀࡿࣃ࣓࣮ࣛࢱࡢ 1 ࡘ࡛࠶ࡿ tan į ࡟╔┠ࡋ◊☻⬟⋡࡜ࡢ㛵ಀࢆホ౯ࡋࡓ⤖ᯝ㸪ᅗ 7 㸦a㸧࡟♧ࡍࡼ࠺࡟㸪◊☻⬟⋡࡜ tan į ࡟ྜ⮴ࡣࡳࡽࢀ࡞࠿ࡗࡓ㸬ࡋ࠿ࡋ㸪㉥እ⥺ᨺᑕ ᗘィ࡛ ᐃࡉࢀࡓ ᗘ࡜ ຍᕤⅬ࡛ࡢ ᗘࡣ␗࡞ࡿࡓࡵ㸪ࡑࡢᙳ㡪ࢆ⪃៖ࡍࡿᚲせࡀ࠶ࡿ㸬ࡑࡇ࡛㸪◊☻⬟⋡࡜ tan į ࡀྜ⮴ࡍࡿ࡜௬ᐃࡋ㸪 ୧⪅ࡢṧᕪᖹ᪉࿴ࢆィ⟬ࡋࡓ⤖ᯝ㸪Į ࡀ 20 °C ࡢ᫬࡟᭱ᑠ࡜࡞ࡗࡓ㸦ᅗ 7㸦b㸧㸧㸬ࡼࡗ࡚㸪 ᐃ ᗘ࡟ᑐࡋ࡚ຍᕤ Ⅼࡣ 20 °C ୖ᪼ࡋ࡚࠸ࡿ࡜᥎ᐃࡋࡓ㸬᥎ᐃࡉࢀࡓ ᗘࢆ⏝࠸࡚㸪෌ᗘ㸪◊☻⬟⋡࡜ tan į ࡢ㛵ಀࢆᥥ⏬ࡋ࡚ࡳࡿ࡜㸪 ᅗ 7㸦a㸧࡟♧ࡍࡼ࠺࡟㸪Į ࡀ 0 ࡲࡓࡣ 40 °C ࡢ㝿࡟ẚ࡭࡚୧⪅࡟ྜ⮴ࡀࡳࡽࢀࡿࡇ࡜ࡀࢃ࠿ࡿ㸬 ḟ࡟㸪◊☻ ᗘࢆ 22 °C ࡜୍ᐃ࡜ࡋ㸪స〇ࡋࡓ✀ࠎࡢ࢚࣏࢟ࢩࣃࢵࢻࡢ◊☻≉ᛶ࡜ tan į ࡢ㛵ಀࢆホ౯ࡋࡓ㸬ᅗ 8 ࡟♧ࡉࢀࡿࡼ࠺࡟㸪࢚࣏࢟ࢩࣃࢵࢻࡣ඲࡚ᚑ᮶ࡢ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚㧗࠸◊☻⬟⋡ࢆ♧ࡋࡓࡀ㸪୺๣࡜ ◳໬๣ࡢ㓄ྜẚ࡟ࡼࡗ࡚㸪◊☻≉ᛶࡀ኱ࡁࡃ␗࡞ࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬ࡑࡇ࡛㸪ྛ࢚࣏࢟ࢩࣃࢵࢻࡢ◊☻⬟⋡࡜ tan

Fig. 5 Schematic view of the polishing experiment

Fig. 6 Comparison of the material removal rate and surface roughness by the urethane and epoxy pads under the different temperature conditions

(15)

į ࢆࣉࣟࢵࢺࡋࡓࡶࡢࡀᅗ 9 ࡛࠶ࡿ㸬ࡇࡢ᫬㸪Į ࡣ 20 °C ࡜ࡋ࡚࠸ࡿ㸬ᅗ࡟♧ࡉࢀࡿࡼ࠺࡟㸪✀㢮ࡢ␗࡞ࡿ◊☻ࣃ ࢵࢻࢆ౑⏝ࡋ࡚ࡶ◊☻⬟⋡࡜ tan į ࡟ࡣࡸࡣࡾᙉ࠸ṇࡢ┦㛵ࢆ♧ࡍࡇ࡜ࡀࢃ࠿ࡗࡓ㸬ᅗ 7 ࡛ࡣ㸪◊☻⬟⋡ࡀ tan į ࡟౫Ꮡࡍࡿ࡜ࡢ௬ᐃࡢࡶ࡜㸪◊☻Ⅼ࡛ࡢୖ᪼ ᗘĮ ࢆぢ✚ࡶࡗࡓࡀ㸪ᅗ 9 ࡢ⤖ᯝ࠿ࡽ㸪◊☻ ᗘࢆ୍ᐃ࡜ࡋ㸪␗ ࡞ࡿ✀㢮ࡢ࢚࣏࢟ࢩࣃࢵࢻ࡛ホ౯ࡋࡓሙྜ࡟ࡶྠᵝࡢ⤖ᯝࡀᚓࡽࢀࡓࡓࡵ㸪ࡇࡢ௬ᐃࡣጇᙜ࡛࠶ࡗࡓ࡜⤖ㄽ௜ࡅ ࡽࢀࡿ㸬 ୖグࡢࡼ࠺࡞㸪◊☻ࣃࢵࢻࡢ⢓ᙎᛶ࡜◊☻≉ᛶࡢ㛵ಀ࡟ࡘ࠸࡚⪃ᐹࢆ⾜ࡗࡓ㸬ᅗ 10㸦a㸧࡟♧ࡉࢀࡿࡼ࠺࡟㐟㞳◒⢏◊☻࡛ࡣ㸪ࣃࢵࢻୖ࡟ಖᣢࡉࢀࡓ◒⢏ࡀ㸪ᕤస≀⾲㠃ࢆᘬࡗ࠿ࡁ㸪ࡑࡢᚤᑠ࡞ษ๐స⏝࡛ᕤస≀⾲㠃ࡢ㝖 ཤࡀ㐍⾜ࡍࡿ㸬ຍᕤᇦ࡟౵ධࡋࣃࢵࢻୖ࡟ಖᣢࡉࢀࡓ◒⢏ࡣ㸪ᕤస≀࠿ࡽࡢᅽຊ࡟ࡼࡗ࡚◊☻ࣃࢵࢻ࡟ỿࡳ㎸ࡳ ࡞ࡀࡽᕤస≀ࢆ㝖ཤࡍࡿ㸬ࡲࡓࡇࡢ᫬㸪◊☻ࣃࢵࢻࡣᕤస≀ࡸ◒⢏࠿ࡽ㈇Ⲵࢆཷࡅᅽ⦰ࡉࢀࡿ㸬ᅗ 10㸦b㸧࡟♧ ࡍࡼ࠺࡟㸪ᕤస≀ࡀ⛣ືࡋࡓᚋ࡟㸪◊☻ࣃࢵࢻࡣᕤస≀࠿ࡽཷࡅ࡚࠸ࡓⲴ㔜࠿ࡽゎᨺࡉࢀࡿࡓࡵ㸪◊☻ࣃࢵࢻࡢ ኚ఩ࡀᅇ᚟ࡍࡿ㸬ࡇࡢ᫬ tan į ࡢ್ࡀᑠࡉ࠸◊☻ࣃࢵࢻࡣ㸪◊☻ࣃࢵࢻࡢኚ఩ࡢᅇ᚟ࡀ᪩ࡃ◒⢏ࡀࣃࢵࢻ⾲㠃ୖ࠿ ࡽ㞳ࢀࢫ࣮ࣛࣜ୰࡟ᾋ㐟ࡍࡿ㸬୍᪉㸪tan į ࡢ್ࡀ኱ࡁ࠸◊☻ࣃࢵࢻࡣࣃࢵࢻࡢኚ఩ࡢᅇ᚟ࡀ㐜࠸ࡓࡵ࡟㸪ከࡃࡢ ◒⢏ࡀಖᣢࡉࢀࡓ≧ែ࡛ࣃࢵࢻ⾲㠃ୖ࡟ṧ␃ࡍࡿ࡜⪃࠼ࡽࢀࡿ㸬ࡇ࠺ࡋ࡚ಖᣢࡉࢀࡓ◒⢏ࡣ㸪ḟ࡟ᕤస≀࡜◊☻ ࣃࢵࢻࡀ᥋ゐࡍࡿ㝿࡟ࡶࣃࢵࢻୖ࡟ಖᣢࡉࢀࡓࡲࡲ࡛࠶ࡾ㸪ࡇࡢ◒⢏ࡀᕤస≀⾲㠃ࢆ㝖ཤࡍࡿࡇ࡜࡜࡞ࡿ㸬ᅗ 10 ࡛ࡣ㸪ᕤస≀⾲㠃ࡢพฝࡀ◒⢏ࡼࡾࡶᑠࡉࡃᥥ࠸࡚࠸ࡿࡀ㸪ᐇ㝿ࡢᕤస≀⾲㠃ࡣ◒⢏ࡼࡾࡶ኱ࡁ࡞พฝࡀ࠶ࡾ㸪

Fig. 7 (a) Temperature dependence of the material removal rate and tan į of the epoxy resin pad (C). (b) Residual sum of squares (RSS) between the material removal rate and tan į of the epoxy resin pad (C) as a function of the increased temperature Į.

Fig. 8 Comparison of the material removal rate and the surface roughness by the different type of epoxy resin pads

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◊☻ࣃࢵࢻࡢᅽ⦰࡜ࡑࡢ㛤ᨺࡣ 1 ࡘࡢᕤస≀ෆ࡟࠾࠸࡚㸪▷࠸࿘ᮇ࡛⧞ࡾ㏉ࡉࢀ࡚࠸ࡿ㸬tan į ࡢ್ࡀ㧗࠸◊☻ࣃ ࢵࢻࡣ◒⢏ࡢಖᣢᛶࡀ㧗ࡃ㸪ຍᕤᇦ࡟ከࡃࡢ◒⢏ࡀᏑᅾࡍࡿࡇ࡜࡜࡞ࡾ㸪㧗࠸◊☻⬟⋡ࡀᚓࡽࢀࡓ࡜⪃࠼ࡽࢀࡿ㸬 5. ࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ◊☻≉ᛶࡢຍᕤ᮲௳౫Ꮡᛶ ␗࡞ࡿ⢓ᙎᛶࢆ᭷ࡍࡿ஧✀㢮ࡢ࢚࣏࢟ࢩࣃࢵࢻ㸦C㸪E㸧ࢆ⏝࠸࡚㸪◊☻≉ᛶࡢຍᕤ᮲௳౫Ꮡᛶࢆホ౯ࡋࡓ㸬ᮏ ᐇ㦂࡛ࡣ㸪ᐃ┙ᚄ 380 mm ࡢ∦㠃◊☻⿦⨨㸦SPL-15F㸪㸦ᰴ㸧ᒸᮏᕤసᶵᲔ〇సᡤ㸧㸪ᐃ┙/ᕤస≀ᅇ㌿ᩘࡣ 60 rpm ࡟ኚ᭦ࡋ㸪ࡑࡢ௚ࡢᐇ㦂᮲௳ࡣ⾲ 2 ࡜ྠᵝ࡛࠶ࡿ㸬 ࡲࡎ㸪◊☻᫬㛫࡜ᕤస≀⾲㠃⢒ࡉࡢ㛵ಀࢆホ౯ࡋࡓࡶࡢࡀᅗ 11 ࡛࠶ࡿ㸬࢘ࣞࢱࣥࣃࢵࢻࡣ 15 ศ⛬ᗘ࡛⾲㠃⢒ ࡉࡀ㣬࿴ࡋࡓࡢ࡟ᑐࡋ㸪࢚࣏࢟ࢩࣃࢵࢻ C㸪E ࡣ 5 ศ⛬ᗘ࡜ࡼࡾ▷࠸◊☻᫬㛫࡛฿㐩⢒ࡉ࡟㐩ࡋࡓ㸬ࡲࡓ㸪◊☻ ᫬㛫 5 ศᚋ࡟ὀ┠ࡍࡿ࡜࢚࣏࢟ࢩࣃࢵࢻ C ࡣ࡝ࡢ◊☻ࣃࢵࢻࡼࡾࡶඃࢀࡓ௙ୖࡆ㠃⢒ࡉࡀᚓࡽࢀࡿࡇ࡜ࡀศ࠿ࡿ㸬 ࡇࡢࡼ࠺࡟㸪tan į ࡢ್ࡀ㧗࠸◊☻ࣃࢵࢻࡣ◒⢏ࡢಖᣢᛶ࡟ඃࢀ࡚࠸ࡿࡓࡵ࡟㸪ከࡃࡢస⏝◒⢏ᩘࡀᚓࡽࢀ◊☻᫬ 㛫ࡢ▷⦰ࡸ▷᫬㛫࡛ඃࢀࡓ௙ୖࡆ㠃⢒ࡉࡀᚓࡽࢀࡿ㸬⤖ᯝ࡜ࡋ࡚㸪࢘ࣞࢱࣥࣃࢵࢻࡢ 15 ศ◊☻ᚋ࡜㸪࢚࣏࢟ࢩࣃ ࢵࢻ C ࡢ 5 ศ◊☻ᚋࡢ࢞ࣛࢫ⾲㠃ࡢ௙ୖࡆ㠃⢒ࡉࡀ࡯ࡰྠ➼࡞ࡇ࡜࠿ࡽ㸪࢚࣏࢟ࢩࣃࢵࢻ C ࢆ౑⏝ࡍࡿࡇ࡜࡛◊ ☻᫬㛫ࢆ⣙ 3 ศࡢ 1 ࡟ࡍࡿࡇ࡜ࡀྍ⬟࡛࠶ࡿࡇ࡜ࡀ☜ㄆࡉࢀࡓ㸬 ḟ࡟㸪◒⢏⃰ᗘ࠾ࡼࡧᅇ㌿㏿ᗘࡀ࢚࣏࢟ࢩࣃࢵࢻࡢ◊☻≉ᛶ࡟୚࠼ࡿᙳ㡪࡟ࡘ࠸࡚ホ౯ࡋࡓ㸬ᐇ㦂᮲௳࡜ࡋ࡚㸪 ᐃ┙ᅇ㌿ᩘ 60 rpm㸪◒⢏⃰ᗘ 3 wt%ࢆᇶᮏ᮲௳࡜ࡋ㸪ࡑࢀࡒࢀࢆ⊂❧࡟ኚ໬ࡉࡏ◊☻≉ᛶࢆホ౯ࡋࡓ㸬ᅗ 12㸦a㸧 ࡟ࢫ࣮ࣛࣜ୰ࡢ㓟໬ࢭ࣒ࣜ࢘◒⢏⃰ᗘ࡜◊☻⬟⋡ࡢ㛵ಀࢆ♧ࡍ㸬㛤Ⓨࡋࡓ࢚࣏࢟ࢩࣃࢵࢻࡣ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ ㍑ࡋ࡚඲࡚ࡢ◒⢏⃰ᗘ࡟࠾࠸࡚㧗࠸◊☻⬟⋡ࡀᚓࡽࢀࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬࢚࣏࢟ࢩࣃࢵࢻࡣࡸࡣࡾ tan į ࡀ኱ࡁ࠸

Fig. 9 Relationship between the material removal rate and tan į of the polishing pads

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ࡓࡵ◒⢏ࡢಖᣢᛶࡀ㧗ࡃ㸪ప◒⢏⃰ᗘࡢࢫ࣮ࣛࣜ࡟࠾࠸࡚ࡶከࡃࡢస⏝◒⢏ᩘࡀᚓࡽࢀࡿࡓࡵ࡛࠶ࡿ࡜⪃࠼ࡽࢀ ࡿ㸬࢚࣏࢟ࢩࣃࢵࢻ C ࡣ E ࡜ẚ㍑ࡋ࡚㧗࠸◊☻⬟⋡ࡀᚓࡽࢀࡓࡀ㸪9 wt%ࡢ㧗◒⢏⃰ᗘ࡛ࡣ࡯ࡰྠ➼ࡢ◊☻⬟⋡ ࡛࠶ࡗࡓ㸬◒⢏⃰ᗘࡀቑຍࡍࡿ࡜ࢫ࣮ࣛࣜ୰ࡢ◒⢏㛫㝸ࡀᑠࡉࡃ࡞ࡾ㸪◒⢏ྠኈࡀ஫࠸ࡢືࡁࢆጉࡆࡿࡓࡵ㸪ࣃ ࢵࢻࡢ tan į ࡟ࡼࡽࡎ◒⢏ࡢ⁫␃ᛶࡀ㧗ࡃ࡞ࡿࡇ࡜ࡀせᅉ࡛࠶ࡿ㸬࢘ࣞࢱࣥࣃࢵࢻࡣ㸪ࢫ࣮ࣛࣜぶ࿴ᛶ࡟ஈࡋ࠸ࡇ ࡜࠿ࡽ㸪㧗࠸◒⢏⃰ᗘ࡛ࡶຍᕤᇦ࡟༑ศ࡞ࢫ࣮ࣛࣜࡀ౪⤥ࡉࢀ࡞࠸ࡓࡵ㸪࢚࣏࢟ࢩࣃࢵࢻ࡟ẚ࡭࡚ప࠸◊☻⬟⋡ ࢆ♧ࡋࡓ࡜⪃࠼ࡽࢀࡿ㸬⤖ᯝ࡜ࡋ࡚࢚࣏࢟ࢩࣃࢵࢻ C ࡢ◒⢏⃰ᗘ 0.5 wt%ࡢ◊☻⬟⋡࡜࢘ࣞࢱࣥࣃࢵࢻࡢ◒⢏⃰ ᗘ 9 wt%ࡢ◊☻⬟⋡ࡀ࡯ࡰྠ➼ࡢࡇ࡜࠿ࡽ㸪࢚࣏࢟ࢩࣃࢵࢻ C ࢆ౑⏝ࡍࡿࡇ࡜࡛౑⏝◒⢏ࢆ⣙ 94%పῶ࡛ࡁࡿࡇ ࡜ࡀྍ⬟࡛࠶ࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬 ᅇ㌿㏿ᗘࡀ◊☻⬟⋡࡟୚࠼ࡿᙳ㡪ࢆ♧ࡋࡓࡶࡢࡀᅗ 12㸦b㸧࡛࠶ࡿ㸬ప࠸ᐃ┙ᅇ㌿㏿ᗘ࡛ࡣ◒⢏ࡲࡓࡣࢫࣛࣜ ࣮࡟స⏝ࡍࡿ㐲ᚰຊࡀᑠࡉࡃ㸪◊☻ࣃࢵࢻࡢ✀㢮࡟ࡼࡽࡎ༑ศ࡞స⏝◒⢏ᩘࡀᚓࡽࢀࡿࡓࡵ㸪࢘ࣞࢱࣥࣃࢵࢻ࡜ ࢚࣏࢟ࢩࣃࢵࢻ࡛ࡣ◊☻≉ᛶ࡟኱ࡁ࡞ᕪ␗ࡀ⌧ࢀ࡞࠸㸬ᐃ┙ᅇ㌿㏿ᗘࢆ㧗ࡃࡍࡿ࡜㸪◒⢏࡜ᕤస≀ࡢ┦ᑐ㏿ᗘࡀ ୖࡀࡾ◊☻⬟⋡ࡣྥୖࡍࡿ㸬୍᪉㸪ᐃ┙ᅇ㌿㏿ᗘࡢቑຍ࡟క࠸◒⢏࡟స⏝ࡍࡿ㐲ᚰຊࡀ኱ࡁࡃ࡞ࡿࡓࡵ㸪◒⢏ࡢ ⁫␃ᛶࡀపୗࡍࡿ㸬◒⢏ࡢಖᣢᛶࡢᝏ࠸࢘ࣞࢱࣥࣃࢵࢻࡣ 30 rpm ௨ୖࡢᅇ㌿㏿ᗘ࡛ࡣ㸪◊☻⬟⋡ࡀ࡯ࡰ㣬࿴ࡋ࡚ ࠸ࡿࡇ࡜ࡀࢃ࠿ࡿ㸬୍᪉㸪࢚࣏࢟ࢩࣃࢵࢻ C ࡣ◒⢏ࡢಖᣢᛶࡀ㧗࠸ࡓࡵ࡟㸪㧗ᅇ㌿㏿ᗘ᮲௳࡟࠾࠸࡚ࡶ༑ศ࡞స ⏝◒⢏ᩘࡀᚓࡽࢀ㸪㏻ᖖࡢ࢘ࣞࢱࣥࣃࢵࢻࡸ࢚࣏࢟ࢩࣃࢵࢻ E ࡜ẚ㍑ࡋ࡚㧗࠸◊☻⬟⋡ࡀᚓࡽࢀࡓ࡜⪃࠼ࡽࢀࡿ㸬

Fig. 11 The surface roughness of workpieces as a function of polishing time

(a) Effect of abrasive concentration (b) Effect of Rotation rate Fig. 12 Relationship between the material removal rate and polishing conditions

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6. ⤖ ㄒ ᮏ◊✲࡛ࡣ㸪࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢᶵᲔⓗ≀ᛶ್࡛࠶ࡿ⢓ᙎᛶ࡟╔┠ࡋ◊☻≉ᛶ࡜ࡢ㛵ಀࢆㄪᰝࡋࡓ㸬ࡲ ࡓ㸪◊☻≉ᛶࡢຍᕤ᮲௳౫Ꮡᛶࢆホ౯ࡋࡓ㸬௨ୗ࡟㸪ᮏ◊✲࡛ᚓࡽࢀࡓ⤖ᯝ࡟ࡘ࠸࡚ࡲ࡜ࡵࡿ㸬㸦1㸧ᶞ⬡ࡢཎᩱ㓄ྜẚࢆኚ໬ࡉࡏࡓ࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࢆస〇ࡋ㸪ືⓗ⢓ᙎᛶホ౯ࢆ⾜ࡗࡓ⤖ᯝ㸪ᚑ᮶ࡢ࢘ ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚㸪኱ࡁ࡞ tan į ࢆ♧ࡍࡇ࡜ࡀࢃ࠿ࡗࡓ㸬 㸦2㸧࢚࣏࢟ࢩࣃࢵࢻࡢ◊☻⬟⋡࡜ tan ࡀྜ⮴ࡍࡿ࡜ࡢ௬ᐃࡋ㸪ຍᕤⅬ࡟࠾ࡅࡿ◊☻ࣃࢵࢻࡢ ᗘࢆぢ✚ࡶࡗࡓ⤖ ᯝ㸪 ᐃ ᗘ࡟ᑐࡍࡿຍᕤⅬ࡛ࡢ ᗘୖ᪼ࡣ 20 ºC ࡜᥎ᐃࡉࢀࡓ㸬 㸦3㸧␗࡞ࡿᶞ⬡⤌ᡂࡢ࢚࣏࢟ࢩࣃࢵࢻࡢ◊☻≉ᛶࢆホ౯ࡋ㸪᥎ᐃࡉࢀࡓୖ᪼ ᗘ࡟࠾࠸࡚◊☻⬟⋡࡜ tan į ࡢ㛵 ಀࢆㄪ࡭ࡓ⤖ᯝ㸪୧⪅ࡢ㛫࡟ṇࡢ┦㛵㛵ಀࡀㄆࡵࡽࢀࡓ㸬㸦4㸧࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡣ࢘ࣞࢱࣥᶞ⬡◊☻ࣃࢵࢻ࡜ẚ㍑ࡋ࡚▷࠸◊☻᫬㛫࡛฿㐩⢒ࡉ࡟㐩ࡋ㸪࠿ࡘඃࢀࡓ ௙ୖࡆ㠃⢒ࡉࡀᚓࡽࢀࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬㸦5㸧࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡣప◒⢏⃰ᗘ㸪㧗ᅇ㌿㏿ᗘࡢ᮲௳࡟࠾࠸࡚ࡶඃࢀࡓ◊☻⬟⋡ࡀᚓࡽࢀࡿࡇ࡜ࡀศ࠿ ࡗࡓ㸬ࡲࡓ㸪ᚑ᮶ࡢ࢘ࣞࢱࣥࣃࢵࢻ࡜ẚ㍑ࡋ࡚◒⢏౑⏝㔞ࢆ⣙ 94 %పῶ࡛ࡁࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬 ᩥ ⊩

Charns, L., Sugiyama, M. and Philipossian, A., Mechanical properties of chemical mechanical polishing pads containing water-soluble particles, thin solid film, Vol. 485 (2005) , pp. 188-193.

୍ᘕ✑ ┤⪽㸪ᒣཱྀ㞝ஓ㸪Ḉ஭೺⾜㸪㇂ Ὀᘯ㸪㔠 Ὀඖ㸪Ὑίᛶࢆ⪃៖ࡋࡓ」ྜ◒⢏ࡢ㛤Ⓨ࡜ࡑࡢ◊☻≉ᛶ㸪 ᪥ᮏᶵᲔᏛ఍ㄽᩥ㞟 C ⦅㸪Vol. 75㸪No. 757 (2009)㸪pp. 2429-2434㸬

ụ⏣ ὒ㸪㉥ୖ㝧୍㸪␇⏣㐨㞝㸪኱す ಟ㸪㯮Ἑ࿘ᖹ㸪ᅵ⫧ಇ㑻㸪㟁⏺◒⢏ไᚚᢏ⾡ࢆ㐺⏝ࡋࡓ࢞ࣛࢫᇶᯈࡢ㧗 ຠ⋡◊☻ᢏ⾡ࡢ㛤Ⓨ̾㟁⏺ࡀࢫ࣮ࣛࣜᣲື࡜࢞ࣛࢫࡢ◊☻≉ᛶ࡟ཬࡰࡍᙳ㡪̾㸪⢭ᐦᕤᏛ఍ㄅ㸪Vol. 77, No. 10 (2011)㸪pp. 960-965.

Kim, N-H., Seo, Y-J. and Lee, W-S., Effects of Silica Slurry Temperature on Chemical Mechanical Polishing for Tetraethyl Orthosilicate Film, Japanese Journal of Applied Physics, Vol. 44, No. 40 (2005) , pp. L1256-L1258.

ᮧ⏣㡰஧㸪㇂ Ὀᘯ㸪ᗈᕝⰋ୍㸪㔝ᮧಙᖾ㸪ᙇ Ᏹ㸪Ᏹ㔝⣧ᇶ㸪࢞ࣛࢫ◊☻⏝ከᏍ㉁࢚࣏࢟ࢩᶞ⬡◊☻ࣃࢵࢻࡢ 㛤Ⓨ㸪᪥ᮏᶵᲔᏛ఍ㄽᩥ㞟 C ⦅㸪Vol. 77, No. 777 (2011)㸪pp. 2153-2161. 㡲⏣⪷୍㸪ࢼࣀศᩓ໬࡟ࡼࡿ࢞ࣛࢫ◊☻ᮦࡢ㛤Ⓨ㸪࣐ࢸࣜ࢔ࣝ࢖ࣥࢸࢢ࣮ࣞࢩࣙࣥ㸪Vol. 25, No. 6㸦2012㸧, pp. 45-50. ᮡᮏᩥ฼㸪㖝 ᏹ┿㸪᭷ᮏྜྷᘯ㸪ఀ⸨㝯ྖ㸪㓟໬⭷ CMP ࡟࠾ࡅࡿ࢚࢘ࣁ ᗘࡢ in situ ࣔࢽࢱࣜࣥࢢ㸪㟁Ꮚ᝟ሗ ㏻ಙᏛ఍ᢏ⾡◊✲ሗ࿌㸪Vol. 94, No.194 (1994)㸪pp.1-6 ᒣᓮ ດ㸪ᅵ⫧ಇ㑻㸪㯮Ἑ࿘ᖹ㸪኱す ಟ㸪␇⏣㐨㞝㸪ᱵᓮὒ஧㸪ᒣཱྀ㟹ⱥ㸪ᓊ஭㈆ᾈ㸪㓟໬ࢭ࣒ࣜ࢘࡜ࡑࡢ௦ ᭰ࢆ┠ᣦࡍ㓟໬࣐ࣥ࢞ࣥ⣔ࢫ࣮ࣛࣜ࡟ࡼࡿ࢞ࣛࢫᇶᯈࡢ◊☻≉ᛶ࡜ࡑࡢຍᕤ࣓࢝ࢽࢬ࣒㸪⢭ᐦᕤᏛ఍ㄅ㸪Vol. 77, No. 12 (2011)㸪pp. 1146-1150.

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㟁╔ᕤල⏝ࡢ㒊ศ 1L ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ㛤Ⓨ

ᙇ Ᏹ

1)

_{㸪㇂ Ὀᘯ}

1)

_㸪

_ᮧ⏣㡰஧

2)

᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

Development of partially Ni-coated diamond abrasives for electroplated

tools

Yu ZHANG

1)

_,

_{Yasuhiro TANI}

1)

_{and Junji MURATA}

2)

Electroplated diamond tools are developed for grinding hard and brittle materials because of its low wear resistance. To improve the grinding performance of diamond tools, a single layer of diamond abrasives is electroplated on the tool body. The electroplating process delivers a homogeneous layer with diamonds embedded in nickel alloy at high speed. In order to facilitate the adhesion of diamond abrasives, the diamond abrasives are coated by nickel membrane. Therefore, the cutting edges of diamond abrasives are hidden and the grinding performance of diamond tools decreases. Moreover, a phenomenon of abrasive aggregation generates and leads to bad abrasive distribution. In this paper, in order to solve those problems, authors developed partially Ni-coated diamond abrasives, which were produced from the commercially available full Ni-coated diamond abrasives. The adhesion characteristics of partially Ni-coated diamond abrasives were discussed, too. The grind-abilities of diamond tools, which are fabricated with using non-coated diamond abrasives, Ni-coated diamond abrasives and partially Ni-coated diamond abrasives, have been evaluated. As the results, the problems when using non-coated diamond abrasives or Ni-coated diamond abrasives could be solved and the grind-abilities of electroplated tools were improved with using partially Ni-coated diamond abrasives. Key Words : Diamond tool, Abrasive grain, Electroplating, Grinding force, Abrasive distribution, Tool life

᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

1)

_{❧࿨㤋኱Ꮫ⌮ᕤᏛ㒊ᶵᲔᕤᏛ⛉}

2)

_{㏆␥኱Ꮫ⌮ᕤᏛ㒊ᶵᲔᕤᏛ⛉}

1)

_{Department of Mechanical Engineering, Ritsumeikan University,}

Kusatsu, Shiga, 525-8577, Japan

2)

_{Department of Mechanical Engineering, Kinki University,}

Higashiosaka, Osaka, 577-8502, Japan

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⥴ ゝ

ୡ⏺ࡢ࢚ࢿࣝࢠ࣮ᨻ⟇࡟࠾ࡅࡿኴ㝧ගⓎ㟁ࡢ㔜せᛶࡣ㏆ᖺࡲࡍࡲࡍ㧗ࡲࡗ࡚࠸ࡿ㸬⤖ᬗ⣔ࢩࣜࢥࣥኴ㝧㟁ụ࡟ ౑ࢃࢀࡿࢩࣜࢥ࢙࣮ࣥ࢘ࣁࡣ࣐ࣝࢳ࣡࢖ࣖࢯ࣮࡛ࢩࣜࢥࣥ࢖ࣥࢦࢵࢺࢆࢫࣛ࢖ࢩࣥࢢຍᕤࡍࡿࡇ࡜࡟ࡼࡾ〇㐀ࡉ ࢀࡿ㸬ࢫࣛ࢖ࢩࣥࢢຍᕤᕤ⛬࡟࠾࠸࡚ࡣ㸪ࣆ࢔ࣀ⥺ࢆ㧗㏿㉮⾜ࡉࡏ࡞ࡀࡽຍᕤᾮ࡟ GC ◒⢏ࢆᠱ⃮ࡉࡏࡓࢫࣛࣜ ࣮ࢆ࠿ࡅࡿ◊☻ษ᩿ἲ࡜ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆࣆ࢔ࣀ⥺࡟㟁╔ࡋࡓࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࢆ㉮⾜ࡉࡏ࡚Ỉ⁐ᛶ◊ ๐ᾮࡢࡳࢆ࠿ࡅࡿ◊๐ษ᩿ἲࡀ࠶ࡿ㸦Webster and Tricard, 2004㸧㸬◊๐ษ᩿᪉ᘧࡣ◊☻ษ᩿᪉ᘧ࡟ẚ࡭࡚ 2㹼3 ಸ ⛬ᗘࡢษ᩿⬟ຊࢆ᭷ࡍࡿࡓࡵ㸪⌧ᅾࢩࣜࢥࣥ㸪ࢧࣇ࢓࢖࢔㸪SiC ࡞࡝ࡢ◳⬤ᮦᩱࡢษ᩿࡟◊๐ษ᩿᪉ᘧࡢᬑཬࡀ 㐍ࢇ࡛࠸ࡿ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀ᕤ⛬࡛ࡣ㸪◒⢏ࡢᯒฟ㏿ᗘ࡜◒⢏ࡢಖᣢຊࢆྥୖࡍࡿࡓࡵ࡟୍ ⯡ⓗ࡟ࢽࢵࢣࣝ࡞࡝ࡢ㔠ᒓ⓶⭷ࡀ⿕そࡉࢀࡓᑟ㟁ᛶࢆ᭷ࡍࡿࢲ࢖ࣖࣔࣥࢻ◒⢏ࡀ౑⏝ࡉࢀ࡚࠸ࡿ㸦༓ⴥ௚㸪2003㸧㸬 ୍᪉㸪࢞ࣛࢫ㸪ࢭ࣑ࣛࢵࢡࢫ➼ࡢ◳⬤ᮦᩱࡢ◊๐࡟ࡣᙧ≧⢭ᗘ㸪⪏ᦶ⪖ᛶ࡟ඃࢀࡓ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣍࢖࣮ࣝࡀ ࡼࡃ฼⏝ࡉࢀ࡚࠸ࡿ㸦๓⏣㸪2013㸧㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣍࢖࣮ࣝ࡟ࡘ࠸࡚ࡣ୍⯡ⓗ࡟◒⢏ࢆࡵࡗࡁᾮ୰࡟ᠱ⃮ࡋඹ ᯒࡉࡏࡿࡵࡗࡁἲࡸ◒⢏ࢆỿ㝆ࡉࡏ࡚ᯒฟ㔠ᒓ࡟ࡼࡾ⢏Ꮚࢆᇙࡵ㎸ࢇ࡛࠸ࡃỿ㝆ඹᯒἲ࡞࡝ࡢ᪉ἲ㸦ᴮᮏ௚㸪1989㸧 ࡛〇㐀ࡉࢀ㸪◒▼ࡢษࢀ࿡ࢆ㧗ࡵࡿࡓࡵ㔠ᒓ⿕そࡢ࡞࠸ࢲ࢖ࣖࣔࣥࢻ◒⢏ࡀ౑⏝ࡉࢀ࡚࠸ࡿ㸬୍⯡࡟㟁╔ᕤලࡢ ┠❧࡚ࢆ⾜࠺ࢻࣞࢵࢩࣥࢢసᴗ࡟࠾࠸࡚ࡣ㸪◳࠸㔠ᒓ⤖ྜ๣ࡀ౑⏝ࡉࢀ࡚࠸ࡿࡓࡵࢻࣞࢵࢩࣥࢢసᴗࡀᅔ㞴࡛࠶ ࡿ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢࢻࣞࢵࢩࣥࢢࡣ⣽࠸࣡࢖ࣖࡢ෇࿘࡟࠾ࡅࡿ඲࡚ࡢ⟠ᡤࢆࢻࣞࢵࢩࣥࢢࡍࡿᚲ せࡀ࠶ࡾ㸪ࡼࡾ୍ᒙ㞴ࡋࡃ࡞ࡿ㸬ࡑࡢࡓࡵ㸪ࢻࣞࢵࢩࣥࢢࢆᚲせ࡜ࡋ࡞࠸㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㛤Ⓨࡀ ᮇᚅࡉࢀ࡚࠸ࡿ㸬 ࡑࢀࢆᐇ⌧ࡍࡿࡓࡵ࡟ⴭ⪅ࡽࡣࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ⾲㠃≧ែ࡜◒⢏ࡢᕤලྎ㔠࡬ࡢᯒฟ≧ែ࡜ࡢ㛵㐃ᛶ࡟ὀ┠ ࡋ࡚࠸ࡿ㸬ᮏ◊✲࡛ࡣࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ୍㒊ศࡢࡳࡀ Ni ⓶⭷࡛そࢃࢀࡓ㒊ศ Ni ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆᥦ᱌ ࡍࡿ㸬ࡇࡢ◒⢏ࢆ௒ᚋ㒊ศ Ni ⿕そ◒⢏࡜⛠ࡍࡿ㸬ࡇࢀ࡟ᑐࡋ࡚㏻ᖖࡢ඲㠃ࡀ Ni ࡛⿕そࡉࢀࡓ◒⢏ࢆ඲㠃 Ni ⿕そ ◒⢏࡜⛠ࡍࡿ㸬ࡑࡢ㒊ศ Ni ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ㟁╔ᕤලẕᮦ࡬ࡢᯒฟ≧ែ࡟ࡘ࠸᳨࡚ウࡋࡓ㸬ࡑࡋ࡚㸪඲㠃 Ni ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏࠾ࡼࡧ㠀㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏࡜ẚ㍑ࡋ࡞ࡀࡽ㸪ヨసࡋࡓ㒊ศ Ni ⿕そࢲ࢖ࣖࣔࣥ ࢻ◒⢏ࢆ⏝࠸ࡓ㝿ࡢ㟁╔ᕤලࡢ〇㐀᮲௳ࢆ᳨ウࡋࡓ㸬⿕そ≧ែࢆኚ࠼ࡓྛ✀◒⢏ࢆ⏝࠸࡚స〇ࡋࡓ㟁╔ᕤලࢆ౑ ⏝ࡋ㸪◳⬤ᮦᩱࢆ௦⾲ࡍࡿࢩࣜࢥࣥ࡜࢞ࣛࢫࡢ◊๐ᐇ㦂ࢆ⾜࠸㸪◊๐᢬ᢠ࡟ࡼࡾ㟁╔ᕤලࡢษࢀ࿡ࢆホ౯ࡋࡓ㸬 ࡑࡢ⤖ᯝ㸪㛤Ⓨࡋࡓ㒊ศ Ni ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆ౑⏝ࡋࡓሙྜ㸪㠀㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࡼࡾ㟁╔ᕤලୖ ࡢ◒⢏ಖᣢຊࡀ㧗ࡃ㸪඲㠃 Ni ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࡼࡾษࢀ࿡ࡀඃࢀࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡓࡢ࡛ሗ࿌ࡍࡿ㸬㒊ศ㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢᥦ᱌ ⌧ᅾ㸪㟁╔ࢲ࢖ࣖࣔࣥࢻᕤලࡢ〇㐀࡟࠾࠸࡚ࡣࡵࡗࡁᾮ࡟ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆᠱ⃮ࡉࡏࡓ㟁Ẽࢽࢵࢣࣝ」ྜࡵ ࡗࡁἲࡀ⏕⏘⌧ሙ࡛ࡼࡃ฼⏝ࡉࢀ࡚࠸ࡿ㸬㟁╔ᕤලࢆ〇㐀ࡍࡿሙྜ࡟ࡣ㸪◒⢏ࡢษࢀ࿡ࢆ⪃៖ࡋ࡚㠀㔠ᒓ⿕そࡢ ࢲ࢖ࣖࣔࣥࢻ◒⢏ࡀከ⏝ࡉࢀ࡚࠸ࡿ㸬ࡵࡗࡁᒙࡢ↝ࡅࢆ⏕ࡌࡉࡏ࡞࠸ࡓࡵ࡟ࡇࡢ」ྜࡵࡗࡁᕤ⛬࡛ࡣ㟁ὶᐦᗘࢆ 1 kA/m2_{௨ୗ࡜పࡃタᐃࡉࢀ࡚࠾ࡾ㸪㟁╔㏿ᗘࡀ㐜࠸㸬ࡉࡽ࡟㸪ᑟ㟁ᛶࡢ࡞࠸ࢲ࢖ࣖࣔࣥࢻ◒⢏ࡀ౑⏝ࡉࢀ࡚࠸} ࡿࡓࡵ㸪◒⢏࡜ࡵࡗࡁᒙࡢᐦ╔ᛶࡀపࡃ࡞ࡿ㸬ࡑࡇ࡛㸪㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල࡛ࡣ㸪◒⢏࡜ࡵࡗࡁᒙ࡜ࡢ ᐦ╔ᛶࡸඹᯒ⋡ࢆྥୖࡍࡿࡓࡵ㸪㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࡀ⏝࠸ࡽࢀ࡚࠸ࡿ㸬㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆ౑ ⏝ࡍࡿࡇ࡜࡟ࡼࡾ㸪ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆᕤලྎ㔠࡟ᯒฟࡍࡿ」ྜࡵࡗࡁᕤ⛬ࡢ᫬㛫ࡀ▷⦰࡛ࡁ㸪㟁╔ᕤලࡢ〇㐀㏿ᗘࢆⴭࡋࡃྥୖࡉࡏࡿࡇ࡜ࡀ࡛ࡁࡿ㸬ࡋ࠿ࡋ㸪㔠ᒓ⿕そ◒⢏ࢆ౑⏝ࡍࡿ࡜✺ฟࡋࡓ◒⢏ඛ➃࡟ࡵࡗࡁࡀከࡃᯒ ฟࡍࡿࡓࡵ㟁╔ᕤලࡢษࢀ࿡ࡀపୗࡋ࡚ࡋࡲ࠺㸬ࡲࡓ㸪」ྜࡵࡗࡁࢆ⾜࠺㝿࡟◒⢏ࡢจ㞟ඹᯒࡀ㢧ⴭ࡜࡞ࡿ㸬ࡑ ࡇ࡛㸪ⴭ⪅ࡽࡣ㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏࡜㠀㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ࣓ࣜࢵࢺࢆά࠿ࡍࡇ࡜ࡀ࡛ࡁ㸪」ྜ ࡵࡗࡁᾮ୰࡛ప࠸◒⢏⃰ᗘ࡛ࡶ◒⢏ࡢᯒฟࡀ㏿ࡃ㸪ษࢀ࿡ࡀඃࢀࡿᕤලࡢᐇ⌧ࡢࡓࡵ㸪ࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ୍㒊 ศࡢࡳࡀ㔠ᒓ࡛そࢃࢀࡿ㒊ศ㔠ᒓ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆᥦ᱌ࡍࡿ㸬 ◒⢏ࡢᑟ㟁ᛶ࡟㛵ࡋ࡚◒⢏㏆ഐࡢࡵࡗࡁᒙࡢᡂ㛗࡟ࡘ࠸࡚ヲࡋࡃㄽ㏙ࡉࢀ࡚࠸ࡿ㸦బ⸨㸪㕥ᮌ㸪1982㸪1987㸧㸬」ྜ㟁Ẽࡵࡗࡁࢆ⾜࠺㝿࡟ᑟ㟁ᛶࡢ࠶ࡿ◒⢏ࢆ౑⏝ࡋࡓሙྜ࡟ࡣ㸪ᅗ 1(a)࡟♧ࡍࡼ࠺࡟◒⢏ࡢ඲㠃ࡀᑟ㟁ᛶ⓶⭷ ࡟そࢃࢀࡿࡓࡵྎ㔠࡟ᯒฟࡋࡓ◒⢏ࡀ㝜ᴟࡢ୍㒊ศ࡜࡞ࡾ㸪✺ฟࡋࡓ◒⢏ࡢୖ࡟㔠ᒓ⓶⭷ࡸ◒⢏ࡀከࡃᯒฟࡍࡿ㸬

(21)

ࡑࡢ⤖ᯝ㸪◒⢏ࡢᯒฟࡀ㏿ࡃ◒⢏ࡢಖᣢຊࡀ㧗ࡃ࡞ࡿࡀ㸪◒⢏ࡢจ㞟ࡀ㉳ࡁ࡚ᕤලୖࡢ◒⢏ศᕸࡀ୙ᆒ୍࡟࡞ࡿ㸬 ࡑࢀ࡟ᑐࡋ࡚㸪ᑟ㟁ᛶࡢ࡞࠸◒⢏ࢆ౑⏝ࡋࡓሙྜ࡟ࡣᅗ 1(b)࡟♧ࡍࡼ࠺࡟㟁╔ᕤලୖࡢ◒⢏࡜ྎ㔠ࡢ᥋ゐ㠃✚ࡀ ᑡ࡞࠸ࡓࡵ㸪◒⢏ࡢಖᣢຊࡀపࡃ࡞ࡿ㸬ࡲࡓ㸪◒⢏ࡢ⾲㠃࡟ࡣᑟ㟁ᛶࡀ࡞࠸ࡓࡵ㸪ᯒฟࡋࡓ◒⢏ࡢ⾲㠃ࡢୖ࡟ࡉ ࡽ࡟◒⢏ࡸ㔠ᒓ⓶⭷ࡢᯒฟࡀ⏕ࡌࡎ◒⢏ࡢจ㞟ࡀ࡯࡜ࢇ࡝⏕ࡌ࡞࠸ࡓࡵษࢀ࿡ࡀⰋ࠸ࡀ㸪ᯒฟ㏿ᗘࡀ㐜ࡃ࡞ࡿ㸬 ࡇࢀࡽࡢၥ㢟ࢆゎỴࡍࡿࡓࡵ࡟ᅗ 1(c)࡟♧ࡍࡼ࠺࡟ษࢀลࡢ୍㒊ศ࡟㔠ᒓ⓶⭷ࡀ࡞࠸◒⢏ࢆసࢀࡤᕤල࡟ᯒฟࡋ ࡓ◒⢏ࡢศᩓᛶࡀⰋࡃಖᣢຊࡢ㧗࠸㟁╔ᕤලࡢస〇ࡀྍ⬟࡜࡞ࡿࡶࡢ࡜ᛮࢃࢀࡿ㸬ࡑࡇ࡛㸪ⴭ⪅ࡽࡣ㸪๓㏙ࡋࡓ ࡼ࠺࡟㟁╔ᕤලࡢၥ㢟Ⅼࢆඞ᭹ࡍࡿࡓࡵ◒⢏⾲㠃ࡢ୍㒊ศࡔࡅ࡟ᑟ㟁ᛶࢆᣢࡘ Ni ⓶⭷࡛⿕そࡉࢀࡓ㒊ศ Ni ⿕そ ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆ㛤Ⓨࡋࡓ㸬㒊ศ Ni ⿕そ◒⢏ࡢୖ㒊࡟ࡣ㔠ᒓ⓶⭷ࡀ࡞࠸ࡓࡵ㸪ᚲࡎ◒⢏ࡢᑟ㟁ᛶࡢ࠶ࡿ㒊ศࡀ ୗ࡟࡞ࡗ࡚ྎ㔠࡟ᯒฟࡋࡵࡗࡁᒙࡀᡂ㛗ࡍࡿ㸬◒⢏ࡢ඲㠃ࡀࡵࡗࡁᒙ࡟そࢃࢀ࡞࠸ࡓࡵ㸪ಖᣢຊࡀ㧗ࡃษࢀ࿡ࡢ Ⰻ࠸㟁╔ᕤලࡢస〇ࡀྍ⬟࡜࡞ࡿ㸬㒊ศ Ni ⿕そ◒⢏ࡢస〇᪉ἲ࡟㛵ࡋ࡚ࡣ㸪㠀⿕そ◒⢏⾲㠃ࡢ୍㒊ศ࡟↓㟁ゎ Ni ࡵࡗࡁ࡟ࡼࡾ Ni ⓶⭷ࢆᙧᡂࡉࡏ ࡿ㒊ศࡵࡗࡁἲ࡜඲㠃 Ni ⿕そࡉࢀࡓ◒⢏⾲㠃ࡢ୍㒊ศࡢ Ni ⓶⭷ࢆ๤㞳ࡉࡏࡿ㒊ศ๤㞳ἲࡀ࠶ࡿ㸬㒊ศࡵࡗࡁἲ

Fig. 1 Effect of nickel membrane coated on abrasives on growth of electrodeposited layer along the surface of abrasives

Fig. 2 Production method of partially Ni-coated abrasives 電着工具用の部分Ni 被覆ダイヤモンド砥粒の開発

(22)

࡟౑⏝ࡉࢀࡿࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ๓ฎ⌮࡟ࡼࡾ◒⢏࡜ Ni ⓶⭷ࡢᐦ╔ᛶࡀ኱ࡁࡃ␗࡞ࡿࡓࡵ㸪ᮏ◊✲࡛ࡣ㒊ศ๤㞳 ἲ࡟ࡼࡾ㒊ศ Ni ⿕そ◒⢏ࢆస〇ࡋࡓ㸬࡞࠾㸪㒊ศ๤㞳ἲ࡛సᡂࡋ࡚ࡶ㸪㒊ศࡵࡗࡁἲ࡛సᡂࡋ࡚ࡶ㸪㟁╔ᕤලࡢ ◊๐ᛶ⬟ࡣ࡯࡜ࢇ࡝ኚ໬ࡀ࡞࠸ࡇ࡜ࡀ☜ㄆࡉࢀ࡚࠸ࡿ㸦୰ᕝ௚㸪2008㸧㸬ᅗ 2(a)࡟ࡣ㸪㒊ศ๤㞳ἲ࡟ࡼࡿ㒊ศ Ni ⿕そ◒⢏ࡢస〇ࣉࣟࢭࢫࢆ♧ࡍ㸬ࡲࡎ㸪ཌࡳ 2 mm ࡢ⪏⸆ရᛶࡀඃࢀࡿࢫࢸࣥࣞࢫ㗰ᯈ㸦SUS430㸪ڧ150150 mm㸧 ୖ࡟࣍ࢵࢺࣉ࣮ࣞࢺ࡟ࡼࡾ 120 Υ࡟ຍ⇕ࡍࡿࡇ࡜࡛࣡ࢵࢡࢫ㸦KPW-A㸪஑㔜㟁Ẽ㸦ᰴ㸧♫〇㸧ࢆ 20 ȝm ⛬ᗘሬ ᕸࡋࡓ㸬ᕷ㈍ࡢ඲㠃 Ni ⿕そࢲ࢖ࣖࣔࣥࢻ◒⢏㸦⢏ᚄ㸸30~40 ȝm㸪55 wt%Ni㸧ࢆ࣡ࢵࢡࢫୖ࡟ᆒ୍࡟ᩓᕸࡋ㸪ୖ 㒊ࡼࡾࢫ࣏ࣥࢪࢆᢲࡋᙜ࡚ຍ⇕࡟ࡼࡾ㌾໬ࡉࡏࡓ࣡ࢵࢡࢫෆ࡟◒⢏ࢆᢲࡋ㎸ࢇࡔ㸬ࡇࡢ≧ែ࡛ࡣ㸪ᅗ 2(b)࡟♧ࡉ ࢀࡿࡼ࠺࡟◒⢏ࡀ࣡ࢵࢡࢫࡢ⾲㠃࠿ࡽ༙ศ⛬ᗘ㟢ฟࡋ࡚࠸ࡿ㸬ࡇࡢ◒⢏ࢆᩓᕸࡋࡓ㗰ᯈࢆ⾲ 1 ࡟♧ࡋࡓࢽࢵࢣࣝ ๤㞳ᾎ࡟ᾐₕࡋ㸪࣡ࢵࢡࢫ࡟そࢃࢀ࡚࠸࡞࠸㒊ศࡢ Ni ⓶⭷ࢆ๤㞳ࡉࡏࡓ㸬ࡑࡢ⤖ᯝ㸪ᅗ 2(c)࡟♧ࡉࢀࡿࡼ࠺࡟๤ 㞳⤊஢ᚋ࡟ඖ⣲ศᯒࢆ⾜ࡗࡓ⤖ᯝ㸪◒⢏⾲㠃࡟ࢽࢵࢣࣝࡀ᳨ฟࡉࢀࡎ㸪◒⢏⾲㠃࡟ࡣⅣ⣲㸦ࢲ࢖ࣖࣔࣥࢻ㸧ࡀ㟢 ฟࡍࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡓ㸬ࡑࡢᚋ㸪ࢫࢸࣥࣞࢫ㗰ᯈࢆࢺ࢚ࣝࣥࡢ୰࡟ᾐࡋ㸪࣡ࢵࢡࢫࢆ᏶඲࡟⁐࠿ࡋ㸪⬺ⴠࡋࡓ ◒⢏ࢆྵࢇࡔ⁐ᾮࢆ⣬ࣇ࢕ࣝࢱ࡛ࢁ㐣ࡍࡿࡇ࡜࡟ࡼࡾ㒊ศ Ni ⿕そ◒⢏ࢆྲྀࡾฟࡋࡓ㸬

ᅗ 3 ࡟ࡣ࢚ࢿࣝࢠ࣮ศᩓᆺ X ⥺ศගჾ㸦EDX㸪INCA x-act㸪Oxford Instruments ♫〇㸧ࢆ⏝࠸࡚㸪స〇ࡋࡓ㒊ศ Ni ⿕そ◒⢏ࡢ⾲㠃ඖ⣲ศᯒࢆ⾜ࡗࡓ⤖ᯝࢆ♧ࡍ㸬◒⢏⾲㠃ࡢ୍㒊ศࡢ Ni ⓶⭷ࡀ࡞ࡃ࡞ࡾࢲ࢖ࣖࣔࣥࢻ㸦Ⅳ⣲㸧

Fig. 3 Elemental analysis of partially Ni-coated abrasives Table 1 Conditions of stripping nickel membrane

(23)

ࡀ㟢ฟࡋ࡚࠸ࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡿ㸬๤㞳ᾮ࡬ࡢᾐₕ᫬㛫ࢆ 30 min㸪40 min㸪50 min ࡜ኚ໬ࡉࡏ࡚ᚓࡽࢀࡓ◒⢏ࢆ ୍᪉ྥ࠿ࡽ EDX ศᯒࡍࡿࡇ࡜࡟ࡼࡾ C ࡜ Ni ࡜ࡢཎᏊᩘࡢ๭ྜࢆồࡵࡓ㸬ࡑࡢ⤖ᯝ㸪ᅗ 4 ࡟♧ࡍࡼ࠺࡟๤㞳᫬㛫 ࡀ㛗ࡃ࡞ࡿ࡟ࡘࢀ࡚Ⅳ⣲ࡢ๭ྜࡀቑ࠼ࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬๤㞳᫬㛫ࡀ 50 min ࡢሙྜ࡟ࡣ◒⢏࡜࣡ࢵࢡࢫࡢ㝽㛫࡟ ๤㞳ᾮࡀ౵ධࡋ㸪◒⢏඲㠃ࡢ Ni ⓶⭷ࡀ࡯࡜ࢇ࡝๤㞳ࡉࢀࡓࡶࡢ࡜⪃࠼ࡽࢀࡿ㸬ᅗ 5 ࡣస〇ࡋࡓ㒊ศ Ni ⿕そ◒⢏ ࡢ SEM ෗┿ࢆ♧ࡍ㸬30 min ࡢሙྜ࡛ࡣ࣡ࢵࢡࢫࡢ⾲㠃࡟㟢ฟࡋࡓ Ni ⓶⭷ࡀ᏶඲࡟๤㞳ࡉࢀ࡚࠸࡞࠸ࡀ㸪40 min ࡢሙྜ࡟ࡣ◒⢏ࡢ⣙༙ศࡢ㒊ศࡀ๤㞳ࡉࢀ࡚࠸ࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡿ㸬50 min ࡢሙྜ࡛ࡣ㸪◒⢏ࡢ⾲㠃࡟ࢃࡎ࠿࡞ Ni ⓶⭷ࡋ࠿ṧࡗ࡚࠸࡞࠸㸬ᮏ◊✲࡛ࡣ๤㞳᫬㛫ࡀ 30 min㸪40 min㸪50 min ࡢ㒊ศ Ni ⿕そ◒⢏㸦ࡑࢀࡒࢀࡀ௒ᚋ 㒊ศ Ni ⿕そ◒⢏ 30 min㸪40 min㸪50 min ࡜⛠ࡍࡿ㸧ࢆ⏝࠸࡚㟁╔ᕤලࢆస〇ࡋ㸪ࡑࢀࡽࡢຍᕤ≉ᛶࢆホ౯ࡋࡓ㸬㟁╔ᕤලࡢస〇 ࣭ 㟁╔ᕤලࡢ〇㐀⿦⨨࠾ࡼࡧ〇㐀᮲௳ ⣽⥺࡛࠶ࡿ࣡࢖࡛ࣖࡣ◒⢏ࡢจ㞟≧ែほᐹࡀᅔ㞴࡛࠶ࡿࡓࡵ㸪ᮏ◊✲࡛ࡣ〇సࡋࡓ㒊ศ Ni ⿕そ◒⢏࡜ᕷ㈍ࡢ඲ 㠃 Ni ⿕そ◒⢏࠾ࡼࡧ㠀⿕そ◒⢏ࢆ」ྜ㟁Ẽࡵࡗࡁἲ࡟ࡼࡾ㸪࠶ࡽ࠿ࡌࡵ࢔ࣝ࢝ࣜ⬺⬡ฎ⌮࠾ࡼࡧ㓟Ὑฎ⌮㸦㰻⸨ ௚㸪2011㸧ࢆ᪋ࡋࡓ┤ᚄ 10 mm ࡢ୸Წ㸦S45C㸧࡟㟁╔ࡋࡓ㸬ᅗ 6 ࡟ࡣ㟁Ẽࢽࢵࢣࣝࡵࡗࡁᐇ㦂⿦⨨ࡢ࢖࣓࣮ࢪ ᅗࢆ♧ࡍ㸬㝧ᴟ࡜ࡋࡓ⣧ࢽࢵࢣࣝ୸Წࢆࣅ࣮࢝ࡢෆቨ࡟ᅛᐃࡋࡓ㸬ᕤලẕᮦ࡜࡞ࡿ S45C ୸Წࢆᅇ㌿⿦⨨ࡢ㍈ࡢ ୗ㒊࡟ྲྀࡾ௜ࡅ㸪୸Წࡢ࿘ᅖ࡟ᆒ୍࡞ࡵࡗࡁࡀ࡛ࡁࡿࡼ࠺࡟୸Წࢆࡺࡗࡃࡾ࡜ᅇ㌿ࡉࡏ࡞ࡀࡽࡵࡗࡁࢆ⾜ࡗࡓ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀㏿ᗘࡣ 10 m/min ௨ୖࢆ┠ᶆ࡜ࡋ࡚࠸ࡿࡓࡵ㸪୸Წࡢᅇ㌿㏿ᗘࡀ㟁╔ࢲ࢖ࣖࣔ ࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀㏿ᗘ࡜ྠࡌ⛬ᗘ࡟࡞ࡿࡼ࠺࡟ 300 rpm ࡟ᅛᐃࡋࡓ㸬ᅇ㌿⿦⨨ࡢ㍈ࡢ㔠ᒓⰺࡢୖ➃࡜┤ὶ㟁 ※ࡢ㝜ᴟࢆ᥋⥆ࡋ㔠ᒓⰺࢆ㏻ࡋ࡚୸Წ࡟㏻㟁ࡋࡓ㸬ࣅ࣮࢝ࡣຍ⇕࡜ᨩᢾࡢᶵ⬟ࢆࡶࡘ࣐ࢢࢿࢸ࢕ࢵࢡࢫࢱ࣮ࣛࡢ ୖ࡟㍕ࡏ㸪ࡵࡗࡁᾎࢆຍ⇕ࡋ࡞ࡀࡽࡵࡗࡁᾎࢆᨩᢾࡋࡓ㸬๓㏙ࡋࡓࢲ࢖ࣖࣔࣥࢻ◒⢏㸦⢏ᚄ㸸30~40 ȝm㸧ࢆࡵࡗ ࡁᾎ࡟ศᩓࡉࡏࡿࡓࡵ㸪ࢫࢱ࣮ࣛࡢᅇ㌿ᩘࡣ 1000 rpm ࡟ᅛᐃࡋࡓ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻᕤලࡢస〇࡟࠾ࡅࡿࡵࡗࡁ ᕤ⛬ࡣ୍⯡ⓗ࡟ࢫࢺࣛ࢖ࢡࡵࡗࡁ㸪」ྜࡵࡗࡁ㸪ᚋࡵࡗࡁࡢ 3 ࢫࢸࢵࣉ࡛⾜ࢃࢀࡿ㸬࢘ࢵࢻᾎࡣ㸪ᙉ㓟ᾎ࡛㝜ᴟ ௜㏆࡟኱㔞ࡢỈ⣲࢞ࢫࢆⓎ⏕ࡋ㸪㝜ᴟ௜㏆࡟࠾࠸࡚㑏ඖ㞺ᅖẼ࡛ᕤලẕᮦࡢ⾲㠃㓟໬≀ࢆ㑏ඖࡋ࡞ࡀࡽࡵࡗࡁࡍ

Fig. 5 Surface state of partially Ni-coated abrasives stripped in 30 min, 40 min and 50 min

Fig. 6 Schematic diagram of plating setup for manufacturing diamond tools 電着工具用の部分Ni 被覆ダイヤモンド砥粒の開発

(24)

ࡿࡇ࡜ࡀྍ⬟࡛ẕᮦ࡜ࡵࡗࡁᒙ࡜ࡢᐦ╔ᛶࡀⰋࡃ࡞ࡿ㸬ࡑࡢࡓࡵ㸪ࢫࢺࣛ࢖ࢡࡵࡗࡁ࡟ࡣ࢘ࢵࢻᾎࢆ㑅ᢥࡋࡓ㸬 ◒⢏ࢆᯒฟࡍࡿ」ྜࡵࡗࡁᾎ࡜◒⢏ࡢಖᣢຊࢆ㧗ࡵࡿᚋࡵࡗࡁᾎ࡟ࡣ㸪㟁╔ᛂຊࡀᑠࡉࡃᡂ⭷㏿ᗘࡀ㏿࠸ࢫࣝࣇ ࢓࣑ࣥ㓟ࢽࢵࢣࣝᾎࢆ㑅ᢥࡋࡓ㸬ලయⓗ࡞ࡵࡗࡁᾎࡢ⤌ᡂ࠾ࡼࡧࡵࡗࡁ᮲௳ࢆ⾲ 2 ࡟ࡲ࡜ࡵࡓ㸬ࢫࢺࣛ࢖ࢡࡵࡗ ࡁࡢ⭷ཌࡣ 0.5 ȝm ࡟࡞ࡿࡼ࠺࡟ࢫࢺࣛ࢖ࢡࡵࡗࡁࡢ᫬㛫ࢆ 150 s ࡜ࡋࡓ㸬ᚋࡵࡗࡁࡢ᮲௳࡛ࡣ㸪ࡵࡗࡁࡢᡂ⭷㏿ ᗘࡀ 3 ȝm/min ࡛࠶ࡿࡓࡵ㸪◒⢏ᚄࡢ 1/3 ⛬ᗘ㸦10 ȝm㸧ࡀᇙࡵ㎸ࡲࢀࡿࡼ࠺࡟ᚋࡵࡗࡁࡢ᫬㛫ࢆ 200 s ࡜ࡋࡓ㸬」 ྜࡵࡗࡁࡢ᫬㛫ࡣ◒⢏ࡢᯒฟ㔞࡟ᙳ㡪ࢆ୚࠼ࡿࡓࡵ㸪◒⢏ࡢᯒฟ㔞ࢆ⪃៖ࡋ࡞ࡀࡽ」ྜࡵࡗࡁࡢ᫬㛫ࢆㄪᩚࡋࡓ㸬 ࡲࡓ㸪㧗ᡂ⭷㏿ᗘࡢ⥔ᣢࡢࡓࡵሷᇶᛶⅣ㓟ࢽࢵࢣࣝ࡜࢔࣑ࢻ◲㓟ࢆ⏝࠸࡚」ྜࡵࡗࡁᾎ࡜ᚋࡵࡗࡁᾎࡀ pH4 ࡟࡞ ࡿࡼ࠺࡟⟶⌮ࡋࡓ㸬 ࣭ 」ྜࡵࡗࡁ᮲௳࡟ࡼࡿ㟁╔ᕤල⾲㠃ࡢ◒⢏ࡢᯒฟ㔞࡜ศᕸ ๓❶࡟㏙࡭ࡓࡼ࠺࡟◒⢏⾲㠃ࡢ㔠ᒓ⿕そ⋡ࡣᕤල࡟ᯒฟࡋࡓ◒⢏㔞࡟ᙳ㡪ࢆ୚࠼㸪㒊ศ Ni ⿕そ◒⢏ࡢᯒฟ㔞ࡀ ඲㠃 Ni ⿕そ◒⢏࡜㠀⿕そ◒⢏ࡢ୰㛫࡟࡞ࡿ࡜⪃࠼ࡽࢀࡿ㸬స〇ࡋࡓ㒊ศ Ni ⿕そ◒⢏࡜ᕷ㈍ࡢ㠀⿕そ◒⢏࠾ࡼࡧ ඲㠃 Ni ⿕そ◒⢏ࢆ⏝࠸࡚ྠ୍᮲௳࡛㟁╔ࡋࡓᕤලࡢ⾲㠃࡟ᯒฟࡋࡓ◒⢏ࡢศᕸ≧ែࡣᅗ 7 ࡟♧ࡉࢀࡿ㸬㠀⿕そ◒ ⢏ࡢሙྜ࡟ࡣ◒⢏ࡀ࡯࡜ࢇ࡝ᯒฟࡋ࡚࠸࡞࠸㸬඲㠃 Ni ⿕そ◒⢏ࢆ౑⏝ࡋࡓሙྜ࡟ࡣᕤල࡟ᯒฟࡋࡓ◒⢏ࡀ᭱ࡶከ ࠸ࡀ㸪◒⢏ྠኈࡀจ㞟ࡋ࡚ᯒฟࡍࡿഴྥࡀぢࡽࢀࡿ㸬ࡑࢀ࡟ᑐࡋ࡚㸪㒊ศ Ni ⿕そ◒⢏ࢆ౑⏝ࡋࡓሙྜ࡟ࡣ඲㠃 Ni ⿕そ◒⢏࡜ẚ࡭࡚ᯒฟ◒⢏ᩘࡣࡸࡸᑡ࡞࠸ࡀ㸪◒⢏ࡢศᩓᛶࡀࡼࡃ࡞ࡗ࡚࠸ࡿ㸬ࡲࡓ㸪◒⢏ࡢ Ni ⓶⭷๤㞳᫬ 㛫ࡀ㛗࠸࡯࡝ᯒฟࡋࡓ◒⢏ࡢ㔞ࡀᑡ࡞࠸ࡇ࡜ࡀ☜ㄆ࡛ࡁࡿ㸬༓ⴥࡽࡣ㸪㔠ᒓᮦ㉁ࡀ␗࡞ࡿ⿕そ◒⢏ࢆ⏝࠸㸪◒⢏ ࡢᯒฟ㔞ࡀ◒⢏ᑟ㟁ᛶ࡟ᐦ᥋࡟㛵ಀࡋ㸪ᑟ㟁ᛶࡀ㧗࠸࡯࡝◒⢏ࡀᯒฟࡋࡸࡍ࠸࡜ㄽࡌࡓ㸦༓ⴥ௚㸪2003㸧㸬ࡑࡢ⤖ ᯝ㏻ࡾ㸪ᮏ◊✲࡟౑⏝ࡉࢀࡓ◒⢏ࡣ඲㠃 Ni ⿕そ◒⢏㸪㒊ศ Ni ⿕そ◒⢏ 30 min㸪40 min㸪50 min㸪㠀⿕そ◒⢏ࡢ 㡰࡟◒⢏⾲㠃ࡢ㔠ᒓ⓶⭷ࡀᑡ࡞ࡃᑟ㟁ᛶࡀᝏࡃ࡞ࡗࡓࡓࡵ㸪◒⢏ࡢᯒฟ㔞ࡀపࡃ࡞ࡗࡓ࡜⪃࠼ࡽࢀࡿ㸬

Table 2 Compositions of plating baths and plating conditions

(25)

୍⯡ⓗ࡞㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡣ◒⢏ᐦᗘࡀ 150 mm-2_{⛬ᗘ࡛࠶ࡿࡓࡵ㸪඲㠃 Ni ⿕そ◒⢏㸪㒊ศ Ni ⿕そ} ◒⢏࠾ࡼࡧ㠀⿕そ◒⢏ࢆ⏝࠸࡚」ྜࡵࡗࡁࡢ᮲௳ࢆኚ໬ࡉࡏ㸪ᯒฟࡋࡓ◒⢏ࡢ㔞ࢆㄪ࡭ࡓ㸬ᅗ 8 ࡟ࡣ」ྜࡵࡗࡁ ᾎ୰ࡢ◒⢏⃰ᗘ㸪」ྜࡵࡗࡁ᫬㛫➼ࢆኚ໬ࡉࡏࡓ㝿㸪ᕤල⾲㠃ࡢ༢఩㠃✚࠶ࡓࡾ࡟ᯒฟࡋࡓ◒⢏ಶᩘ㸦◒⢏ᐦᗘ㸧 ࢆ♧ࡍ㸬࠸ࡎࢀࡢ◒⢏࡟࠾࠸࡚ࡶ」ྜࡵࡗࡁᾎ୰ࡢ◒⢏⃰ᗘࡸ」ྜࡵࡗࡁ᫬㛫ࡀቑ࠼ࡿ࡯࡝ᯒฟࡋࡓ◒⢏ࡢ㔞ࡀ ቑຍࡍࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬㠀⿕そ◒⢏ࡢሙྜ࡟ࡣ㸪ᯒฟࡋࡓ◒⢏ᐦᗘࡀ 150 mm-2_{࡟㐩ࡍࡿࡓࡵ࡟ࡣᾎ୰ࡢ◒⢏⃰} ᗘࢆ 40 g/L㸪」ྜࡵࡗࡁ᫬㛫ࢆ 60 s ࡟ࡋ࡞ࡅࢀࡤ࡞ࡽ࡞࠸㸬඲㠃 Ni ⿕そ◒⢏ࢆ౑⏝ࡍࡿሙྜ࡟ࡣ㸪0.5 g/L ࡢప ◒⢏⃰ᗘ㸪」ྜࡵࡗࡁࡢ᫬㛫ࢆ 5 s ࡟ࡋ࡚┠ᶆࡢᯒฟ㔞ࡀᚓࡽࢀࡿ㸬ࡑࢀ࡟ᑐࡋ࡚ࡣ㸪㒊ศ Ni ⿕そ◒⢏ 30 min ࡢሙྜ࡟ࡣ㸪ᾎ୰ࡢ◒⢏⃰ᗘࢆ 1 g/L㸪」ྜࡵࡗࡁ᫬㛫ࢆ 5 s ࡟ࡍࢀࡤ 150 mm-2_{ࡢ◒⢏ᐦᗘࡀᚓࡽࢀ㸪඲㠃 Ni ⿕} そ◒⢏ࡼࡾ◒⢏ࡢᯒฟࡀࡸࡸ㐜ࢀࡿࡀ㠀⿕そ◒⢏࡟ẚ࡭࡚ⴭࡋࡃ㏿࠸ࡇ࡜ࡀศ࠿ࡗࡓ㸬๤㞳᫬㛫ࡀ㛗࠸㒊ศ Ni ⿕そ◒⢏ 50 min ࡛ࡣ㸪◒⢏⃰ᗘࢆ 10 g/L㸪」ྜࡵࡗࡁ᫬㛫ࢆ 60 s ࡟ࡍࡿᚲせࡀ࠶ࡿ㸬㒊ศ Ni ⿕そ◒⢏ࢆ౑⏝ࡍ ࡿࡇ࡜࡟ࡼࡾ㸪」ྜࡵࡗࡁ᫬㛫ࡸ」ྜࡵࡗࡁᾎ୰ࡢ◒⢏⃰ᗘࡀ඲㠃 Ni ⿕そ◒⢏ࡼࡾࡸࡸ㧗࠸ࡀ㸪㠀⿕そ◒⢏ࡼࡾ ࠿࡞ࡾప࠸ࡇ࡜ࡀ☜࠿ࡵࡽࢀࡓ㸬

Fig. 8 Effect of complex plating conditions on density of abrasives on tool surface

Fig. 9 Relationship between grain distribution on tools and kinds of abrasives 電着工具用の部分Ni 被覆ダイヤモンド砥粒の開発

(26)

㟁╔ᕤල⾲㠃ࡢ◒⢏ᐦᗘ࡜◒⢏ศᕸ≧ែࡣᕤලࡢ◊๐≉ᛶ࡟኱ࡁࡃᙳ㡪ࢆ୚࠼ࡿ࡜⪃࠼ࡽࢀࡿ㸬ࡑࡢࡓࡵ㸪㟁 ╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල࡜ྠࡌࡃ㸪◒⢏ᐦᗘࡀ 150 mm-2_{⛬ᗘࡢ㟁╔ᕤලࢆసᡂࡋ㸪ᕤල⾲㠃ࡢ◒⢏ศᕸ≧ែࢆ} ㄪ࡭ࡓ㸬◒⢏ࡢศᕸ≧ែࢆᩘ್ⓗ࡟ホ౯ࡍࡿࡓࡵ㸪୍㎶ 150 ȝm ᅄ᪉ᙧࡢ㡿ᇦ࡟ᯒฟࡋࡓ◒⢏ࡢಶᩘࢆ 200 ⟠ᡤ ᩘ࠼㸪◒⢏ࡢಶᩘࢆ⤫ィⓗ࡟ศ㢮ࡋࡓ㸬◒⢏ࡢจ㞟࡟㛵ࡋ࡚ࡣ㸪◒⢏㛫ࡢ୰ᚰ㊥㞳ࡀ 40 ȝm ௨ෆࡢ◒⢏ಶᩘࢆᩘ ࠼㸪඲యࡢ◒⢏ᩘ࡜ࡢ๭ྜ࡛◒⢏จ㞟⋡ࢆᐃ⩏ࡋࡓ㸬ᅗ 9 ࡟ࡣᕤල⾲㠃࡟ᯒฟࡋࡓྛ✀◒⢏ࡢจ㞟⋡࡜ಶᩘศᕸ 㢖ᗘࢆ♧ࡍ㸬඲㠃 Ni ⿕そ◒⢏ࢆ౑⏝ࡋࡓᕤල࡟ࡣ㸪จ㞟ࡋࡓ◒⢏ࡀ࠿࡞ࡾከࡃ⣙ 70 %࡟㐩ࡋ㸪◒⢏ࡀᏑᅾࡋ࡞ ࠸㡿ᇦ࡜ 7 ಶ௨ୖࡢ㡿ᇦࡀ 30 %⛬ᗘ༨ࡵࡿ㸬㠀⿕そ◒⢏ࡢሙྜ࡟ࡣ㸪ᯒฟࡋࡓ◒⢏ࡢ୰࡟จ㞟⋡ࡀ᭱ࡶపࡃ 40 % ௨ୗ࡟࡞ࡗ࡚࠸ࡿ㸬ࡑࢀࡽࡢ◒⢏࡟ᑐࡋ࡚ࡣ㸪㛤Ⓨࡋࡓ㒊ศ Ni ⿕そ◒⢏ࡣ㸪㠀⿕そ◒⢏ࡼࡾ◒⢏ࡢจ㞟⋡ࡀࡸࡸ 㧗࠸ࡀ㸪඲㠃 Ni ⿕そ◒⢏ࡼࡾ኱ࡁࡃపῶࡍࡿࡇ࡜ࡀ࡛ࡁࡓ㸬㒊ศ Ni ⿕そ◒⢏ 30 min ࡜ 40 min ࡢሙྜ࡟ࡣศᕸ ≧ែࡢᕪ␗ࡀ࡯࡜ࢇ࡝ぢࡽࢀࡎ඲㠃 Ni ⿕そ◒⢏࡜ẚ࡭࡚จ㞟ࡋࡓ◒⢏ࡢ㔞ࡀ 15 %⛬ᗘᑡ࡞ࡃ࡞ࡿࡇ࡜ࡀ☜ㄆࡉ ࢀࡓ㸬◒⢏ࡀᏑᅾࡋ࡞࠸㡿ᇦ࡜ 7 ಶ௨ୖࡢ㡿ᇦ࡟࠾࠸࡚ࡶ㸪㒊ศ Ni ⿕そ◒⢏ࡀ඲㠃 Ni ⿕そ◒⢏࡟ẚ࡭࡚༙ศ⛬ ᗘపῶࡍࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬㒊ศ Ni ⿕そ◒⢏ 50 min ࡣ㠀⿕そ◒⢏࡜ኚࢃࡽ࡞࠸࡯࡝◒⢏ศᕸ≧ែࡀࡼ࠸ࡇ࡜ࡀ ☜ㄆ࡛ࡁࡿ㸬⾲㠃࡟ᑟ㟁ᛶࡀ࠶ࡿ◒⢏ࡢ௜㏆࡟ࡣ㟁఩ࡀ㧗ࡃ◒⢏ࡀᯒฟࡋࡸࡍ࠸ࡓࡵࡔ࡜⪃࠼ࡽࢀࡿ㸬㒊ศ Ni ⿕そ◒⢏ࢆ౑⏝ࡍࡿ࡜඲㠃 Ni ⿕そ◒⢏ࡢሙྜ࡟ࡼࡾ◒⢏ࡢจ㞟ඹᯒࡀᢚไ࡛ࡁ㸪㟁╔ᕤලୖࡢ◒⢏ࡢศᩓᛶࢆᨵ ၿࡍࡿຠᯝࡀ࠶ࡿࡇ࡜ࡀ☜࠿ࡵࡽࢀࡓ㸬㒊ศ Ni ⿕そ◒⢏࡟࠾࠸࡚ࡣ Ni ⓶⭷ࡢ࡞࠸㒊ศࡀ◊๐ᕤලୖ࡛ྎ㔠࡟ᑐࡋ࡚እྥࡁ࡟࡞ࡽ࡞ࡅࢀࡤ㟁╔ᕤලࡢ ษࢀ࿡ࡢྥୖࢆᐇ⌧ࡍࡿࡇ࡜ࡀ࡛ࡁ࡞࠸ࡓࡵ㸪ᕤල࡟ᯒฟࡋࡓ㒊ศ Ni ⿕そ◒⢏ࡢྥࡁࢆほᐹࡋࡓ㸬ᅗ 10 ࡣᕤල ⾲㠃࡟㟁╔ࡉࢀࡓ㒊ศ Ni ⿕そ◒⢏ 50 min ࡢ SEM ⏬ീ࡜Ⅳ⣲ศᕸᅗ㸦EDX㸧ࢆ♧ࡍ㸬◒⢏ࡢ࠶ࡿ࡜ࡇࢁ࡟ࡣⅣ⣲ ࡀ࡯࡜ࢇ࡝ほᐹࡉࢀࡿࡓࡵ Ni ⓶⭷ࡢ࡞࠸㒊ศࡀእྥࡁ࡟࡞ࡗ࡚࠸ࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡿ㸬ᑟ㟁ᛶࡢ࡞࠸㠀⿕そ◒⢏ ࡀ኱ኚᯒฟࡋ࡟ࡃ࠸ࡇ࡜࡜㸪ᑟ㟁ᛶࡢ࠶ࡿ඲㠃 Ni ⿕そ◒⢏ࡀᯒฟࡋࡸࡍ࠸ࡇ࡜ࢆ๓㏙ࡉࢀࡓ㸬◒⢏ࡀᾮ୰࡟ࣛࣥ ࢲ࣒࡟㐠ືࡋ㒊ศ Ni ⿕そ◒⢏ࡢࡍ࡭࡚ࡢ㠃ࡀྎ㔠࡟᥋ゐࡍࡿ㢖ᗘࡀྠࡌ࡜⪃࠼ࡽࢀࡿࡀ㸪◒⢏ࡢࢲ࢖ࣖࣔࣥࢻ㒊 ศ࡟ࡣᑟ㟁ᛶࡀ࡞ࡃྎ㔠࡟᥋ゐࡋ࡚ࡶᅛ╔ࡉࢀ࡞࠸ࡲࡓࡣᅛ╔ࡉࢀ࡟ࡃ࠸࡜᥎ ࡛ࡁࡿ㸬ࡑࢀ࡟ᑐࡋ㸪Ni ⓶⭷ࡢ 㒊ศࡀྎ㔠࡟᥋ゐࡍࡿ࡜᥋ゐ㒊ศ࡟㟁Ẽࡀὶࢀࡵࡗࡁᒙࡀ㧗㏿࡟ᡂ㛗ࡋ◒⢏ࡀᅛ╔ࡉࢀࡸࡍ࠸࡜⪃࠼ࡽࢀࡿ㸬࡞ ࠾㸪㒊ศ Ni ⿕そ◒⢏⾲㠃 Ni ⭷ࡢ࡝ࡢ㒊ศࡀྎ㔠࡟ᅛ╔ࡉࢀࡿࡢࡀุ᩿ࡍࡿࡇ࡜ࡀ࡛ࡁ࡞࠿ࡗࡓ㸬ࡋࡓࡀࡗ࡚㸪 ᯒฟࡋࡓ㒊ศ Ni ⿕そ◒⢏ࡀⰍࠎ࡞᪉ྥ࡟ྥ࠿ࡎࢲ࢖ࣖࣔࣥࢻࡀ㟢ฟࡋࡓ㒊ศࡀྎ㔠࡟ᑐࡋ࡚እྥࡁ࡟࡞ࡾࡸࡍ ࠸࡜ᐃᛶⓗ࡟⪃ᐹࡋࡓ㸬ࡲࡓ㸪ᅗ 5 ࡟♧ࡉࢀࡓࡼ࠺࡟㒊ศ Ni ⿕そ◒⢏ࡢ Ni ⓶⭷࡜◒⢏ࡢ㛫࡟๤㞳ᾮࡀከᑡ౵ධ ࡋ㝽㛫ࡀ⏕ࡌ◒⢏ࡢಖᣢຊࡀపୗࡍࡿࡇ࡜ࡀᠱᛕࡉࢀࡓࡀ㸪ᅗ 1(c)࡜ᅗ 10(a)࡟♧ࡉࢀࡿࡼ࠺࡟◒⢏࡜ Ni ⓶⭷ࡢ ⏺㠃࡟ࡣࡑࡢ㝽㛫ࡀ☜ㄆࡉࢀ࡚࠾ࡽࡎ㸪㟁╔୰࡟ࡵࡗࡁᾮࡀ౵ධࡋᯒฟࡋࡓࢽࢵࢣࣝࡼࡾᇙࡵࡽࢀࡓ࡜᥎ᐹࡉࢀ ࡿ㸬௨ୖࡢ⌮⏤࡟ࡼࡾ㸪㒊ศ Ni ⿕そ◒⢏ࢆ⏝࠸࡚స〇ࡋࡓ◊๐ᕤලࡣ඲㠃 Ni ⿕そ◒⢏࡜㠀⿕そ◒⢏ࡢ㛗ᡤࢆ᭷ ࡋ㸪◒⢏ࡢಖᣢຊࡀ㧗࠸ࡲࡲษࢀ࿡ࡀࡼ࠸ࡶࡢ࡜⪃࠼ࡽࢀࡿ㸬 ᅗ 12 ࡣస〇ࡋࡓ㟁╔ᕤලࢆ⏝࠸࡚࢞ࣛࢫ࡜ࢩࣜࢥࣥࢆ◊๐ࡋࡓ㝿ࡢ༢఩ᖜᙜࡾࡢ◊๐᢬ᢠ࠾ࡼࡧᕤస≀ࡢ ⾲㠃⢒ࡉࢆ♧ࡍ㸬ࡇࡢ⤖ᯝ࠿ࡽ◒⢏⾲㠃ࡢ Ni ⓶⭷ࡢ⿕そ⋡࡟ࡼࡾ㟁╔ᕤලࡢ◊๐≉ᛶࡀ␗࡞ࡿࡇ࡜ࡀศ࠿ࡿ㸬㒊

(27)

ศ Ni ⿕そ◒⢏ࢆ⏝࠸ࡓᕤලࡢሙྜ࡟ࡣ㸪඲㠃 Ni ⿕そ◒⢏ࡢᕤල࡟ẚ࡭◊๐᢬ᢠࡀపࡃ࡞ࡗ࡚࠸ࡿ㸬㠀⿕そ◒⢏ ࢆ౑⏝ࡋࡓሙྜ࡟㸪◊๐᢬ᢠࡀ᭱ࡶᑠࡉࡃ࡞ࡗࡓ㸬ࡇࢀࡣ㸪ᅗ 1 ࡟♧ࡉࢀࡿࡼ࠺࡟㟁╔ᕤලࡢ⾲㠃࡟ᯒฟࡋࡓ㠀⿕そ◒⢏ࡲࡓࡣ㒊ศ Ni ⿕そ◒⢏ࡢ⾲㠃࡟ࡣ Ni ⓶⭷ࡀ࡞ࡃ㸪ᮏ᮶ࡢࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ㗦࠸ษࢀลࢆᣢࡘࡓࡵ㸪 ◊๐᢬ᢠࡀᑠࡉࡃ࡞ࡗࡓ࡜⪃࠼ࡽࢀࡿ㸬㒊ศ Ni ⿕そ◒⢏ࢆస〇ࡍࡿ㝿ࡢ๤㞳᫬㛫ࡀ㛗ࡃ࡞ࡿ࡟ࡘࢀ࡚◊๐᢬ᢠࡀ ᑠࡉࡃ࡞ࡗ࡚࠸ࡿ㸬ᅗ 4 ࡟♧ࡉࢀࡿࡼ࠺࡟๤㞳᫬㛫ࡀ㛗࠸࡯࡝◒⢏⾲㠃ࡢ Ni ⓶⭷ࡀᑡ࡞ࡃ㸪ࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ 㟢ฟ㒊ศࡀቑ࠼ࡓࡓࡵ࡜⪃࠼ࡽࢀࡿ㸬ࡲࡓ㸪ᕤస≀ࡢᮦ㉁࡟ࡼࡗ࡚◊๐ືຊࡀ␗࡞ࡾ㸪࢞ࣛࢫࡢሙྜ࡟ࡣࢩࣜࢥ ࣥࡼࡾ◊๐᢬ᢠࡀಸ⛬ᗘ㧗ࡃ࡞ࡗ࡚࠸ࡿ㸬࢞ࣛࢫࡣ㠀ᬗ㉁࡛⢓ࡾᙉ࠸㞴◊๐ᮦᩱ࡜▱ࡽࢀ࡚࠾ࡾ㸪ࢩࣜࢥࣥ࡜ẚ ࡭࡚◳ࡃ࡚ᕤලࡀ⁥ࡾࡸࡍ࠸ࡓࡵ◊๐᢬ᢠࡀቑ኱ࡋࡓ࡜⪃࠼ࡽࢀࡿ㸬 ᕤస≀◊๐㠃ࡢ⾲㠃⢒ࡉ࡟ࡘ࠸࡚ࡣ㸪ᅗ 12 ࡟♧ࡉࢀࡿࡼ࠺࡟㒊ศ Ni ⿕そ◒⢏ࢆ౑⏝ࡋࡓᕤලࡢሙྜࡣ඲㠃 Ni ⿕そ◒⢏ࡢᕤලࡢሙྜࡼࡾ⾲㠃⢒ࡉࡀࡸࡸపࡃ࡞ࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬඲㠃 Ni ⿕そ◒⢏ࡢᕤලࡢሙྜ࡟ࡣจ㞟ࡋࡓ ◒⢏ࡢ㔞ࡀከࡃ◒⢏ࡢศᩓᛶࡀᝏ࠸ࡓࡵ◒⢏㛫㝸ࡢࡤࡽࡘࡁࡀ኱ࡁ࠸㸬ࡉࡽ࡟㸪ᅗ 1 ࡟♧ࡉࢀࡿࡼ࠺࡟඲㠃 Ni ⿕そ◒⢏ࡀྎ㔠ࡢ༙ᚄ᪉ྥ࡟ࡶจ㞟ࡋ㸪ษࢀลࡢ㧗ࡉࡀ䬘ࡗ࡚࠸࡞࠸ࡓࡵ㸪⾲㠃⢒ࡉࡢ್ࡀ኱ࡁࡃ࡞ࡗࡓ࡛ࡣ࡞ ࠸࠿࡜⪃ᐹࡋࡓ㸬ࡇࢀ࡟ᑐࡋ㸪㒊ศ Ni ⿕そ◒⢏ࡲࡓࡣ㠀⿕そ◒⢏ࡢᕤලࡢሙྜ࡟ࡣ㸪ᯒฟࡋࡓ◒⢏ࡢศᩓᛶࡀࡼ ࠸ࡔࡅ࡛ࡣ࡞ࡃ㸪◒⢏ࡢඛ➃࡟ᑟ㟁ࡋ࡞࠸ࢲ࢖ࣖࣔࣥࢻ࡜࡞ࡗ࡚࠾ࡾ◒⢏ࡀ⦪࡟จ㞟ࡍࡿࡇ࡜ࡀᑡ࡞ࡃ࡚◒⢏ࡢ ඛ➃㧗ࡉࡀ䬘ࡗ࡚࠸ࡓࡓࡵ㸪◊๐㠃ࡢ⾲㠃⢒ࡉࡀࡼࡃ࡞ࡗࡓ࡜⪃࠼ࡽࢀࡿ㸬ࡇࢀࡽࡢ⤖ᯝࢆᅗ 9 ࡢ⤖ᯝ࡜ྜࢃࡏ ࡚⪃៖ࡍࢀࡤ㸪㟁╔ᕤල࡟ᯒฟࡋࡓ◒⢏ࡢศᕸ≧ែࡀࡼ࠸࡯࡝◊๐㠃ࡢᛶ≧ࡀⰋࡃ࡞ࡿࡇ࡜ࡀ᫂ࡽ࠿࡜࡞ࡿ㸬

Fig. 11 Schematic diagram of grinding tests

Fig. 12 Influence of kinds of abrasives on grinding force and surface roughness 電着工具用の部分Ni 被覆ダイヤモンド砥粒の開発

(28)

㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡣ◒⢏ᒙࡀ༢ᒙ࡛࠶ࡾ㸪◒⢏ࡢಖᣢຊࡣᕤලᑑ࿨࡟኱ࡁࡃᙳ㡪ࡍࡿ㸬ྛ✀ࡢ◒⢏ ࡢಖᣢຊࢆホ౯ࡍࡿࡓࡵ㸪◊๐᮲௳ࡢษ㎸ࡳ㔞ࢆ 150 ȝm ࡟ቑຍࡋ࢞ࣛࢫࡢ㔜◊๐ࢆ⾜ࡗࡓ㸬ᅗ 13 ࡟ࡣ㸪ྛ✀ࡢ ◒⢏ࢆ౑⏝ࡋࡓ㟁╔ᕤලࢆ⏝࠸࡚◊๐ᅇᩘࢆቑຍࡋ࡞ࡀࡽ◊๐ຍᕤࢆ⾜ࡗࡓ㝿ࡢ◊๐᢬ᢠࡢኚ໬ࢆ♧ࡍ㸬㒊ศ Ni ⿕そ◒⢏ࢆ⏝࠸ࡓᕤලࡣ㸪඲㠃 Ni ⿕そ◒⢏ࡢᕤල࡟ࡼࡾᕤල◚ቯ࡟⮳ࡿࡲ࡛ࡢ◊๐᢬ᢠࡀᏳᐃࡍࡿࡇ࡜ࡀ☜ㄆࡉ ࢀࡿ㸬඲㠃 Ni ⿕そ◒⢏ࡢሙྜ㸪◊๐ึᮇ࡛ࡣ◒⢏ඛ➃࡟そࢃࢀࡓ Ni ⓶⭷ࡀᦶ⪖ࡉࢀࢲ࢖ࣖࣔࣥࢻࡀ㟢ฟࡋ◊๐ ᢬ᢠࡀῶᑡࡍࡿഴྥࡀࡳࡽࢀࡿ㸬㒊ศ Ni ⿕そ◒⢏ࡢሙྜ࡛ࡣ㸪◒⢏ࡢඛ➃࡟ Ni ⓶⭷ࡀᑡ࡞࠸ࡓࡵ㸪◊๐᢬ᢠࡀ Ᏻᐃࡋ࡚ప࠸್ࢆ♧ࡋࡓ࡜⪃ᐹࡋࡓ㸬ᕤලᑑ࿨㸦◊๐ᅇᩘ㸧ࡣ◒⢏࿘ᅖࡢ Ni ⓶⭷ศᕸ≧ែ࠾ࡼࡧ◒⢏ศᕸࡢᆒ୍ ᛶ࡟኱ࡁࡃᙳ㡪ࡉࢀࡿ㸬ᙉᅛ࡞ Ni ⭷࡛ᅖࡲࢀࡿ◒⢏ࡀᆒ୍࡟ᕤලୖ࡟ศᕸࡋࡓ◊๐ᕤලࡣᕤලᑑ࿨ࡀ㛗࠸࡜⪃࠼ ࡽࢀࡿ㸬㠀⿕そ◒⢏ࢆ౑⏝ࡋࡓሙྜ࡟ࡣ㸪ࢃࡎ࠿ 7 ᅇ┠ࡢ◊๐࡛ᕤලࡀ◚ቯࡋࡓ㸬ᅗ 1 ࡟♧ࡉࢀࡿࡼ࠺࡟㸪㠀⿕そ◒⢏ࡀẕᮦ࡜ࡢ᥋ゐࡍࡿ㒊ศ࡛ࡵࡗࡁ⭷ࡀพࢇ࡛࠸ࡓࡓࡵ㸪◒⢏ࡢಖᣢຊࡀᙅࡃ࡞ࡾ㸪ᕤලᑑ࿨ࡀ᭱ࡶ▷࠿ࡗ ࡓ࡜⪃࠼ࡽࢀࡿ㸬ࡇࢀ࡟ᑐࡋ࡚㸪඲㠃 Ni ⿕そ◒⢏ࢆ౑⏝ࡋࡓᕤලࡢሙྜ࡟ࡣ㸪㠀⿕そ◒⢏ࢆ౑⏝ࡍࡿሙྜࡼࡾࡶ ᕤලᑑ࿨ࡣఙࡧ࡚࠸ࡿࡀ㸪12 ᅇ◊๐௨ᚋ࡟ࡣ◊๐᢬ᢠࡀᛴ⃭࡟ቑ኱ࡋᕤලࡢࡵࡗࡁᒙࡀ๤ࡀࡉࢀᕤල◚ᦆ࡟⮳ࡗ ࡓ㸬ࡑࢀࡣ㸪୍㒊ࡢಖᣢຊࡀᙅ࠸◒⢏ࡀඛ࡟ᕤල࠿ࡽ⬺ⴠࡋ㸪ṧࡗࡓ◒⢏࡟ࡣ኱ࡁ࡞◊๐ຊࡀཷࡅࡽࢀ኱つᶍࡢ ◒⢏⬺ⴠࡀ⏕ࡌ㸪◊๐⬟ຊࡢ࡞࠸ࡵࡗࡁᒙࡀᕤస≀࡟┤᥋࡟ᙜࡓࡗ࡚๤ࡀࡉࢀࡿࡇ࡜࡟ࡼࡾᕤලࡢ◚ቯ࡟⮳ࡗࡓ ࡜᥎ᐹࡋࡓ㸬㒊ศ Ni ⿕そ◒⢏ 30 min ࡜ 40 min ࢆ⏝࠸ࡓᕤලࡢሙྜ㸪13 ᅇ◊๐ࡲ࡛ᕤලࡀ◚ᦆࡏࡎ࡟◊๐࡛ࡁࡓ㸬㒊ศ Ni ⿕そ◒⢏ 30 min ࡜ 40 min ࡢᕤලࡣ඲㠃 Ni ⿕そ◒⢏ࡢᕤලࡼࡾᕤලᑑ࿨ࡀࡸࡸ㛗࠸ࡇ࡜ࡀศ࠿ࡗࡓ㸬◒ ⢏⾲㠃ࡢ Ni ⓶⭷ࡢ๤㞳᫬㛫ࢆ㐺ษ࡟ㄪᩚࡋࡓ㒊ศ Ni ⿕そ◒⢏ࢆ⏝࠸ࡿࡇ࡜࡟ࡼࡾ㸪඲㠃 Ni ⿕そ◒⢏ࡼࡾ㧗࠸ᑑ ࿨ࢆ᭷ࡍࡿ㟁╔ᕤලࡀస〇࡛ࡁࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬㒊ศ Ni ⿕そ◒⢏ 30 min ࡜ 40 min ࢆ⏝࠸ࡓ㟁╔ᕤලࡢᕤලᑑ ࿨ࡀ㛗ࡃ࡞ࡿཎᅉ࡜ࡋ࡚ࡣ㸪◒⢏ࡀᕤල࡟ᯒฟࡋࡓ≧ែࡀ␗࡞ࡿࡓࡵ࡜⪃࠼ࡽࢀࡿ㸬඲㠃 Ni ⿕そ◒⢏ࡢሙྜ࡟ࡣ㸪 ᅗ 1 ࡟♧ࡉࢀࡿࡼ࠺࡟㒊ศ Ni ⿕そ◒⢏࡜ẚ࡭◒⢏࡟ᑟ㟁ᛶࡢ Ni ⓶⭷ࡀ࠶ࡿࡓࡵࡵࡗࡁᒙࡢᡂ㛗ᙧែࡣఝ࡚࠾ࡾ ◒⢏ࡢಖᣢຊࡀ㧗࠸࡜⪃࠼ࡽࢀࡿࡀ㸪จ㞟ࡋࡓ◒⢏ࡢሢ࡟࠿࠿ࡿ◊๐ຊࡀ኱ࡁࡃࡑࡢ◒⢏ࡀᕤල࠿ࡽ๤㞳ࡋࡸࡍ ࠸ࡓࡵ㸪㒊ศ Ni ⿕そ◒⢏ 30 min ࡜ 40 min ࡢᕤලࡼࡾᑑ࿨ࡀ▷ࡃ࡞ࡗࡓ࡛ࡣ࡞࠸࠿࡜⪃ᐹࡋࡓ㸬࡞࠾㸪㒊ศ Ni ⿕そ◒⢏ 50 min ࡢᕤලࡣ 10 ᅇ┠ࡢ◊๐ࢆ⾜ࡗࡓ㝿࡟ᕤලࡀቯࢀ㸪௚ࡢ㒊ศ Ni ⿕そ◒⢏ࡢᕤලࡼࡾᕤලᑑ࿨ࡀ▷ ࠿ࡗࡓ㸬๤㞳᫬㛫ࡀ 50 min ࡟࡞ࡿ࡜◒⢏ࡢ⾲㠃ࡢ Ni ⓶⭷ࡀ࡯࡜ࢇ࡝࡞࠸ࡓࡵ㸪◒⢏ࡢಖᣢຊࡀᙅࡃ㠀⿕そ◒⢏ ࡼࡾࢃࡎ࠿࡟㧗࠸⛬ᗘ࡟࡞ࡗࡓ࡜⪃࠼ࡽࢀࡿ㸬ࡋࡓࡀࡗ࡚㸪㒊ศ Ni ⿕そ◒⢏⾲㠃ࡢ Ni ⓶⭷ࡢ㔞ࡣᕤලࡢ◊๐≉ ᛶ࡟኱ࡁࡃᙳ㡪ࡋ㸪㐺ษ࡞ Ni ⓶⭷ࢆ᭷ࡍࡿ㒊ศ Ni ⿕そ◒⢏ࢆ౑⏝ࡍࡿࡇ࡜࡟ࡼࡾ㸪◒⢏ࡢಖᣢຊࡀ㧗ࡃ࡚ษࢀ ࿡ࡢඃࢀࡿ㟁╔ᕤලࡀస〇࡛ࡁࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬

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5. ⤖ ㄒ ᮏ◊✲࡛ࡣ㸪㟁╔ᕤලࡢษࢀ࿡࡜◒⢏ಖᣢຊࡢࢺ࣮ࣞࢻ࢜ࣇࢆゎỴࡋ㧗ᛶ⬟㟁╔ᕤලࢆ㛤Ⓨࡍࡿࡓࡵ࡟㸪㒊ศ Ni ⿕そ◒⢏ࢆᥦ᱌ࡋࡓ㸬඲㠃 Ni ⿕そ◒⢏⾲㠃ࡢ୍㒊ศࡢ Ni ⓶⭷ࢆ๤㞳ࡍࡿࡇ࡜࡟ࡼࡾ㒊ศ Ni ⿕そ◒⢏ࡢస〇 ࢆヨࡳࡓ㸬㛤Ⓨࡋࡓ㒊ศ Ni ⿕そ◒⢏ࢆᕷ㈍ࡢ඲㠃 Ni ⿕そ◒⢏࠾ࡼࡧ㠀⿕そ◒⢏࡜ẚ㍑ࡋ࡞ࡀࡽ㸪㟁╔᮲௳࡟ࡼ ࡿ◒⢏ࡢ㟁╔ᕤල࡬ࡢᯒฟ≉ᛶࡸศᕸ≧ែࡢ┦㐪ࢆ᳨ウࡋࡓ㸬㒊ศ Ni ⿕そ◒⢏࡜඲㠃 Ni ⿕そ◒⢏㸪㠀⿕そ◒⢏ ࢆ⏝࠸࡚ྠࡌ◒⢏ᐦᗘࡢ㟁╔ᕤලࢆస〇ࡋ㸪ࢩࣜࢥࣥ࡜࢞ࣛࢫࡢ◊๐ᐇ㦂ࢆ⾜࠸㸪◊๐᢬ᢠࡸ◊๐㠃ࡢ≧ែࢆホ ౯ࡋࡓ㸬ᚓࡽࢀࡓ⤖ᯝࡣ㸪௨ୗࡢ㏻ࡾ࡛࠶ࡿ㸬 (1) ඲㠃 Ni ⿕そ◒⢏⾲㠃ࡢ Ni ⓶⭷ࢆ๤㞳ࡍࡿࡇ࡜࡟ࡼࡾ Ni ⓶⭷ࡢ㔞ࡀ␗࡞ࡿ㒊ศ Ni ⿕そ◒⢏ࡢస〇ࡀ࡛ࡁࡓ㸬 (2) 」ྜ㟁Ẽࡵࡗࡁἲ࡟ࡼࡿ㟁╔ࢲ࢖ࣖࣔࣥࢻᕤලࡢస〇࡟࠾࠸࡚ࡣ㸪㒊ศ Ni ⿕そ◒⢏ࡀ඲㠃 Ni ⿕そ◒⢏࡟ẚ ࡭࡚ᯒฟ㔞ࡀࡸࡸຎࡿࡀ◒⢏ࡢจ㞟㔞ࡀᑡ࡞ࡃ㸪ศᩓᛶࡀࡼࡃ࡞ࡿ㸬㠀⿕そ◒⢏ࡼࡾ㒊ศ Ni ⿕そ◒⢏ࡢจ 㞟⋡ࡣࡸࡸ㧗࠸ࡀ㸪◒⢏ࡢᯒฟ㔞ࡀከࡃ࡞ࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬 (3) 㒊ศ Ni ⿕そ◒⢏ࢆ౑⏝ࡍࡿࡇ࡜࡟ࡼࡾࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ㗦࠸ษࢀลࡀእྥࡁ࡟࡞ࡾ㸪◊๐᢬ᢠࡀపࡃ࡞ ࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬◒⢏ࡢಖᣢຊࡀຎࡿࡇ࡜࡞ࡃඃࢀࡓ◊๐≉ᛶࡀ⥔ᣢ࡛ࡁࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬 (4) 㒊ศ Ni ⿕そ◒⢏ࢆ⏝࠸ࡓ㟁╔ᕤලࡣ඲㠃 Ni ⿕そ◒⢏࡟ẚ࡭࡚◒⢏ࡢจ㞟ࡀᑡ࡞ࡃ࡚ศᩓᛶࡀࡼ࠸ࡓࡵ㸪◊ ๐㠃⢒ࡉࡀⰋዲ࡛࠶ࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬Ni ⓶⭷ࡢ๤㞳᫬㛫ࢆ 40 min ࡟ࡋࡓ◒⢏ࢆ౑⏝ࡋࡓᕤලࡢ◊๐≉ᛶ ࡀ᭱ࡶඃࢀࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬 ᭱ᚋ࡟㸪ᮏ◊✲ࢆ⾜࠺࡟ᙜࡓࡗ࡚ᐇ㦂࡟༠ຊࡉࢀࡓ❧࿨㤋኱ᏛඖᏛ⏕࣭ᐆ⏣┿࿃Ặ㸪୰ᕝ᫭ᏹẶ㸪ᶫ∎㞝኱ Ặ㸪㔠೧Ặ࡟ᚰࡼࡾឤㅰ࠸ࡓࡋࡲࡍ㸬 ᩥ ⊩ ༓ⴥᗣ㞞, ㇂Ὀᘯ, ᴮᮏಇஅ, 㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㧗㏿〇㐀ἲࡢ㛤Ⓨ, ᪥ᮏᶵᲔᏛ఍ㄽᩥ㞟 C ⦅, Vol.69, No.680 (2003), pp.303-309. ᴮᮏⱥᙪ, ྂᕝ┤἞, ᯇᮧ᐀㡰, 」ྜ ࡵࡗ ࡁ, ᪥หᕤᴗ᪂⪺♫ (1989), p.4. ๓⏣▱ὒ, ◊๐⏝㟁╔࣍࢖࣮ࣝࡢ⤂௓, ◒⢏ຍᕤᏛ఍ㄅ, Vol.57, No.8 (2013), pp.502-505. ୰ᕝ᫭ᏹ, ᐆ⏣┿࿃, ㇂Ὀᘯ, 㟁╔ᕤල⏝㒊ศࢥ࣮ࢸ࢕ࣥࢢࢲ࢖ࣖࣔࣥࢻ◒⢏ࡢ㛤Ⓨ, 2008 ᖺᗘ⢭ᐦᕤᏛ఍⛅Ꮨ኱ ఍Ꮫ⾡ㅮ₇఍ㅮ₇ㄽᩥ㞟 (2008), pp.467-468. ᩪ⸨ᅖ, ᮏ㛫ⱥኵ, ᒣୗႹே, ᪂ࡵࡗࡁᢏ⾡ (2011), p.75 బ⸨㔠ྖ, 㕥ᮌᩘኵ, 㟁╔ࢲ࢖ࣖࣔࣥࢻ◒▼ࡢసᡂ࡜ࡑࡢ◊๐ᣲື, 㔠ᒓ⾲㠃ᢏ⾡, Vol.33, No.6 (1982), pp.285-290. బ⸨㔠ྖ, 㕥ᮌᩘኵ, 㟁╔ࢲ࢖ࣖࣔࣥࢻ◒▼ࡢᛶ⬟࡟ᑐࡍࡿ◒⢏≀ᛶࡢຠᯝ, 㔠ᒓ⾲㠃ᢏ⾡, Vol.38, No.3 (1987), pp.92-96.

Webster, J. and Tricard, M., Innovations in abrasive products for precision grinding, CIRP Annals - Manufacturing Technology, Vol.53, No.2 (2004), pp.597-617.

電着工具用の部分Ni 被覆ダイヤモンド砥粒の開発

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࣡࢖ࣖ᧿㐣᥼⏝࢙࢘ࢵࢺ࢚ࢵࢳࣥࢢ࡟ࡼࡿࢩࣜࢥࣥ࢖ࣥࢦࢵࢺࡢ

ษ᩿ࡢᇶ♏ⓗ᳨ウ

㇂ Ὀᘯ

1)

_{㸪ᙇ Ᏹ}

1)

_{㸪ᮧ⏣㡰஧}

2) ᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

A feasibility study for the application for slicing Si ingots using a wet etching

assisted by wire-friction

Yasuhiro TANI

1)

_{, Yu ZHANG}

1)

_and

_{Junji MURATA}

2)

Silicon (Si) wafers for electronic or photovoltaic devices are fabricated by slicing a Si ingot using mechanical slicing with a diamond wire. Recently, the slicing method without generating damage on Si surface has been strongly required because of the increasing demand of ultra-thin Si wafers. In this study, we have developed a novel machining method for Si grooving based on a wet chemical etching. In this method, Si was processed by the chemical etching in HNO3 and HF mixture combined with an abrasion effect of metallic wires that contains no abrasives. The extremely

low kerf loss with approx. 100 ȝm was achieved by optimizing the composition of etchant. SEM observation showed that Si surfaces processed by the proposed method had no crack and tool mark contrary to the mechanical slicing. Furthermore, Raman microscopy exhibited that the proposed method generated no disordered layer on Si surfaces, whereas the mechanical slicing caused amorphous layers. Surface roughness was improved by adding CH3COOH to the

etchant.

Key Words : Silicon, Etching, Slicing, Mixed acid, Kerf loss

᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

立命館大学理工学研究所紀要: 第73号