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MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS

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TSOT−23, 6 LEAD CASE 419AF−01

ISSUE O

DATE 19 DEC 2008

E1 E

A2

A1 e

b D

c A

TOP VIEW

SIDE VIEW END VIEW

L1

L L2

Notes:

(1) All dimensions are in millimeters. Angles in degrees.

(2) Complies with JEDEC MO-193.

SYMBOL

θ

MIN NOM MAX

q A A1 A2 b c D E E1

e L

0º 8º

L1 L2

0.01 0.80 0.30 0.12

0.30

0.05 0.87

0.15 2.90 BSC 2.80 BSC 1.60 BSC 0.95 TYP

0.40 0.60 REF 0.25 BSC

1.00 0.10 0.90 0.45 0.20

0.50

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.

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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1 TSOT−23, 6 LEAD

© Semiconductor Components Industries, LLC, 2019

www.onsemi.com

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