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Bump bonding

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C.3 Bump bonding

One of most difficult parts of realizing CdTe and/or CdZnTe pixel detectors is to establish a simple and robust connection technology for these fragile devices. It should be noted that high compression and/or high ambient temperature would damage the CdTe crystal.

Also, the coplanarity of the CdTe wafer is measured to be 2 µm at most, which is much worse than that of usual silicon wafers. Usual indium-ball soldering might not be appropriate for this purpose. Also, indium is easily oxidizable and needs flux which could contaminate the detector surface.

Therefore, we adopted a stud-bump method[83,130]. To prevent possible stress on the device, we choose a combination of soft metal, gold and indium, as a stud. In order to attain good connection between the bond pad on the readout board and the pixel electrode on the CdTe wafer, a needle-shaped stud consisting of two stages of gold studs is prepared on the bump pad (Fig. C.5). Studs are made from a gold stud bonder with a 25 µm diameter gold wire, and a thin layer of indium is printed on the top of the stud to improve connectivity. The total height of the stud from bottom to top is 150–

200 µm. The CdTe wafer and the fanout board are then pressed together with 20 g of compression per bump under controlled temperature conditions. To increase mechanical strength, epoxy resin with low viscosity is filled into the space between the CdTe wafer and the fanout board.

Figure C.5: Photograph of studs83

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Acknowledgement

Words cannot express my thanks to Prof. T. Takahashi for guiding me throughout the five years at ISAS. I also wish to thank Dr. S. Watanabe, Dr. K. Nakazawa, Dr. H.

Tajima, Dr. M. Kokubun and Dr. T. Tanaka for their guidance and continuous support.

The Si/CdTe Compton camera consists of many semiconductors and a lot of acknowl-edgement. H. Odaka, S. Ishikawa and H. Aono who are the reliable “samurai”s of the Compton team in the Takahashi Lab have contributed to the Compton camera develop-ment, building and experiments. H. Yasuda and S. Okuyama from Hiroshima University and The University of Tokyo are the great contributors to the Double-sided Silicon strip detector. I thank Y. Kuroda, M. Onishi and K. Genba from the Nagoya Guidance and Propulsion System Works, Mitsubishi Heavy Industries Ltd. for collaborating with us in developing the Compton camera. S. Kubo from Clearpulse Ltd. helped me many times when the electronics of the Compton camera broke down. H. Toyokawa from SPring-8 who helped out on the experiments for polarization measurements. For the imaging ex-periment at Gumma University, I really appreciate the great effort by Dr. N. Kawachi from the Quantum Beam Science Directorate, The Japan Atomic Energy Agency. I am grateful to Dr. T. Nakano, Dr. H. Shimada and Dr. Y. Yamaguchi at Gumma University for the great kindness they showed us. For the mouse imaging at RIKEN, I thank Dr. S.

Motomura and Dr. S. Enomoto. I thank the Japan Society for the Promotion of Science (JSPS) for their economical support through my doctoral course.

Finally, I wish to thank my family for supporting my happy academic life.

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