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Dynamic Linking Method for an Embedded Component System

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(1)

Dynamic Linking Method for

an Embedded Component System

Katsuya Yamauchi

1,a)

Tomoaki Kawada

1

Hiroshi Oyama

2

Takuya Azumi

3

Hiroaki Takada

1

Abstract: This paper presents a dynamic linking method using the TOPPERS Embedded Component System (TECS).

Dynamic linking mechanisms (e.g., Shared Object and Dynamic Link Library) are responsible for loading and linking software modules at run-time. Such mechanisms are useful to allow a software module to be combined with other modules which are not known beforehand during the module’s development, such as third-party applications and fu-ture versions of an application that is intended to be combined with the said module. Another benefit is the ability to update application modules individually, and to reduce the delivery cost of software updates. Those mechanisms have been put into practical use in general-purpose software systems. The use of a dynamic linking mechanism for embedded systems is also being considered; however, existing solutions are not always appropriate for embedded sys-tems because of their tight memory constraints. Therefore, this paper proposes a linking method suitable for embedded systems that utilizes TECS, which has the advantage of ensuring interface consistency.

Keywords: Dynamic Linking, TECS, Loadable Module, Component-based Development, Embedded System

1.

Introduction

Dynamic linking mechanisms (e.g., Shared Object and Dy-namic Link Library) are responsible for loading and linking soft-ware modules at run-time [1], [2]. Such mechanisms are useful to allow a software module to be combined with other modules which are not known beforehand during the module’s develop-ment. Another benefit is the ability to update application modules individually, and to reduce the delivery cost of software updates. Those mechanisms have been put into practical use in general-purpose software systems. On the other hand, in recent years, a technology for updating software wirelessly (over-the-air pro-gramming) has become widespread [3]. By using these technolo-gies, partial software updates can be done efficiently. However, there is a problem that the memory amount required for link-age resolution becomes large. For this reason, existing solutions are not always appropriate for embedded systems that have tight memory constraints.

TOPPERS Embedded Component System (TECS) is a com-ponent system suitable for embedded systems [4]. Comcom-ponent system is a system that is divided into subsystems and made into parts to improve reusability. Dividing into subsystems fa-cilitates parallel development and module changes. By using TECS, systems can enjoy the benefits of component-based devel-opment (e.g., reduction of initialization time and suppression of increased memory usage) without reducing execution efficiency [5], [6], [7]. Therefore, development suitable for a real-time sys-tem can be performed.

This paper proposes a dynamic linking method suitable for

em-1 Nagoya University, Nagoya, Japan

2 OKUMA Corporation, Niwa-gun, Japan

3 Saitama University, Saitama, Japan a) [email protected]

bedded systems utilizing TECS. By utilizing TECS, the benefits of component-based development can be applied to embedded systems. Therefore, even the embedded systems with tight mem-ory constraints can use the dynamic linking mechanisms appro-priately while suppressing the increase in memory usage.

In this study, we first applied TECS to a dynamic loading mode of TOPPERS/EV3RT which is a target environment of this study. Then, we designed a dynamic linking method utilizing TECS for TOPPERS/EV3RT and checked the operation if it works prop-erly.

Our contributions in this paper are as follows:

( 1 ) We designed to apply TECS to a dynamic loading mode of TOPPERS/EV3RT so that the functions by TECS can be used in this platform.

( 2 ) We designed an API that utilizes TECS and implemented a dynamic linking method in embedded systems.

( 3 ) We evaluated the application size before and after using TECS.

The remainder of this paper is organized as follows. After de-scribing TECS and TOPPERS/EV3RT in Section 2, we will intro-duce the flow of applying TECS to TOPPERS/EV3RT in Section 3. Section 4 includes the design of the dynamic linking method utilizing TECS and comparison of application size. Finally, Sec-tion 5 concludes the paper and offers an outlook for future re-search.

2.

Background

In this section, we describe TECS and TOPPERS/EV3RT, which our study targets.

2.1 TECS

TECS is a component system suitable for embedded systems. We explain the development process, component model, and Asia Pacific Conference on Robot IoT System Development and Platform 2020 (APRIS2020)

(2)

Asia Pacific Conference on Robot IoT System Development and Platform 2020 (APRIS2020)

(3)

Asia Pacific Conference on Robot IoT System Development and Platform 2020 (APRIS2020)

(4)

Asia Pacific Conference on Robot IoT System Development and Platform 2020 (APRIS2020)

(5)

Asia Pacific Conference on Robot IoT System Development and Platform 2020 (APRIS2020)

参照

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