© Semiconductor Components Industries, LLC, 2013
October, 2013 − Rev. 4 1 Publication Order Number:
NJD1718/D
Power Transistors
PNP Silicon DPAK For Surface Mount Applications
Designed for high−gain audio amplifier and power switching applications.
Features
• Low Collector−Emitter Saturation Voltage
• High Switching Speed
• Epoxy Meets UL 94 V−0 @ 0.125 in
• NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Base Voltage V
CB−50 Vdc
Collector−Emitter Voltage V
CEO−50 Vdc
Emitter−Base Voltage V
EB−5 Vdc
Collector Current − Continuous I
C−2 Adc
Collector Current − Peak I
CM−3 Adc
Base Current I
B−0.4 Adc
Total Device Dissipation
@ T
C= 25 ° C Derate above 25°C
P
D0.1 15 W W/°C Total Device Dissipation
@ T
A= 25°C (Note 1) Derate above 25°C
P
D0.011 1.68 W W/°C Operating and Storage Junction
Temperature Range T
J, T
stg−65 to +150 °C
ESD − Human Body Model HBM 3B V
ESD − Machine Model MM C V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance Junction−to−Case
Junction−to−Ambient (Note 2) R
qJCR
qJA10
89.3
°C/W 2. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
Device Package Shipping
†ORDERING INFORMATION
SILICON
POWER TRANSISTORS 2 AMPERES
50 VOLTS 15 WATTS
MARKING DIAGRAM
A = Assembly Location
Y = Year
WW = Work Week G = Pb−Free Device
DPAK CASE 369C
STYLE 1
AYWW J 1718G 1 2 3
4 http://onsemi.com
NJD1718T4G DPAK
(Pb−Free) 2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
1 BASE
3 EMITTER COLLECTOR
2, 4
NJVNJD1718T4G DPAK
(Pb−Free) 2500 / Tape & Reel
NJD1718, NJVNJD1718
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ELECTRICAL CHARACTERISTICS (T
C= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
OFF CHARACTERISTICS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector−Emitter Breakdown Voltage (Note 3) (I
C= −10 mAdc, I
B= 0)
ÎÎÎÎÎ
ÎÎÎÎÎ
BV
CEO ÎÎÎÎÎÎ
−50
ÎÎÎÎ
ÎÎÎÎ ÎÎÎ
ÎÎÎ
−
ÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector Cutoff Current (V
CB= −50 Vdc, I
E= 0)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
I
CBOÎÎÎ
ÎÎÎ
ÎÎÎ
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ ÎÎÎ
ÎÎÎ
ÎÎÎ
−100
ÎÎÎ
ÎÎÎ
ÎÎÎ
nAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Emitter Cutoff Current (V
BE= −5 Vdc, I
C= 0)
ÎÎÎÎÎÎÎÎÎÎ
I
EBOÎÎÎ
ÎÎÎ
−
ÎÎÎÎÎÎÎÎ ÎÎÎ
ÎÎÎ
−100
ÎÎÎÎÎÎ
nAdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ON CHARACTERISTICS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DC Current Gain (Note 3) (I
C= −0.5 A, V
CE= 2 V) (I
C= −1.5 Adc, V
CE= 2 Vdc)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
h
FE ÎÎÎÎÎÎ
ÎÎÎ
70 40
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ ÎÎÎ
ÎÎÎ
ÎÎÎ
240 −
ÎÎÎ
ÎÎÎ
ÎÎÎ
−
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Collector−Emitter Saturation Voltage (Note 3) (I
C= −1 A, I
B= −0.05 A)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
V
CE(sat)ÎÎÎ
ÎÎÎ
ÎÎÎ
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
−0.2
ÎÎÎ
ÎÎÎ
ÎÎÎ
−0.5
ÎÎÎ
ÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Base−Emitter Saturation Voltage (Note 3) (I
C= −1 A, I
B= −0.05 Adc)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
V
BE(sat) ÎÎÎÎÎÎ
ÎÎÎ
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
−
ÎÎÎ
ÎÎÎ
ÎÎÎ
−1.2
ÎÎÎ
ÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Base−Emitter On Voltage (Note 3) (I
C= −1 Adc, V
CE= −2 Vdc)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
V
BE(on) ÎÎÎÎÎÎ
ÎÎÎ
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
−
ÎÎÎ
ÎÎÎ
ÎÎÎ
−1.2
ÎÎÎ
ÎÎÎ
ÎÎÎ
Vdc
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
DYNAMIC CHARACTERISTICS
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Current−Gain − Bandwidth Product (Note 4)
(I
C= −500 mAdc, V
CE= −2 Vdc, f
test= 10 MHz)
ÎÎÎÎÎÎÎÎÎÎ
f
TÎÎÎ
ÎÎÎ
−
ÎÎÎÎÎÎÎÎ
80
ÎÎÎÎÎÎ
−
ÎÎÎÎÎÎ
MHz
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Output Capacitance
(V
CB= 10 Vdc, I
E= 0, f = 0.1 MHz)
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
C
ob ÎÎÎÎÎÎ
ÎÎÎ
−
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
33
ÎÎÎ
ÎÎÎ
ÎÎÎ
−
ÎÎÎ
ÎÎÎ
ÎÎÎ
pF
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Switching Timers V
CC= −30 V, I
C= −1 A
ÎÎÎÎÎ
ÎÎÎÎÎ
t
ON ÎÎÎÎÎÎ
−
ÎÎÎÎÎÎÎÎ
55
ÎÎÎÎÎÎ
−
ÎÎÎÎÎÎ
ÎÎÎ
ÎÎÎ
ns
ÎÎÎÎÎ
ÎÎÎÎÎ
t
STG ÎÎÎÎÎÎ
−
ÎÎÎÎÎÎÎÎ
320
ÎÎÎÎÎÎ
−
ÎÎÎÎÎ
ÎÎÎÎÎ
t
fÎÎÎ
ÎÎÎ
−
ÎÎÎÎÎÎÎÎ
40
ÎÎÎÎÎÎ
− 3. Pulse Test: Pulse Width = 300 m s, Duty Cycle [ 2%.
4. f
T= ⎪h
fe⎪• f
test.
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TYPICAL CHARACTERISTICS
I
C, COLLECTOR CURRENT (A) V
CE(sat), COLLECT OR − EMITTER SA TURA TION VOL TAGE (V)
I
C/I
B= 20
I
C, COLLECTOR CURRENT (A) V
BE(sat), BASE − EMITTER SA TURA TION VOL TAGE (V)
I
C, COLLECTOR CURRENT (A) h
FE, DC CURRENT GAIN
Figure 1. DC Current Gain Figure 2. Collector−Emitter Saturation Voltage
Figure 3. Base−Emitter Saturation Voltage Figure 4. Base−Emitter Voltage I
C, COLLECTOR CURRENT (A) V
BE(on), BASE − EMITTER VOL TAGE (V)
0 100 200 300
0.001 0.01 0.1 1 10
−55°C 25°C 150°C
V
CE= 2.0 V
0 0.2 0.4 0.6 0.8 1 1.2
0.001 0.01 0.1 1 10
−55°C
25°C 150°C
0.20 0.40 0.60 0.80 1.00 1.20 1.40
0.001 0.01 0.1 1 10
−55°C
25°C 150°C I
C/I
B= 20
0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 1.10 1.20
0.001 0.01 0.1 1 10
V
CE= 2.0 V
−55 ° C 25°C
150 ° C
1 10 100 1000
0.1 1 10 100
C, CAP ACIT ANCE (pF)
V
R, REVERSE VOLTAGE (V) Figure 5. Capacitance
T
A= 25°C C
ibC
ob10 100
I
C, COLLECTOR CURRENT (A)
Figure 6. Current−Gain−Bandwidth Product V
CE= 2.0 V
T
A= 25°C
f
T, CURRENT − GAIN − BANDWIDTH PRODUCT
0.001 0.01 0.1 1 10
NJD1718, NJVNJD1718
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TYPICAL CHARACTERISTICS
0.1 1 10
1 10 100
100 ms
1.0 ms 1.0 s
V
CE, COLLECTOR EMITTER VOLTAGE (V) Figure 7. State Operating Area I
C, COLLECT OR CURRENT (A)
10 ms
0 8 16
0 80 160
T
A, AMBIENT TEMPERATURE (°C) Figure 8. Power Derating P
D, POWER DISSIP ATION (W)
2 4 6 10 12 14
140 120 100 60
40 20
t, TIME (ms) 0.01
0.02 0.05 0.1 0.2 0.5 1 2 5 10 20 50 100 200
1
0.2 0.1 0.05
r(t) , TRANSIENT THERMAL R
qJC(t) = r(t) q
JCR
qJC= 10 ° C/W MAX
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t
1T
J(pk)- T
C= P
(pk)q
JC(t)
P
(pk)t
1t
2DUTY CYCLE, D = t
1/t
20.2
0 (SINGLE PULSE)
RESIST ANCE (NORMALIZED)
Figure 9. Thermal Response
0.5 D = 0.5
0.05 0.3 0.7
0.07 0.03 0.02
0.1
0.02
0.01
DPAK (SINGLE GAUGE) CASE 369C
ISSUE F
DATE 21 JUL 2015 SCALE 1:1
STYLE 1:
PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR
STYLE 2:
PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN
STYLE 3:
PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE
STYLE 4:
PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE
STYLE 5:
PIN 1. GATE 2. ANODE 3. CATHODE 4. ANODE STYLE 6:
PIN 1. MT1 2. MT2 3. GATE 4. MT2
STYLE 7:
PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR
1 2 3 4
STYLE 8:
PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE
STYLE 9:
PIN 1. ANODE 2. CATHODE 3. RESISTOR ADJUST 4. CATHODE
STYLE 10:
PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE
b D E
b3
L3
L4 b2
0.005 (0.13)
MC
c2 A
c
C
Z
DIM MIN MAX MIN MAX MILLIMETERS INCHES
D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 A 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61
e 0.090 BSC 2.29 BSC b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01 L 0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z 0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI- MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
7. OPTIONAL MOLD FEATURE.
1 2 3
4
XXXXXX = Device Code A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package AYWW XXX XXXXXG XXXXXXG
ALYWW
Discrete IC
5.80 0.228
2.58 0.102
1.60 0.063 6.20
0.244
3.00 0.118
6.17 0.243
ǒ
inchesmmǓ
SCALE 3:1
GENERIC MARKING DIAGRAM*
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H 0.370 0.410 9.40 10.41 A1 0.000 0.005 0.00 0.13
L1 0.114 REF 2.90 REF L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING PLANE
A
B
C
L1 L
H L2
GAUGEPLANEDETAIL A
ROTATED 90 CW5
e BOTTOM VIEW
Z
BOTTOM VIEW SIDE VIEW
TOP VIEW
ALTERNATE CONSTRUCTIONS NOTE 7
Z
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
98AON10527D DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1 DPAK (SINGLE GAUGE)
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