NGTB40N60IHLWG IGBT
This Insulated Gate Bipolar Transistor (IGBT) features a robust and cost effective Field Stop (FS) Trench construction, and provides superior performance in demanding switching applications, offering both low on state voltage and minimal switching loss. The IGBT is well suited for half bridge resonant applications. Incorporated into the device is a soft and fast co−packaged free wheeling diode with a low forward voltage.
Features
• Low Saturation Voltage using Trench with Fieldstop Technology
• Low Switching Loss Reduces System Power Dissipation
• Low Gate Charge
• Soft, Fast Free Wheeling Diode
• These are Pb−Free Devices
Typical Applications• Inductive Heating
• Soft Switching
ABSOLUTE MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−emitter voltage VCES 600 V
Collector current
@ TC = 25°C
@ TC = 100°C
IC
80 40
A
Pulsed collector current, Tpulse limited by TJmax
ICM 200 A
Diode forward current
@ TC = 25°C
@ TC = 100°C
IF
80 40
A
Diode pulsed current, Tpulse limited by TJmax
IFM 200 A
Gate−emitter voltage VGE $20 V
Power Dissipation
@ TC = 25°C
@ TC = 100°C
PD
250 50
W
Operating junction temperature range
TJ −55 to +150 °C Storage temperature range Tstg −55 to +150 °C Lead temperature for soldering, 1/8”
from case for 5 seconds
TSLD 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
TO−247 CASE 340AL C
G
40 A, 600 V V
CEsat= 2.0 V
E
off= 0.4 mJ
E
Device Package Shipping ORDERING INFORMATION
www.onsemi.com
A = Assembly Location
Y = Year
WW = Work Week G = Pb−Free Package
MARKING DIAGRAM
40N60IHL AYWWG G
E C
THERMAL CHARACTERISTICS
Rating Symbol Value Unit
Thermal resistance junction−to−case, for IGBT RqJC 0.87 °C/W
Thermal resistance junction−to−case, for Diode RqJC 1.46 °C/W
Thermal resistance junction−to−ambient RqJA 40 °C/W
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter Test Conditions Symbol Min Typ Max Unit
STATIC CHARACTERISTIC Collector−emitter breakdown voltage, gate−emitter short−circuited
VGE = 0 V, IC = 500 mA V(BR)CES 600 − − V
Collector−emitter saturation voltage VGE = 15 V, IC = 40 A VGE = 15 V, IC = 40 A, TJ = 150°C
VCEsat −
−
2.0 2.6
2.4
−
V Gate−emitter threshold voltage VGE = VCE, IC = 150 mA VGE(th) 4.5 5.5 6.5 V Collector−emitter cut−off current, gate−
emitter short−circuited
VGE = 0 V, VCE = 600 V VGE = 0 V, VCE = 600 V, TJ = 150°C
ICES −
−
−
−
0.2 2
mA Gate leakage current, collector−emitter
short−circuited
VGE = 20 V , VCE = 0 V IGES − − 100 nA
DYNAMIC CHARACTERISTIC Input capacitance
VCE = 20 V, VGE = 0 V, f = 1 MHz
Cies − 3100 − pF
Output capacitance Coes − 120 −
Reverse transfer capacitance Cres − 80 −
Gate charge total
VCE = 480 V, IC = 40 A, VGE = 15 V
Qg 130 nC
Gate to emitter charge Qge 29
Gate to collector charge Qgc 67
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD Turn−on delay time
TJ = 25°C VCC = 400 V, IC = 40 A
Rg = 10 W VGE = 0 V/ 15V
td(on) 70 ns
Rise time tr 40
Turn−off delay time td(off) 140
Fall time tf 70
Turn−off switching loss Eoff 0.4 mJ
Turn−on delay time
TJ = 150°C VCC = 400 V, IC = 40 A
Rg = 10 W VGE = 0 V/ 15V
td(on) 70 ns
Rise time tr 40
Turn−off delay time td(off) 140
Fall time tf 90
Turn−off switching loss Eoff 0.8 mJ
DIODE CHARACTERISTIC
Forward voltage VGE = 0 V, IF = 40 A
VGE = 0 V, IF = 40 A, TJ = 150°C
VF 1.3
1.35
1.5 V
Reverse recovery time TJ = 25°C
IF = 40 A, VR = 200 V diF/dt = 200 A/ms
trr 400 ns
Reverse recovery charge Qrr 5500 nc
Reverse recovery current Irrm 25 A
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL CHARACTERISTICS
140 120 100 80 60 40 20 0
0 1 2 3 4 5 6 7 8
VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)
Figure 1. Output Characteristics VGE = 17 V to 15 V
11 V 10 V 9 V 7 V to 8 V TJ = 25°C
13 V VGE = 17 V
to 13 V
11 V 10 V 9 V 8 V 7 V TJ = 150°C
0 1 2 3 4 5 6 7 8
140 120 100 80 60 40 20 0
VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)
Figure 2. Output Characteristics
140 120 100 80 60 40 20 0
0 1 2 3 4 5 6 7 8
160
VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)
Figure 3. Output Characteristics TJ = −55°C VGE = 17 V
to 13 V
11 V 10 V 9 V 7 V to 8 V
VGE, GATE−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)
Figure 4. Typical Transfer Characteristics TJ = 25°C
TJ = 150°C 140
120 100 80 60 40 20 0
0 4 8 12 16
−75 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50
0 −25 25 75 125 175
TJ, JUNCTION TEMPERATURE (°C) VCE, COLLECTOR−EMITTER VOLT- AGE (V)
Figure 5. VCE(sat) vs. TJ IC = 80 A
IC = 40 A IC = 20 A IC = 5 A
0 10 20 90 100
10000
1000
100
10 30 40 50 60 70 80
VCE, COLLECTOR−EMITTER VOLTAGE (V)
CAPACITANCE (pF)
Figure 6. Typical Capacitance Cies
Coes Cres
TYPICAL CHARACTERISTICS
VF, FORWARD VOLTAGE (V) IF, FORWARD CURRENT (A)
Figure 7. Diode Forward Characteristics TJ = 25°C
TJ = 150°C 120
100 80 60 40 20 0
0 0.5 1 1.5 2 2.5
20
0
QG, GATE CHARGE (nC) VGE, GATE−EMITTER VOLTAGE (V)
Figure 8. Typical Gate Charge
20 40 60 80 100 120 140
15
10
5
0
VCE = 480 V
TJ, JUNCTION TEMPERATURE (°C) Eoff, TURN−OFF SWITCHING LOSS (mJ)
Figure 9. Switching Loss vs. Temperature VCE = 400 V
VGE = 15 V IC = 40 A Rg = 10 W 1.2
0 20 40 120 140 160
1 0.8 0.6 0.4 0.2 0
60 80 100
TJ, JUNCTION TEMPERATURE (°C)
SWITCHING TIME (ns)
Figure 10. Switching Time vs. Temperature 1000
0 20 40 60 80 100 120 140
100
10
1
160 VCE = 400 V
VGE = 15 V IC = 40 A Rg = 10 W
td(off) td(on) tf
tr
IC, COLLECTOR CURRENT (A) Eoff, TURN−OFF SWITCHING LOSS (mJ)
Figure 11. Switching Loss vs. IC 2.5
4 16 28 40 52 64 76 88
2
1.5 1 0.5
0
VCE = 400 V VGE = 15 V TJ = 150°C Rg = 10 W
SWITCHING TIME (ns)
1000
100
10
1
IC, COLLECTOR CURRENT (A)
Figure 12. Switching Time vs. Temperature
4 20 32 44 56 68 80
VCE = 400 V VGE = 15 V TJ = 150°C Rg = 10 W
td(off) td(on)
tf
tr
TYPICAL CHARACTERISTICS
Eoff, TURN−OFF SWITCHING LOSS (mJ)
RG, GATE RESISTOR (W) Figure 13. Switching Loss vs. RG 1.6
5 1.4 1.2 1 0.8 0.6 0.4 0.2 0
15 25 35 45 55 65 75 85
VCE = 400 V VGE = 15 V
IC = 40 A TJ = 150°C
SWITCHING TIME (ns)
RG, GATE RESISTOR (W) Figure 14. Switching Time vs. RG 1000
5 15 25 35 45 55 65 75 85
100
10
1
VCE = 400 V VGE = 15 V
IC = 40 A TJ = 150°C td(off)
td(on) tf tr
VCE, COLLECTOR−EMITTER VOLTAGE (V) Figure 15. Switching Loss vs. VCE Eoff, TURN−OFF SWITCHING LOSS (mJ)
1.4
175 225 275 325 375 425 475 525 575
1.2 1 0.8 0.6 0.4 0.2 0
VGE = 15 V IC = 40 A RG = 10 W TJ = 150°C
SWITCHING TIME (ns)
VCE, COLLECTOR−EMITTER VOLTAGE (V) Figure 16. Switching Time vs. VCE 1000
100
10
1
175 225 275 325 375 425 475 525 575
td(off) td(on) tf
tr
VGE = 15 V IC = 40 A RG = 10 W TJ = 150°C
1000
1
VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)
Figure 17. Safe Operating Area
10 100 1000
100
10 1
0.1 0.01
50 ms
100 ms 1 ms
dc operation
Single Nonrepetitive Pulse TC = 25°C Curves must be derated linearly with increase in temperature
Figure 18. Reverse Bias Safe Operating Area VCE, COLLECTOR−EMITTER VOLTAGE (V) IC, COLLECTOR CURRENT (A)
1000 100
10 11
10 100 1000
VGE = 15 V, TC = 125°C
TYPICAL CHARACTERISTICS
50% Duty Cycle 20%
10%
5%
2%
1%
Single Pulse
RqJC = 0.87
Figure 19. IGBT Transient Thermal Impedance
R(t) (°C/W)
PULSE TIME (sec) 0.001
0.01 0.1 1
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
0.001 0.01 0.1 1 10
0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Figure 20. Diode Transient Thermal Impedance PULSE TIME (sec)
R(t) (°C/W)
RqJC = 1.46 50% Duty Cycle
20%
10%
5%
2%
1%
Single Pulse
Junction Case
C1 C2
R1 R2 Rn
Ci = ti/Ri
Duty Factor = t1/t2 Peak TJ = PDM x ZqJC + TC
Cn
ti (sec) 1.0E−4 5.48E−5
0.002 0.03 0.1 Ri (°C/W) 0.04077 0.09054 0.16141 0.21558 0.24842
2.0 0.11759
Junction Case
C1 C2
R1 R2 Rn
Ci = ti/Ri
Duty Factor = t1/t2 Peak TJ = PDM x ZqJC + TC
Cn
ti (sec) 1.48E−4
0.002 0.03
0.1 2.0 Ri (°C/W) 0.18019 0.37276 0.45472 0.33236 0.11759
Figure 21. Test Circuit for Switching Characteristics
Figure 22. Definition of Turn On Waveform
Figure 23. Definition of Turn Off Waveform
TO−247 CASE 340AL
ISSUE D
DATE 17 MAR 2017
GENERIC MARKING DIAGRAM*
XXXXX = Specific Device Code A = Assembly Location
Y = Year
WW = Work Week G = Pb−Free Package
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”, may or may not be present.
SCALE 1:1
XXXXXXXXX AYWWG E2
L1 D
L
b4 b2
b E
0.25 M B AM c
A1 A
1 2 3
B
e
2X
3X
0.635M B AM A
S P
SEATING PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. SLOT REQUIRED, NOTCH MAY BE ROUNDED.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH.
MOLD FLASH SHALL NOT EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE MEASURED AT THE OUTERMOST EXTREME OF THE PLASTIC BODY.
5. LEAD FINISH IS UNCONTROLLED IN THE REGION DEFINED BY L1.
6.∅P SHALL HAVE A MAXIMUM DRAFT ANGLE OF 1.5° TO THE TOP OF THE PART WITH A MAXIMUM DIAMETER OF 3.91.
7. DIMENSION A1 TO BE MEASURED IN THE REGION DEFINED BY L1.
DIM MIN MAX MILLIMETERS
D 20.80 21.34 E 15.50 16.25 A 4.70 5.30
b 1.07 1.33 b2 1.65 2.35
e 5.45 BSC A1 2.20 2.60
c 0.45 0.68
L 19.80 20.80
Q 5.40 6.20 E2 4.32 5.49
L1 3.81 4.32 P 3.55 3.65 S 6.15 BSC b4 2.60 3.40 NOTE 6
4
NOTE 7
Q
NOTE 4
NOTE 3
NOTE 5
E2/2
NOTE 4
F 2.655 ---
2XF
PACKAGE DIMENSIONS
98AON16119F DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1 TO−247
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.