NLAS325 Dual SPST Analog Switch, Low Voltage, Single Supply

Dual SPST Analog Switch, Low Voltage, Single Supply

The NLAS325 is a dual SPST (Single Pole, Single Throw) switch, similar to 1/2 a standard 4066. The device permits the independent selection of 2 analog/digital signals. Available in the Ultra−Small 8 package.

The use of advanced 0.6 CMOS process, improves the R

resistance considerably compared to older higher voltage technologies.

Features

• On Resistance is 20 Typical at 5.0 V

• Matching is < 1.0 Between Sections

• 2.0−6.0 V Operating Range

• Ultra Low < 5.0 pC Charge Injection

• Ultra Low Leakage < 1.0 nA at 5.0 V, 25 ° C

• Wide Bandwidth > 200 MHz, −3.0 dB

• 2000 V ESD (HBM)

• ^R

Flatness " 6.0 at 5.0 V

• Independent Enables; One Positive, One Negative

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant

V_CC NO1

COM1

GND IN2

NC2 1

2

3

8

7

6 COM2

IN1

4 5

Figure 1. Pinout

See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet.

ORDERING INFORMATION MARKING DIAGRAM

PIN ASSIGNMENT 1

2

3 IN2

NO1

4 GND 5

COM1

IN1 6

FUNCTION TABLE

L H On/Off Enable Input

Analog Switch 1

Off On 7

8 V_CC

COM2 NC2

US8 US SUFFIX

CASE 493 8

1

A9 = Device Code M = Date Code*

G = Pb−Free Package

Analog Switch 2

On Off www.onsemi.com

1 8

A9 MG G

(Note: Microdot may be in either location)

MAXIMUM RATINGS

Symbol Parameter Value Unit

V_CC DC Supply Voltage *0.5 to )7.0 V

V_I DC Input Voltage *0.5 to )7.0 V

V_O DC Output Voltage *0.5 to )7.0 V

I_IK DC Input Diode Current V_I < GND *50 mA

I_OK DC Output Diode Current V_O < GND *50 mA

I_O DC Output Sink Current $50 mA

I_CC DC Supply Current per Supply Pin $100 mA

I_GND DC Ground Current per Ground Pin $100 mA

T_STG Storage Temperature Range *65 to )150 °C

T_L Lead Temperature, 1.0 mm from Case for 10 Seconds 260 °C

T_J Junction Temperature under Bias )150 °C

JA Thermal Resistance (Note 1) 250 °C/W

P_D Power Dissipation in Still Air at 85°C 250 mW

MSL Moisture Sensitivity Level 1

F_R Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

V_ESD ESD Withstand Voltage Human Body Model (Note 2)

Machine Model (Note 3) Charged Device Model (Note 4)

> 2000

> 200 N/A

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

V_CC DC Supply Voltage 2.0 5.5 V

V_IN Digital Select Input Voltage GND 5.5 V

V_IS Analog Input Voltage (NC, NO, COM) GND V_CC V

T_A Operating Temperature Range *55 )125 °C

t_r, t_f Input Rise or Fall Time, SELECT V_CC = 3.3 V $ 0.3 V V_CC = 5.0 V $ 0.5 V

0 0

100 20

ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.

DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES

Junction

Temperature °C Time, Hours Time, Years

80 1,032,200 117.8

90 419,300 47.9

100 178,700 20.4

110 79,600 9.4

120 37,000 4.2

130 17,800 2.0

140 8,900 1.0

NORMALIZED FAILURE RATE

1

1 10 100 1000

FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR

Figure 2. Failure Rate vs. Time Junction Temperature TIME, YEARS

TJ = 130°C TJ = 120°C TJ = 110°C TJ = 100°C TJ = 90°C TJ = 80°C

DC CHARACTERISTICS − Digital Section (Voltages Referenced to GND)

Guaranteed Limit

Symbol Parameter Condition V_CC *555C to 255C t855C t1255C Unit V_IH Minimum High−Level Input

Voltage, Select Inputs

2.0 2.5 3.0 4.5 5.5

1.5 1.9 2.1 3.15 3.85

1.5 1.9 2.1 3.15 3.85

1.5 1.9 2.1 3.15 3.85

V

V_IL Maximum Low−Level Input Voltage, Select Inputs

2.0 2.5 3.0 4.5 5.5

0.5 0.6 0.9 1.35 1.65

0.5 0.6 0.9 1.35 1.65

0.5 0.6 0.9 1.35 1.65

V

I_IN Maximum Input Leakage Current, Select Inputs

V_IN = 5.5 V or GND 0 V to 5.5 V $0.2 $2.0 $2.0 A

I_CC Maximum Quiescent Supply Current

Select and V_IS = V_CC or GND 5.5 4.0 4.0 8.0 A

DC ELECTRICAL CHARACTERISTICS − Analog Section

Guaranteed Limit

Symbol Parameter Condition V_CC *555C to 255C t855C t1255C Unit R_ON Maximum “ON” Resistance

(Figures 16 − 22)

V_IN = V_IL or V_IH V_IS = GND to V_CC I_INI v 10 mA

2.5 3.0 4.5 5.5

85 45 30 25

95 50 35 30

105 55 40 35

R_FLAT(ON) ON Resistance Flatness (Figures 16 − 22)

V_IN = V_IL or V_IH I_INI v 10 mA

V_IS = 1.0 V, 2.0 V, 3.5 V

4.5 4.0 4.0 5.0

I_NC(OFF) I_NO(OFF)

NO or NC Off Leakage Current (Figure 8)

V_IN = V_IL or V_IH

V_NO or V_NC = 1.0 V_COM 4.5 V

5.5 1.0 10 100 nA

I_COM(ON) COM ON Leakage Current (Figure 8)

V_IN = V_IL or V_IH

V_NO 1.0 V or 4.5 V with V_NC floating or V_NO 1.0 V or 4.5 V with V_NO floating V_COM = 1.0 V or 4.5 V

5.5 1.0 10 100 nA

AC ELECTRICAL CHARACTERISTICS (Input t_r = t_f = 3.0 ns)

Guaranteed Maximum Limit V_CC V_IS *555C to 255C t855C t1255C

Symbol Parameter Test Conditions (V) (V) Min Typ* Max Min Max Min Max Unit

t_ON Turn−On Time (Figures 11 and 12)

R_L = 300 C_L = 35 pF (Figures 4 and 5)

2.5 3.0 4.5 5.5

2.0 2.0 3.0 3.0

5.0 5.0 2.0 2.0

23 16 11 9.0

35 24 16 14

5.0 5.0 2.0 2.0

38 27 19 17

5.0 5.0 2.0 2.0

41 30 22 20

ns

t_OFF Turn−Off Time (Figures 11 and 12)

R_L = 300 C_L = 35 pF (Figures 4 and 5)

2.5 3.0 4.5 5.5

2.0 2.0 3.0 3.0

1.0 1.0 1.0 1.0

7.0 5.0 4.0 3.0

12 10 6.0 5.0

1.0 1.0 1.0 1.0

15 13 9.0 8.0

1.0 1.0 1.0 1.0

18 16 12 11

ns

t_BBM Minimum Break−Before−Make Time

V_IS = 3.0 V (Figure 3) R_L = 300 C_L = 35 pF

2.5 3.0 4.5 5.5

2.0 2.0 3.0 3.0

1.0 1.0 1.0 1.0

12 11 6.0 5.0

1.0 1.0 1.0 1.0

1.0 1.0 1.0 1.0

ns

*Typical Characteristics are at 25°C.

Typical @ 25, V_CC = 5.0 V C_IN

C_NO orC_NC C_COM C_(ON)

Maximum Input Capacitance, Select Input Analog I/O (switch off)

Common I/O (switch off) Feedthrough (switch on)

8.0 10 10 20

pF

ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)

V_CC Typical

Symbol Parameter Condition (V) 25°C Unit

BW Maximum On−Channel −3.0 dB Bandwidth or Minimum Frequency Response (Figure 10)

V_IN = 0 dBm

V_IN centered between V_CC and GND (Figure 6)

3.0 4.5 5.5

145 170 175

MHz

V_ONL Maximum Feedthrough On Loss V_IN = 0 dBm @ 100 kHz to 50 MHz V_IN centered between V_CC and GND (Figure 6)

3.0 4.5 5.5

*2.0

*2.0

*2.0 dB

V_ISO Off−Channel Isolation (Figure 9) f = 100 kHz; V_IS = 1.0 V RMS V_IN centered between V_CC and GND (Figure 6)

3.0 4.5 5.5

*93

*93

*93 dB

Q Charge Injection Select Input to Common I/O (Figure 14)

V_{IN =} V_{CC to} GND, F_IS = 20 kHz t_r = t_f = 3.0 ns

R_IS = 0 , C_L = 1000 pF Q = C_L * V_OUT (Figure 7)

3.0 5.5

1.5 3.0

pC

THD Total Harmonic Distortion THD + Noise (Figure 13)

F_IS = 20 Hz to 100 kHz, R_L = Rgen = 600 , C_L = 50 pF

V_IS = 5.0 V_PP sine wave 5.5 0.1

% VCT Channel−to−Channel Crosstalk f = 100 kHz; V_IS = 1.0 V RMS

V_IN centered between V_CC and GND (Figure 6)

5.5 3.0

*90

*90 dB

10% 10%

50%

50%

Output Input

0 V

V_OH

V_OL 35 pF

V_CC

Output DUT

Open

Input

50%

90%

90%

50%

Output Input

0 V

35 pF Output

Open

Input

Input GND

90%

Output

GND Switch Select Pin

35 pF Output

DUT

Figure 3. t_BBM (Time Break−Before−Make) 300

V_CC

V_CC

90% of V_OH

Figure 4. t_ON/t_OFF

t_ON t_OFF

V_OH V_CC

Figure 5. t_ON/t_OFF

t_ON t_OFF

V_CC 300

0.1 F

t_BMM V_OUT

V_OL

V_OUT DUT

V_CC

300

V_OUT 0.1 F

Transmitted Output

DUT Input Reference

Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. V_ISO, Bandwidth and V_ONL are independent of the input signal direction.

V_ISO = Off Channel Isolation = 20 Log for V_IN at 100 kHz

V_ONL = On Channel Loss = 20 Log for V_IN at 100 kHz to 50 MHz Bandwidth (BW) = the frequency 3.0 dB below V_ONL

V_CT = Use V_ISO setup and test to all other switch analog input/outputs terminated with 50 50 50 Generator

Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/V_ONL

50

ǒ

Ǔ ǒ

Ǔ

On Off

Off Output

DUT Open

V_OUT V_CC

GND

Output V_IN

C_L

Figure 7. Charge Injection: (Q) V_IN

−55 −20

LEAKAGE (nA)

Figure 8. Switch Leakage vs. Temperature 1

I_NO(OFF)

TEMPERATURE (°C) 0.01

25 0.001

0.1

70 85 125

I_COM(ON)

I_COM(OFF)

V_CC = 5.0 V 10

100

Figure 9. Off−Channel Isolation Figure 10. Typical Bandwidth and Phase Shift

1

0.1

0.01

3.0 30

2.5 3 4.5 5

Figure 11. t_ON and t_OFF vs. V_CC at 255C V_CC (VOLTS)

Figure 12. t_ON and t_OFF vs. Temp Temperature (°C)

TIME (ns)

TIME (ns)

FREQUENCY (kHz) V_COM (V)

THD + NOISE (%) Q (pC)

10

1 100

−55 −40 25 125

20 15 25

0

0 1 2 3 4 5

t_ON

V_CC = 3 V V_CC = 5 V 2.5

2.0 1.5 1.0 0.5 0

−0.5 V_INpp = 5.0 V

V_CC = 5.5 V V_INpp = 3.0 V V_CC = 3.6 V

10

5 t_OFF

t_ON (ns)

t_OFF (ns)

V_CC = 4.5 V

3.5 4

30

20 15 25

0 10 5

85

0.01 0.1 1 10

(dB)

−100 0

Off Isolation

FREQUENCY (MHz)

100 200

−80

−60

−40

−20

V_CC = 5.0 V T_A = 25°C

0.01 0.1 1 10 100 300

FREQUENCY (MHz)

PHASE (°)

Bandwidth (ON−RESPONSE)

PHASE SHIFT

V_CC = 5.0 V T_A = 25°C

−5

−15

−35

−10

−20

−30

−25 0 +5 +10 +15

(dB)

2.0 4.0

6.0

10.0 0 1.0 3.0

5.0

7.0

9.0 8.0

0 5 10 15 20 25 30 35 40 45 50

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

25°C

−55°C

85°C 125°C 85°C

−55°C 125°C

0 10 20 30 40 50 60 70 80 90 100

0.0 0.5 1.0 1.5 2.0 2.5

25°C

−55°C 85°C

25°C

125°C 0 10 20 30 40 50 60 70 80 90 100

0.0 0.5 1.0 1.5 2.0 2.5 3.0

0.0 1.0 2.0 3.0 4.0 5.0 6.0

Temperature (°C)

Figure 15. I_CC vs. Temp, V_CC = 3.0 V and 5.0 V ICC (nA)

80 100

60

40

20 0

Figure 16. R_ON vs. V_CC, Temp = 255C V_IS (VDC)

Figure 17. R_ON vs Temp,V_CC = 2.0 V

RON () RON ()

Figure 18. R_ON vs. Temp,V_CC = 2.5 V V_IS (VDC)

Figure 19. R_ON vs. Temp, V_CC = 3.0 V V_IS (VDC)

RON ()

RON ()

−40 −20 0 20 60 80 100 120

V_CC = 2.0 V

V_CC = 2.5 V V_CC = 3.0 V

V_CC = 4.0 V V_CC = 5.5 V

V_CC = 3.0 V

V_CC = 5.0 V 10

1 0.1 100

0.01 0.001 0.0001 0.00001

Figure 20. R_ON vs. Temp,V_CC = 4.5 V V_IS (VDC)

0 5 10 15 20 25 30

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 RON ()

V_IS (VDC) 25°C

−55°C

125°C 85°C

Figure 21. R_ON vs. Temp,V_CC = 5.0 V Figure 22. R_ON vs. Temp,V_CC = 5.5 V 20

15 RON ()

10 25

V_IS (VDC) 5

00.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 25°C

85°C

125°C

−55°C

20

15 RON ()

10 25

V_IS (VDC) 5

00.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 25°C

85°C

125°C

−55°C

ORDERING INFORMATION Device

Order Number Package Type

Tape and Reel Shippingize†

NLAS325USG US8

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

CASE 493US8 ISSUE F

DATE 01 SEP 2021 SCALE 4 :1

XX = Specific Device Code M = Date Code

G = Pb−Free Package 1

8

XX MG G GENERIC MARKING DIAGRAM*

(Note: Microdot may be in either location)

*This information is generic. Please refer to device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.

PACKAGE DIMENSIONS

98AON04475D DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1 US8

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