TEM001795 Rev. O Page 1 of 3
Final Product/Process Change Notification
Document # : FPCN22086Y Issue Date: 17 January 2018
Title of Change:
ORELA: change of assembly location to combine the complete backend flow in one site and change of the waffle pack design to reduce the tolerance between the die and the waffle pack cavity.Proposed first ship date:
24 April 2018Contact information:
Contact your local ON Semiconductor Sales Office or <[email protected]> orSamples:
Contact your local ON Semiconductor Sales Office or <[email protected]>Additional Reliability Data:
Contact your local ON Semiconductor Sales Office or <[email protected]>Type of notification:
This is a Final Product/Process Change Notification (FPCN) sent to customers. FPCNs are issued 90 days prior to implementation of the change.ON Semiconductor will consider this change accepted, unless an inquiry is made in writing within 30 days of delivery of this notice. To do so, contact <[email protected]>.
Change Part Identification:
Datecode ≥ 1801Change category: ☐
Wafer Fab Change☒
Assembly Change☐
Test Change☐
Other __________Change Sub-Category(s):
☒
Manufacturing Site Change/Addition☐
Manufacturing Process Change☒
Material Change☐
Product specific change☒
Datasheet/Product Doc change☒
Shipping/Packaging/Marking☐
Other: ____________Sites Affected:
ON Semiconductor Sites:None
External Foundry/Subcon Sites:
Corwil / Flip Chip Inc.
Description and Purpose:
Change of assembly location to combine the complete backend flow in one site and change of the waffle pack design to reduce the tolerance between the die and the waffle pack cavity.
Before Change Description After Change Description
Assembly site Corwil Flip Chip Inc. (FCI)
(Qualified for similar type of product) Waffle pack Entegris H20-121186 (480/5 trays). Entegris H20-N205406-66C02 (480/5 trays).
Datasheet With Entegris H20-121186 details. With Entegris H20-N205406-66C02 details.
TEM001795 Rev. O Page 2 of 3
Final Product/Process Change Notification
Document # : FPCN22086Y Issue Date: 17 January 2018
New Waffle pack details:
Die Image in Tray Pocket – Bumps Down (Image through backside of Si)
Pin1
TEM001795 Rev. O Page 3 of 3
Final Product/Process Change Notification
Document # : FPCN22086Y Issue Date: 17 January 2018
Reliability Data Summary:
The First Time Silicon evaluation report from FCI can be consulted at an ON Semiconductor site of choice.
Electrical Characteristic Summary:
Not applicable
List of Affected Part:
Part Number Qualification Vehicle
0W482-009-XDI 0W482-009-XDI
