TEM001791 Rev. B Page 1 of 3
Initial Product/Process Change Notification
Document # : IPCN22623Z Issue Date: 21 February 2019
Title of Change: Qualification of assembly and test manufacturing for NCV8170 SOT563 family in Leshan, China Proposed Changed Material
First Ship Date: 1 March 2020
Current Material Last Order Date:
NA
Orders received after the Current Material Last Order Date expiration are to be considered as orders for new changed material as described in this PCN. Orders for current (unchanged) material after this date will be per mutual agreement and current material inventory availability.
Current Material Last Delivery Date:
NA
The Current Material Last Delivery Date may be subject to change based on build and depletion of the current (unchanged) material inventory.
Product Category: Active components – Integrated circuits
Contact information: Contact your local ON Semiconductor Sales Office or <[email protected]>
Samples:
Contact your local ON Semiconductor Sales Office to place sample order or
Sample requests are to be submitted no later than 45 days after publication of this change notification.
Additional Reliability Data: Contact your local ON Semiconductor Sales Office or <[email protected]>.
Type of Notification:
This is an Initial Product/Process Change Notification (IPCN) sent to customers. An IPCN is an advance notification about an upcoming change and contains general information regarding the change details and devices affected. It also contains the preliminary reliability qualification plan.
The completed qualification and characterization data will be included in the Final Product/Process Change Notification (FPCN). This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at least 12 months prior to implementation of the change. In case of questions, contact <[email protected]>.
Change Categor Type of Change
Test Flow Move of all or part of electrical wafer test and/or final test to a different location/site/subcontractor
Process – Assembly Move of all or part of assembly to a different location/site/subcontractor. (Qualification of an additional manufacturing site)
TEM001791 Rev. B Page 2 of 3
Initial Product/Process Change Notification
Document # : IPCN22623Z Issue Date: 21 February 2019
Description and Purpose:
ON Semiconductor is notifying customers of the pending qualification and transfer of assembly and test processes for the listed products in SOT563 packages from ON Semiconductor Seremban, Malaysia facility to ON Semiconductor Leshan, China facility.
Before Change Description After Change Description
Mold Compound EME-G700LS Hysol GR640HV-L1 M7A
Assembly Site Seremban Leshan
Test Site Seremban Leshan
From To
Product marking change M = Month Code, rotate=0° M = Month Code, rotate=270°
Product assembled in Leshan, China will include the trace character of ‘M’ (rotated 270 degrees) in the trace. There are no other changes to the product marking as a result of this notification.
Reason / Motivation for Change:
- Change benefits for customer: Supply continuity - Risk for late release for customer: Supply interruption.
Anticipated impact on fit, form, function, reliability, product safety or
manufacturability:
The device has been qualified and validated based on the same Product Specification. The device has successfully passed the qualification tests. Potential impacts can be identified, but due to testing performed by ON Semiconductor in relation to the PCN, associated risks are verified and excluded.
No anticipated impacts.
Sites Affected:
ON Semiconductor Sites:
ON Leshan, China
External Foundry/Subcon Sites:
None
Marking of Parts/
Traceability of Change:
Package labeling will indicate ‘Assembled in China’ and affected product will include the Leshan location identifier of ‘M’ (rotated 270 degrees) marked on the package body.
TEM001791 Rev. B Page 3 of 3
Initial Product/Process Change Notification
Document # : IPCN22623Z Issue Date: 21 February 2019
Reliability Data Summary:
QV DEVICE NAME: NCP170AXVyyyT2G RMS: S55953 & S55565
PACKAGE: SOT-563 AU SNGL HPBF
Test Specification Condition Interval
HTOL JESD22-A108 Ta=125°C, 100 % max rated Vcc (6V) 2016 hrs
HTSL JESD22-A103 Ta= 150°C 2016 hrs
TC JESD22-A104 Ta= -65°C to +150°C 500 cyc
HAST JESD22-A110 130°C, 85% RH, 18.8psig, bias 96 hrs
AC JESD22-A102 121°C, 100% RH, 15psig, unbiased 96 hrs
PC J-STD-020 JESD-A113 MSL 1 @ 260 °C
RSH JESD22- B106 Ta = 265C, 10 sec
BPS M883 Method 2011 Wire Bond Pull Strength, Condition C
BS AECQ100-001 Bond Shear test
Electrical Characteristic Summary:
Electrical characteristics are not impacted.
List of Affected Parts:
Note: Only the standard (off the shelf) part numbers are listed in the parts list. Any custom parts affected by this PCN are shown in the customer specific PCN addendum in the PCN email notification, or on the PCN Customized Portal.
Current Part Number New Part Number Qualification Vehicle
NCV8170AXV120T2G NA NCP170AXVYYYT2G
NCV8170AXV150T2G NA NCP170AXVYYYT2G
NCV8170AXV250T2G NA NCP170AXVYYYT2G
NCV8170AXV300T2G NA NCP170AXVYYYT2G
NCV8170AXV360T2G NA NCP170AXVYYYT2G
NCV8170BXV250T2G NA NCP170AXVYYYT2G
NCV8170BXV280T2G NA NCP170AXVYYYT2G
NCV8170BXV300T2G NA NCP170AXVYYYT2G
NCV8170BXV310T2G NA NCP170AXVYYYT2G
NCV8170BXV330T2G NA NCP170AXVYYYT2G
