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The TSSOP8 assembly and test in Aizu backend covered by this PCN will be transferred to ATP(Amkor Technology Philippines) which is a QS9000 certified assembly and test site

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Subject: Motorola PRODUCT AND PROCESS CHANGE NOTIFICATION 4421 TITLE: TSSOP8 ASSEBLY AND TEST SITE TRANSFER TO AMKOA TECHNOLOGY PHILIPPINES

EFFECTIVE DATE: 15-MAY-99 AFFECTED CHANGE CATEGORIES

Motorola Assembly Site Motorola Test Site

AFFECTED PRODUCT DIVISIONS

PERSONAL AND PC MED POWER PRODUCTS DIV

ADDITIONAL RELIABILITY DATA: None Ref: NPM057

SAMPLES: Contact Below Ref: [email protected] Contact your local Motorola Sales Office.

For any questions concerning this notification:

REFERENCE: NOBUYUKI OHTAKE PHONE: 81-241-27-2231 DISCLAIMER:

MOTOROLA WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC

CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL MOTOROLA SALES OFFICE.

GPCN FORMAT: CUSTOMER

DO NOT REPLY TO THIS MESSAGE.

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Motorola Page:2 Semiconductor Products Sector

**********************************************************************

PRODUCT AND PROCESS CHANGE NOTIFICATION

**********************************************************************

ISSUE DATE: 07-Feb- 1999 NOTIFICATION #:4421 EFFECTIVE DATE: 15-May- 1999 ISSUING DIVISION:NML-S/ISYS DESCRIPTION AND PURPOSE

---

Motorola has decided to consolidate Aizu backend operation into other

manufacturing sites, which will enable Aizu to become a center of excellence focused on Analog CMOS and TMOS technologies. The TSSOP8 assembly and test in Aizu backend covered by this PCN will be transferred to ATP(Amkor Technology Philippines) which is a QS9000 certified assembly and test site. As ATP also has the same assembly and test capability, the equipment is not transferred. The shutdown timing in Aizu is 6-May-99.

NOTE: All Life Time Buy Notices (end of life) previously issued for this product, remain in effect and will be phased out as stated.

QUALIFICATION PLAN ---

The qualification sample using biggest die size at the package has been selected to verify the reliability performance. The following is the reliability and process charactalization.

1. Reliability test

The preconditioning for reliability test will be done in accordance with the JDEC Moisture sensitivity for each level.

Package type Device type S/S PCT T/C

--- TSSOP8 MC34119ADTB 77 X 3 6-Apr-99 6-Apr-99 PCT test condition : 121 degree C/100%RH/2 atm/96 hours.

Temp. cycle test condition: -65 degree C - +150 degree C/1000 cycle 2. Process characterization

The process charactalization will be performed in accordance with Motorola internal criteria.

RELIABILITY DATA SUMMARY ---

The reliability test data of existing products will be available upon request.

ELECTRICAL CHARACTERISTIC SUMMARY ---

The electrical characteristics report is not applicable because there is no change on product design and wafer process.

CHANGED PART IDENTIFICATION ---

There is no physical change to the parts. Only location code in tracebility code marked on surface of package will changed as below.

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Motorola Page:3 Semiconductor Products Sector

**********************************************************************

PRODUCT AND PROCESS CHANGE NOTIFICATION

**********************************************************************

ISSUE DATE: 07-Feb- 1999 NOTIFICATION #:4421 EFFECTIVE DATE: 15-May- 1999 ISSUING DIVISION:NML-S/ISYS

Now After

--- J L Y W 5 L Y W

- - - - - - - - 1st digit : Assembly site location 2nd digit : Wafer lot number

3rd digit : Year 4th digit : Work week

FILE FORMAT: ASCII TEXT FONT - Courier SIZE - 12 Point

LINE - 70 characters/line PAGE - 55 lines/page

PAGEBREAK CHARACTER - ^L (Control L)

AFFECTED DEVICE LIST (WITHOUT SPECIALS) ---

MBDF1200ZEL , MC34119ADTBEL , MC34119DTB , MC34119DTBEL MC34119DTBR2

参照

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