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BUL45D2G High Speed, High Gain Bipolar NPN Power Transistor

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High Speed, High Gain Bipolar NPN Power Transistor

with Integrated Collector−Emitter Diode and Built−in Efficient Antisaturation Network

The BUL45D2G is state−of−art High Speed High gain BiPolar transistor (H2BIP). High dynamic characteristics and lot−to−lot minimum spread ( ± 150 ns on storage time) make it ideally suitable for light ballast applications. Therefore, there is no need to guarantee an h

FE

window. It’s characteristics make it also suitable for PFC application.

Features

• Low Base Drive Requirement

• High Peak DC Current Gain

• Extremely Low Storage Time Min/Max Guarantees Due to the H2BIP Structure which Minimizes the Spread

• Integrated Collector−Emitter Free Wheeling Diode

• Fully Characterized and Guaranteed Dynamic V

CE(sat)

• “6 Sigma” Process Providing Tight and Reproductible Parameter Spreads

• These Devices are Pb−Free and are RoHS Compliant*

MAXIMUM RATINGS

Rating Symbol Value Unit

Collector−Emitter Sustaining Voltage VCEO 400 Vdc Collector−Base Breakdown Voltage VCBO 700 Vdc Collector−Emitter Breakdown Voltage VCES 700 Vdc

Emitter−Base Voltage VEBO 12 Vdc

Collector Current − Continuous IC 5 Adc

Collector Current − Peak (Note 1) ICM 10 Adc

Base Current − Continuous IB 2 Adc

Base Current − Peak (Note 1) IBM 4 Adc

Total Device Dissipation

@ TC = 25_C Derate above 25°C

PD

75 0.6

W W/_C Operating and Storage Temperature TJ, Tstg −65 to +150 _C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤10%.

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques

POWER TRANSISTOR 5.0 AMPERES, 700 VOLTS, 75 WATTS

TO−220 CASE 221A

STYLE 1

1

www.onsemi.com

MARKING DIAGRAM 23

BUL45D2G AY WW

A = Assembly Location

Y = Year

WW = Work Week G = Pb−Free Package

Device Package Shipping ORDERING INFORMATION

BUL45D2G TO−220

(Pb−Free)

50 Units / Rail 1

BASE

3 EMITTER COLLECTOR

2, 4

4

(2)

THERMAL CHARACTERISTICS

Characteristics Symbol Max Unit

Thermal Resistance, Junction−to−Case RqJC 1.65 _C/W

Thermal Resistance, Junction−to−Ambient RqJA 62.5 _C/W

Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 5 Seconds TL 260 _C

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS

Collector−Emitter Sustaining Voltage (IC = 100 mA, L = 25 mH)

VCEO(sus)

400 450 −

Vdc

Collector−Base Breakdown Voltage (ICBO = 1 mA)

VCBO

700 910 −

Vdc

Emitter−Base Breakdown Voltage (IEBO = 1 mA)

VEBO

12 14.1 −

Vdc

Collector Cutoff Current (VCE = Rated VCEO, IB = 0)

ICEO

− − 100 mAdc

Collector Cutoff Current (VCE = Rated VCES, VEB = 0)

@ TC = 25°C

@ TC = 125°C (VCE = 500 V, VEB = 0)

@ TC = 125°C

ICES

100 500 100

mAdc

Emitter−Cutoff Current (VEB = 10 Vdc, IC = 0)

IEBO

− − 100 mAdc

ON CHARACTERISTICS Base−Emitter Saturation Voltage

(IC = 0.8 Adc, IB = 80 mAdc)

@ TC = 25°C

@ TC = 125°C (IC = 2 Adc, IB = 0.4 Adc)

@ TC = 25°C

@ TC = 125°C

VBE(sat)

0.8 0.7 0.89 0.79

1 0.9

1 0.9

Vdc

Collector−Emitter Saturation Voltage (IC = 0.8 Adc, IB = 80 mAdc)

@ TC = 25°C

@ TC = 125°C (IC = 2 Adc, IB = 0.4 Adc)

@ TC = 25°C

@ TC = 125°C

(IC = 0.8 Adc, IB = 40 mAdc)

@ TC = 25°C

@ TC = 125°C

VCE(sat)

0.28 0.32 0.32 0.38 0.46 0.62

0.4 0.5 0.5 0.6 0.75 1

Vdc

DC Current Gain

(IC = 0.8 Adc, VCE = 1 Vdc)

@ TC = 25°C

@ TC = 125°C (IC = 2 Adc, VCE = 1 Vdc)

@ TC = 25°C

@ TC = 125°C

hFE

22 20 10 7

34 29 14 9.5

DIODE CHARACTERISTICS Forward Diode Voltage

(IEC = 1 Adc)

@ TC = 25°C

@ TC = 125°C (IEC = 2 Adc)

@ TC = 25°C

@ TC = 125°C (IEC = 0.4 Adc)

@ TC = 25°C

@ TC = 125°C

VEC

1.04 0.7 1.2

− 0.85 0.62

1.5

− 1.6

− 1.2

V

(3)

ELECTRICAL CHARACTERISTICS (continued)(TC = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

DIODE CHARACTERISTICS

Forward Recovery Time (see Figure 27) (IF = 1 Adc, di/dt = 10 A/ms)

@ TC = 25°C

(IF = 2 Adc, di/dt = 10 A/ms)

@ TC = 25°C

(IF = 0.4 Adc, di/dt = 10 A/ms)

@ TC = 25°C

Tfr

330 360 320

ns

DYNAMIC CHARACTERISTICS Current Gain Bandwidth

(IC = 0.5 Adc, VCE = 10 Vdc, f = 1 MHz)

fT

− 13 −

MHz

Output Capacitance

(VCB = 10 Vdc, IE = 0, f = 1 MHz)

Cob

− 50 75

pF

Input Capacitance (VEB = 8 Vdc)

Cib

− 340 500

pF

DYNAMIC SATURATION VOLTAGE Dynamic Saturation

Voltage:

Determined 1 ms and 3 ms respectively after rising IB1 reaches 90% of final IB1

IC = 1 A IB1 = 100 mA VCC = 300 V

@ 1 ms @ TC = 25°C

@ TC = 125°C

VCE(dsat)

3.7 9.4

V

@ 3 ms @ TC = 25°C

@ TC = 125°C

0.35 2.7

V

IC = 2 A IB1 = 0.8 A VCC = 300 V

@ 1 ms @ TC = 25°C

@ TC = 125°C

3.9 12

V

@ 3 ms @ TC = 25°C

@ TC = 125°C

0.4 1.5

V

SWITCHING CHARACTERISTICS: Resistive Load (D.C. ≤ 10%, Pulse Width = 20 ms) Turn−on Time IC = 2 Adc, IB1 = 0.4 Adc

IB2 = 1 Adc VCC = 300 Vdc

@ TC = 25°C

@ TC = 125°C

ton

90 105

150

ns

Turn−off Time @ TC = 25°C

@ TC = 125°C

toff

1.15 1.5

1.3

ms

Turn−on Time IC = 2 Adc, IB1 = 0.4 Adc IB2 = 0.4 Adc VCC = 300 Vdc

@ TC = 25°C

@ TC = 125°C

ton

90 110

150

ns

Turn−off Time @ TC = 25°C

@ TC = 125°C

toff 2.1

− 3.1

2.4

ms

SWITCHING CHARACTERISTICS: Inductive Load (Vclamp = 300 V, VCC = 15 V, L = 200 mH)

Fall Time IC = 1 Adc

IB1 = 100 mAdc IB2 = 500 mAdc

@ TC = 25°C

@ TC = 125°C

tf

90 93

150

ns

Storage Time @ TC = 25°C

@ TC = 125°C

ts

0.72 1.05

0.9

ms

Crossover Time @ TC = 25°C

@ TC = 125°C

tc

95 95

150

ns

Fall Time IC = 2 Adc

IB1 = 0.4 Adc IB2 = 0.4 Adc

@ TC = 25°C

@ TC = 125°C

tf

80 105

150

ns

Storage Time @ TC = 25°C

@ TC = 125°C

ts 1.95

− 2.9

2.25

ms

Crossover Time @ TC = 25°C

@ TC = 125°C

tc

225 450

300

ns

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

(4)

TYPICAL STATIC CHARACTERISTICS

Figure 1. DC Current Gain @ 1 Volt 100

80

60

40

20 0

10 1

0.1 0.01

0.001

IC, COLLECTOR CURRENT (AMPS)

hFE, DC CURRENT GAIN

TJ = 125°C TJ = 25°C

TJ = -20°C VCE = 1 V

Figure 2. DC Current Gain @ 5 Volt 100

80

60

40

20 0

10 1

0.1 0.01

0.001

IC, COLLECTOR CURRENT (AMPS)

hFE, DC CURRENT GAIN

TJ = 125°C TJ = 25°C

TJ = -20°C VCE = 5 V

Figure 3. Collector Saturation Region 4

2

0

10 0.1

0.01 0.001

IB, BASE CURRENT (AMPS) IC = 500 mA

Figure 4. Collector−Emitter Saturation Voltage 10

1

0.1

10 1

0.1 0.01

0.001

IC, COLLECTOR CURRENT (AMPS) TJ = 125°C

TJ = 25°C

TJ = -20°C IC/IB = 5

VCE, VOLTAGE (VOLTS) VCE, VOLTAGE (VOLTS)3

1

TJ = 25°C

1 A 4 A

Figure 5. Collector−Emitter Saturation Voltage 10

1

0.1

10 0.1

0.01 0.001

IC, COLLECTOR CURRENT (AMPS)

Figure 6. Collector−Emitter Saturation Voltage 10

1

0.1

1 0.1

0.01 0.001

IC, COLLECTOR CURRENT (AMPS) TJ = 125°C TJ = 25°C

TJ = -20°C

VCE, VOLTAGE (VOLTS) VCE, VOLTAGE (VOLTS)

1 IC/IB = 10

TJ = 125°C

TJ = 25°C TJ = -20°C

IC/IB = 20 1

5 A 2 A 3 A

10

(5)

TYPICAL STATIC CHARACTERISTICS

Figure 7. Base−Emitter Saturation Region 10

1

0.1

10 0.1

0.01 0.001

IC, COLLECTOR CURRENT (AMPS)

Figure 8. Base−Emitter Saturation Region 10

1

0.1

10 0.1

0.01 0.001

IC, COLLECTOR CURRENT (AMPS) TJ = 125°C TJ = 25°C

TJ = -20°C

VBE, VOLTAGE (VOLTS) VBE, VOLTAGE (VOLTS)

1 TJ = 125°C

TJ = 25°C

TJ = -20°C

IC/IB = 10

1 IC/IB = 5

Figure 9. Base−Emitter Saturation Region 10

1

0.1

1 0.1

0.01 0.001

IC, COLLECTOR CURRENT (AMPS)

Figure 10. Forward Diode Voltage 10

1

0.1

10 0.1

0.01

REVERSE EMITTER-COLLECTOR CURRENT (AMPS) 125°C 25°C

VBE, VOLTAGE (VOLTS) FORWARD DIODE VOLTAGE (VOLTS)

TJ = 125°C TJ = 25°C

TJ = -20°C

1 IC/IB = 20

Figure 11. Capacitance 1000

10

1

100 10

1

VR, REVERSE VOLTAGE (VOLTS) 100

Cib (pF)

Cob (pF) TJ = 25°C f(test) = 1 MHz

Figure 12. BVCER = f(ICER) 1000

700

400

1000 100

10

RBE (W)

BVCER (VOLTS)

TJ = 25°C BVCER @ 10 mA

900 800

600 500

BVCER(sus) @ 200 mA 10

(6)

TYPICAL SWITCHING CHARACTERISTICS

Figure 13. Resistive Switch Time, ton 1000

400

0

4 1.5

0.5

IC, COLLECTOR CURRENT (AMPS) 3.5

t, TIME (ns)

800

600

200

TJ = 125°C TJ = 25°C

IC/IB = 10

IC/IB = 5 IBon = IBoff

VCC = 300 V PW = 20 ms

1 2 2.5 3

Figure 14. Resistive Switch Time, toff 5

0

IC, COLLECTOR CURRENT (AMPS) 3

t, TIME (s)μ

4

2

1 TJ = 125°C TJ = 25°C

IC/IB = 10

IC/IB = 5

IBon = IBoff VCC = 300 V PW = 20 ms

4 1.5

0.5 1 2 2.5 3 3.5

Figure 15. Inductive Storage Time, tsi @ IC/IB = 5

4

2

0

4 1

0

IC, COLLECTOR CURRENT (AMPS) 3 3

1

t, TIME (s)μ

2 TJ = 125°C TJ = 25°C

IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH IC/IB = 5

Figure 16. Inductive Storage Time, tsi @ IC/IB = 10

5

2

0

4 1

0

IC, COLLECTOR CURRENT (AMPS) 3 3

1

t, TIME (s)μ

2 TJ = 125°C TJ = 25°C

IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH 4

t, TIME (ns)

Figure 17. Inductive Switching, tc & tfi @ IC/IB = 5 600

200

0

4 1

0

IC, COLLECTOR CURRENT (AMPS) 3 400

300

100 500

2 TJ = 125°C TJ = 25°C IBon = IBoff

VCC = 15 V VZ = 300 V LC = 200 mH

Figure 18. Inductive Switching, tfi @ IC/IB = 10

tc

tfi

t, TIME (ns)

400

200

0

4 1

0

IC, COLLECTOR CURRENT (AMPS) 3 300

100

2 TJ = 125°C TJ = 25°C IBoff = IBon VCC = 15 V VZ = 300 V LC = 200 mH

(7)

TYPICAL SWITCHING CHARACTERISTICS

1500

0

4 2

0

IC, COLLECTOR CURRENT (AMPS) Figure 19. Inductive Switching,

tc @ IC/IB = 10

5

2

20 5

0

hFE, FORCED GAIN 15 4

3 1000

t, TIME (ns)

500

10

, STORAGE TIME (

t si

μs)

1 3

TJ = 125°C TJ = 25°C

IC = 1 A IBoff = IBon

VCC = 15 V VZ = 300 V LC = 200 mH

TJ = 125°C TJ = 25°C

IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH

Figure 20. Inductive Storage Time IC = 2 A

Figure 21. Inductive Fall Time 450

50

20 8

2

hFE, FORCED GAIN

Figure 22. Inductive Crossover Time 1400

400

0

hFE, FORCED GAIN 1000

600

200 350

t fi, FALL TIME (ns)

t c, CROSSOVER TIME (ns)

250

150

4 6 10 12

TJ = 125°C TJ = 25°C

IC = 1 A IBoff = IBon

VCC = 15 V VZ = 300 V LC = 200 mH

IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH

TJ = 125°C TJ = 25°C

IC = 2 A

14 16 18

IC = 2 A

800

20 8

2 4 6 10 12 14 16 18

IC = 1 A

Figure 23. Inductive Storage Time, t 3000

0

3 1

0.5

IC, COLLECTOR CURRENT (AMPS) 2000

t, TIME (ns)

1000

1.5

IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH

2 2.5

IB1 = IB2

IB = 50 mA IB = 100 mA

IB = 200 mA IB = 500 mA

Figure 24. Forward Recovery Time t 360

300

2 1

0.5 0

IF, FORWARD CURRENT (AMP) dI/dt = 10 A/ms

TC = 25°C

1.5

tfr, FORWARD RECOVERY TIME (ns)

340

320

3.5 4

IB = 1 A

1200

(8)

TYPICAL SWITCHING CHARACTERISTICS

Figure 25. Dynamic Saturation Voltage Measurements

TIME

Figure 26. Inductive Switching Measurements 10

4

0

8 2

0

TIME

6 8

6

2

4 9

7

5

3

1

1 3 5 7

VCE

0 V

IB 90% IB 1 ms

3 ms dyn 1 ms

dyn 3 ms

IB IC

Vclamp

tsi

tc tfi 90% IC

10% IC

90% IB1

Figure 27. tfr Measurements 0

10 6

0 VF

IF

2 4 8

10% Vclamp

VFR (1.1 VF unless otherwise specified) VFRM

tfr

VF 0.1 VF

10% IF

(9)

TYPICAL SWITCHING CHARACTERISTICS

Table 1. Inductive Load Switching Drive Circuit

V(BR)CEO(sus)

L = 10 mH RB2 = ∞ VCC = 20 Volts IC(pk) = 100 mA

Inductive Switching L = 200 mH RB2 = 0 VCC = 15 Volts RB1 selected for desired IB1

RBSOA L = 500 mH RB2 = 0 VCC = 15 Volts RB1 selected for desired IB1 +15 V

1 mF 150 W 3 W

100 W 3 W

MPF930 +10 V

50 COMMON W

-Voff

500 mF MPF930

MTP8P10

MUR105

MJE210

MTP12N10 MTP8P10

150 W 3 W

100 mF

Iout A RB1

RB2

1 mF

IC PEAK VCE PEAK

VCE

IB IB1

IB2

Figure 28. Forward Bias Safe Operating Area 100

0.01

1000 10

VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)

Figure 29. Reverse Bias Safe Operating Area 6

3

0

800 200

VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS) 100

1

0.1

I C, COLLECTOR CURRENT (AMPS)

I C, COLLECTOR CURRENT (AMPS)

DC

5 ms 1 ms 10 ms

1 ms

2

0 V -1.5 V - 5 V

TC≤ 125°C GAIN ≥ 5 LC = 2 mH

300 400 600 700

5 4

TYPICAL CHARACTERISTICS

500 10

1

EXTENDED SOA

(10)

TYPICAL CHARACTERISTICS

Figure 30. Forward Bias Power Derating 1

0

160 100

20

TC, CASE TEMPERATURE (°C) 0.8

POWER DERATING FACTOR

0.6

0.4

0.2

60 140

SECOND BREAKDOWN DERATING

40 80 120

THERMAL DERATING

There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I

C

−V

CE

limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 28 is based on T

C

= 25 ° C; T

J(pk)

is variable depending on power level. Second breakdown pulse limits are valid for duty cycles to 10% but must be derated when T

C

> 25 ° C. Second breakdown limitations do not derate the same as thermal limitations. Allowable current at the voltages shown on

Figure 28 may be found at any case temperature by using the appropriate curve on Figure 30.

T

J(pk)

may be calculated from the data in Figure 31. At any case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. For inductive loads, high voltage and current must be sustained simultaneously during turn−off with the base to emitter junction reverse biased. The safe level is specified as a reverse biased safe operating area (Figure 29). This rating is verified under clamped conditions so that the device is never subjected to an avalanche mode.

TYPICAL THERMAL RESPONSE

Figure 31. Typical Thermal Response (ZqJC(t)) for BUL45D2 1

0.01

10 0.1

0.01

t, TIME (ms) 0.1

1 100 1000

r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)

RqJC(t) = r(t) RqJC RqJC = 2.5°C/W MAX

D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) RqJC(t) P(pk)

t1 t2

DUTY CYCLE, D = t1/t2 0.05

SINGLE PULSE 0.5

0.2 0.1

0.02

(11)

TO−220 CASE 221A

ISSUE AK

DATE 13 JAN 2022

SCALE 1:1

STYLE 1:

PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR

STYLE 2:

PIN 1. BASE 2. EMITTER 3. COLLECTOR 4. EMITTER

STYLE 3:

PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE

STYLE 4:

PIN 1. MAIN TERMINAL 1 2. MAIN TERMINAL 2 3. GATE 4. MAIN TERMINAL 2 STYLE 7:

PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE STYLE 10:

PIN 1. GATE 2. SOURCE 3. DRAIN 4. SOURCE STYLE 5:

PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN

STYLE 8:

PIN 1. CATHODE 2. ANODE

3. EXTERNAL TRIP/DELAY 4. ANODE

STYLE 6:

PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 9:

PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR

STYLE 11:

PIN 1. DRAIN 2. SOURCE 3. GATE 4. SOURCE

STYLE 12:

PIN 1. MAIN TERMINAL 1 2. MAIN TERMINAL 2 3. GATE 4. NOT CONNECTED

PACKAGE DIMENSIONS

98ASB42148B DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1 TO−220

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(12)

products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,

The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,

The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,

The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,

The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,

The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,

The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,

The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features,