High Speed, High Gain Bipolar NPN Power Transistor
with Integrated Collector−Emitter Diode and Built−in Efficient Antisaturation Network
The BUL45D2G is state−of−art High Speed High gain BiPolar transistor (H2BIP). High dynamic characteristics and lot−to−lot minimum spread ( ± 150 ns on storage time) make it ideally suitable for light ballast applications. Therefore, there is no need to guarantee an h
FEwindow. It’s characteristics make it also suitable for PFC application.
Features
• Low Base Drive Requirement
• High Peak DC Current Gain
• Extremely Low Storage Time Min/Max Guarantees Due to the H2BIP Structure which Minimizes the Spread
• Integrated Collector−Emitter Free Wheeling Diode
• Fully Characterized and Guaranteed Dynamic V
CE(sat)• “6 Sigma” Process Providing Tight and Reproductible Parameter Spreads
• These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector−Emitter Sustaining Voltage VCEO 400 Vdc Collector−Base Breakdown Voltage VCBO 700 Vdc Collector−Emitter Breakdown Voltage VCES 700 Vdc
Emitter−Base Voltage VEBO 12 Vdc
Collector Current − Continuous IC 5 Adc
Collector Current − Peak (Note 1) ICM 10 Adc
Base Current − Continuous IB 2 Adc
Base Current − Peak (Note 1) IBM 4 Adc
Total Device Dissipation
@ TC = 25_C Derate above 25°C
PD
75 0.6
W W/_C Operating and Storage Temperature TJ, Tstg −65 to +150 _C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤10%.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques
POWER TRANSISTOR 5.0 AMPERES, 700 VOLTS, 75 WATTS
TO−220 CASE 221A
STYLE 1
1
www.onsemi.com
MARKING DIAGRAM 23
BUL45D2G AY WW
A = Assembly Location
Y = Year
WW = Work Week G = Pb−Free Package
Device Package Shipping ORDERING INFORMATION
BUL45D2G TO−220
(Pb−Free)
50 Units / Rail 1
BASE
3 EMITTER COLLECTOR
2, 4
4
THERMAL CHARACTERISTICS
Characteristics Symbol Max Unit
Thermal Resistance, Junction−to−Case RqJC 1.65 _C/W
Thermal Resistance, Junction−to−Ambient RqJA 62.5 _C/W
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 5 Seconds TL 260 _C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (IC = 100 mA, L = 25 mH)
VCEO(sus)
400 450 −
Vdc
Collector−Base Breakdown Voltage (ICBO = 1 mA)
VCBO
700 910 −
Vdc
Emitter−Base Breakdown Voltage (IEBO = 1 mA)
VEBO
12 14.1 −
Vdc
Collector Cutoff Current (VCE = Rated VCEO, IB = 0)
ICEO
− − 100 mAdc
Collector Cutoff Current (VCE = Rated VCES, VEB = 0)
@ TC = 25°C
@ TC = 125°C (VCE = 500 V, VEB = 0)
@ TC = 125°C
ICES
−
−
−
−
−
−
100 500 100
mAdc
Emitter−Cutoff Current (VEB = 10 Vdc, IC = 0)
IEBO
− − 100 mAdc
ON CHARACTERISTICS Base−Emitter Saturation Voltage
(IC = 0.8 Adc, IB = 80 mAdc)
@ TC = 25°C
@ TC = 125°C (IC = 2 Adc, IB = 0.4 Adc)
@ TC = 25°C
@ TC = 125°C
VBE(sat)
−
−
−
−
0.8 0.7 0.89 0.79
1 0.9
1 0.9
Vdc
Collector−Emitter Saturation Voltage (IC = 0.8 Adc, IB = 80 mAdc)
@ TC = 25°C
@ TC = 125°C (IC = 2 Adc, IB = 0.4 Adc)
@ TC = 25°C
@ TC = 125°C
(IC = 0.8 Adc, IB = 40 mAdc)
@ TC = 25°C
@ TC = 125°C
VCE(sat)
−
−
−
−
−
−
0.28 0.32 0.32 0.38 0.46 0.62
0.4 0.5 0.5 0.6 0.75 1
Vdc
DC Current Gain
(IC = 0.8 Adc, VCE = 1 Vdc)
@ TC = 25°C
@ TC = 125°C (IC = 2 Adc, VCE = 1 Vdc)
@ TC = 25°C
@ TC = 125°C
hFE
22 20 10 7
34 29 14 9.5
−
−
−
−
−
DIODE CHARACTERISTICS Forward Diode Voltage
(IEC = 1 Adc)
@ TC = 25°C
@ TC = 125°C (IEC = 2 Adc)
@ TC = 25°C
@ TC = 125°C (IEC = 0.4 Adc)
@ TC = 25°C
@ TC = 125°C
VEC
−
−
−
−
−
−
1.04 0.7 1.2
− 0.85 0.62
1.5
− 1.6
− 1.2
−
V
ELECTRICAL CHARACTERISTICS (continued)(TC = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
DIODE CHARACTERISTICS
Forward Recovery Time (see Figure 27) (IF = 1 Adc, di/dt = 10 A/ms)
@ TC = 25°C
(IF = 2 Adc, di/dt = 10 A/ms)
@ TC = 25°C
(IF = 0.4 Adc, di/dt = 10 A/ms)
@ TC = 25°C
Tfr
−
−
−
330 360 320
−
−
−
ns
DYNAMIC CHARACTERISTICS Current Gain Bandwidth
(IC = 0.5 Adc, VCE = 10 Vdc, f = 1 MHz)
fT
− 13 −
MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1 MHz)
Cob
− 50 75
pF
Input Capacitance (VEB = 8 Vdc)
Cib
− 340 500
pF
DYNAMIC SATURATION VOLTAGE Dynamic Saturation
Voltage:
Determined 1 ms and 3 ms respectively after rising IB1 reaches 90% of final IB1
IC = 1 A IB1 = 100 mA VCC = 300 V
@ 1 ms @ TC = 25°C
@ TC = 125°C
VCE(dsat) −
−
3.7 9.4
−
−
V
@ 3 ms @ TC = 25°C
@ TC = 125°C
−
−
0.35 2.7
−
−
V
IC = 2 A IB1 = 0.8 A VCC = 300 V
@ 1 ms @ TC = 25°C
@ TC = 125°C
−
−
3.9 12
−
−
V
@ 3 ms @ TC = 25°C
@ TC = 125°C
−
−
0.4 1.5
−
−
V
SWITCHING CHARACTERISTICS: Resistive Load (D.C. ≤ 10%, Pulse Width = 20 ms) Turn−on Time IC = 2 Adc, IB1 = 0.4 Adc
IB2 = 1 Adc VCC = 300 Vdc
@ TC = 25°C
@ TC = 125°C
ton −
−
90 105
150
−
ns
Turn−off Time @ TC = 25°C
@ TC = 125°C
toff −
−
1.15 1.5
1.3
−
ms
Turn−on Time IC = 2 Adc, IB1 = 0.4 Adc IB2 = 0.4 Adc VCC = 300 Vdc
@ TC = 25°C
@ TC = 125°C
ton −
−
90 110
150
−
ns
Turn−off Time @ TC = 25°C
@ TC = 125°C
toff 2.1
−
− 3.1
2.4
−
ms
SWITCHING CHARACTERISTICS: Inductive Load (Vclamp = 300 V, VCC = 15 V, L = 200 mH)
Fall Time IC = 1 Adc
IB1 = 100 mAdc IB2 = 500 mAdc
@ TC = 25°C
@ TC = 125°C
tf −
−
90 93
150
−
ns
Storage Time @ TC = 25°C
@ TC = 125°C
ts −
−
0.72 1.05
0.9
−
ms
Crossover Time @ TC = 25°C
@ TC = 125°C
tc −
−
95 95
150
−
ns
Fall Time IC = 2 Adc
IB1 = 0.4 Adc IB2 = 0.4 Adc
@ TC = 25°C
@ TC = 125°C
tf −
−
80 105
150
−
ns
Storage Time @ TC = 25°C
@ TC = 125°C
ts 1.95
−
− 2.9
2.25
−
ms
Crossover Time @ TC = 25°C
@ TC = 125°C
tc −
−
225 450
300
−
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.
TYPICAL STATIC CHARACTERISTICS
Figure 1. DC Current Gain @ 1 Volt 100
80
60
40
20 0
10 1
0.1 0.01
0.001
IC, COLLECTOR CURRENT (AMPS)
hFE, DC CURRENT GAIN
TJ = 125°C TJ = 25°C
TJ = -20°C VCE = 1 V
Figure 2. DC Current Gain @ 5 Volt 100
80
60
40
20 0
10 1
0.1 0.01
0.001
IC, COLLECTOR CURRENT (AMPS)
hFE, DC CURRENT GAIN
TJ = 125°C TJ = 25°C
TJ = -20°C VCE = 5 V
Figure 3. Collector Saturation Region 4
2
0
10 0.1
0.01 0.001
IB, BASE CURRENT (AMPS) IC = 500 mA
Figure 4. Collector−Emitter Saturation Voltage 10
1
0.1
10 1
0.1 0.01
0.001
IC, COLLECTOR CURRENT (AMPS) TJ = 125°C
TJ = 25°C
TJ = -20°C IC/IB = 5
VCE, VOLTAGE (VOLTS) VCE, VOLTAGE (VOLTS)3
1
TJ = 25°C
1 A 4 A
Figure 5. Collector−Emitter Saturation Voltage 10
1
0.1
10 0.1
0.01 0.001
IC, COLLECTOR CURRENT (AMPS)
Figure 6. Collector−Emitter Saturation Voltage 10
1
0.1
1 0.1
0.01 0.001
IC, COLLECTOR CURRENT (AMPS) TJ = 125°C TJ = 25°C
TJ = -20°C
VCE, VOLTAGE (VOLTS) VCE, VOLTAGE (VOLTS)
1 IC/IB = 10
TJ = 125°C
TJ = 25°C TJ = -20°C
IC/IB = 20 1
5 A 2 A 3 A
10
TYPICAL STATIC CHARACTERISTICS
Figure 7. Base−Emitter Saturation Region 10
1
0.1
10 0.1
0.01 0.001
IC, COLLECTOR CURRENT (AMPS)
Figure 8. Base−Emitter Saturation Region 10
1
0.1
10 0.1
0.01 0.001
IC, COLLECTOR CURRENT (AMPS) TJ = 125°C TJ = 25°C
TJ = -20°C
VBE, VOLTAGE (VOLTS) VBE, VOLTAGE (VOLTS)
1 TJ = 125°C
TJ = 25°C
TJ = -20°C
IC/IB = 10
1 IC/IB = 5
Figure 9. Base−Emitter Saturation Region 10
1
0.1
1 0.1
0.01 0.001
IC, COLLECTOR CURRENT (AMPS)
Figure 10. Forward Diode Voltage 10
1
0.1
10 0.1
0.01
REVERSE EMITTER-COLLECTOR CURRENT (AMPS) 125°C 25°C
VBE, VOLTAGE (VOLTS) FORWARD DIODE VOLTAGE (VOLTS)
TJ = 125°C TJ = 25°C
TJ = -20°C
1 IC/IB = 20
Figure 11. Capacitance 1000
10
1
100 10
1
VR, REVERSE VOLTAGE (VOLTS) 100
Cib (pF)
Cob (pF) TJ = 25°C f(test) = 1 MHz
Figure 12. BVCER = f(ICER) 1000
700
400
1000 100
10
RBE (W)
BVCER (VOLTS)
TJ = 25°C BVCER @ 10 mA
900 800
600 500
BVCER(sus) @ 200 mA 10
TYPICAL SWITCHING CHARACTERISTICS
Figure 13. Resistive Switch Time, ton 1000
400
0
4 1.5
0.5
IC, COLLECTOR CURRENT (AMPS) 3.5
t, TIME (ns)
800
600
200
TJ = 125°C TJ = 25°C
IC/IB = 10
IC/IB = 5 IBon = IBoff
VCC = 300 V PW = 20 ms
1 2 2.5 3
Figure 14. Resistive Switch Time, toff 5
0
IC, COLLECTOR CURRENT (AMPS) 3
t, TIME (s)μ
4
2
1 TJ = 125°C TJ = 25°C
IC/IB = 10
IC/IB = 5
IBon = IBoff VCC = 300 V PW = 20 ms
4 1.5
0.5 1 2 2.5 3 3.5
Figure 15. Inductive Storage Time, tsi @ IC/IB = 5
4
2
0
4 1
0
IC, COLLECTOR CURRENT (AMPS) 3 3
1
t, TIME (s)μ
2 TJ = 125°C TJ = 25°C
IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH IC/IB = 5
Figure 16. Inductive Storage Time, tsi @ IC/IB = 10
5
2
0
4 1
0
IC, COLLECTOR CURRENT (AMPS) 3 3
1
t, TIME (s)μ
2 TJ = 125°C TJ = 25°C
IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH 4
t, TIME (ns)
Figure 17. Inductive Switching, tc & tfi @ IC/IB = 5 600
200
0
4 1
0
IC, COLLECTOR CURRENT (AMPS) 3 400
300
100 500
2 TJ = 125°C TJ = 25°C IBon = IBoff
VCC = 15 V VZ = 300 V LC = 200 mH
Figure 18. Inductive Switching, tfi @ IC/IB = 10
tc
tfi
t, TIME (ns)
400
200
0
4 1
0
IC, COLLECTOR CURRENT (AMPS) 3 300
100
2 TJ = 125°C TJ = 25°C IBoff = IBon VCC = 15 V VZ = 300 V LC = 200 mH
TYPICAL SWITCHING CHARACTERISTICS
1500
0
4 2
0
IC, COLLECTOR CURRENT (AMPS) Figure 19. Inductive Switching,
tc @ IC/IB = 10
5
2
20 5
0
hFE, FORCED GAIN 15 4
3 1000
t, TIME (ns)
500
10
, STORAGE TIME (
t si
μs)
1 3
TJ = 125°C TJ = 25°C
IC = 1 A IBoff = IBon
VCC = 15 V VZ = 300 V LC = 200 mH
TJ = 125°C TJ = 25°C
IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH
Figure 20. Inductive Storage Time IC = 2 A
Figure 21. Inductive Fall Time 450
50
20 8
2
hFE, FORCED GAIN
Figure 22. Inductive Crossover Time 1400
400
0
hFE, FORCED GAIN 1000
600
200 350
t fi, FALL TIME (ns)
t c, CROSSOVER TIME (ns)
250
150
4 6 10 12
TJ = 125°C TJ = 25°C
IC = 1 A IBoff = IBon
VCC = 15 V VZ = 300 V LC = 200 mH
IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH
TJ = 125°C TJ = 25°C
IC = 2 A
14 16 18
IC = 2 A
800
20 8
2 4 6 10 12 14 16 18
IC = 1 A
Figure 23. Inductive Storage Time, t 3000
0
3 1
0.5
IC, COLLECTOR CURRENT (AMPS) 2000
t, TIME (ns)
1000
1.5
IBon = IBoff VCC = 15 V VZ = 300 V LC = 200 mH
2 2.5
IB1 = IB2
IB = 50 mA IB = 100 mA
IB = 200 mA IB = 500 mA
Figure 24. Forward Recovery Time t 360
300
2 1
0.5 0
IF, FORWARD CURRENT (AMP) dI/dt = 10 A/ms
TC = 25°C
1.5
tfr, FORWARD RECOVERY TIME (ns)
340
320
3.5 4
IB = 1 A
1200
TYPICAL SWITCHING CHARACTERISTICS
Figure 25. Dynamic Saturation Voltage Measurements
TIME
Figure 26. Inductive Switching Measurements 10
4
0
8 2
0
TIME
6 8
6
2
4 9
7
5
3
1
1 3 5 7
VCE
0 V
IB 90% IB 1 ms
3 ms dyn 1 ms
dyn 3 ms
IB IC
Vclamp
tsi
tc tfi 90% IC
10% IC
90% IB1
Figure 27. tfr Measurements 0
10 6
0 VF
IF
2 4 8
10% Vclamp
VFR (1.1 VF unless otherwise specified) VFRM
tfr
VF 0.1 VF
10% IF
TYPICAL SWITCHING CHARACTERISTICS
Table 1. Inductive Load Switching Drive CircuitV(BR)CEO(sus)
L = 10 mH RB2 = ∞ VCC = 20 Volts IC(pk) = 100 mA
Inductive Switching L = 200 mH RB2 = 0 VCC = 15 Volts RB1 selected for desired IB1
RBSOA L = 500 mH RB2 = 0 VCC = 15 Volts RB1 selected for desired IB1 +15 V
1 mF 150 W 3 W
100 W 3 W
MPF930 +10 V
50 COMMON W
-Voff
500 mF MPF930
MTP8P10
MUR105
MJE210
MTP12N10 MTP8P10
150 W 3 W
100 mF
Iout A RB1
RB2
1 mF
IC PEAK VCE PEAK
VCE
IB IB1
IB2
Figure 28. Forward Bias Safe Operating Area 100
0.01
1000 10
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 29. Reverse Bias Safe Operating Area 6
3
0
800 200
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS) 100
1
0.1
I C, COLLECTOR CURRENT (AMPS)
I C, COLLECTOR CURRENT (AMPS)
DC
5 ms 1 ms 10 ms
1 ms
2
0 V -1.5 V - 5 V
TC≤ 125°C GAIN ≥ 5 LC = 2 mH
300 400 600 700
5 4
TYPICAL CHARACTERISTICS
500 10
1
EXTENDED SOA
TYPICAL CHARACTERISTICS
Figure 30. Forward Bias Power Derating 1
0
160 100
20
TC, CASE TEMPERATURE (°C) 0.8
POWER DERATING FACTOR
0.6
0.4
0.2
60 140
SECOND BREAKDOWN DERATING
40 80 120
THERMAL DERATING
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I
C−V
CElimits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 28 is based on T
C= 25 ° C; T
J(pk)is variable depending on power level. Second breakdown pulse limits are valid for duty cycles to 10% but must be derated when T
C> 25 ° C. Second breakdown limitations do not derate the same as thermal limitations. Allowable current at the voltages shown on
Figure 28 may be found at any case temperature by using the appropriate curve on Figure 30.
T
J(pk)may be calculated from the data in Figure 31. At any case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. For inductive loads, high voltage and current must be sustained simultaneously during turn−off with the base to emitter junction reverse biased. The safe level is specified as a reverse biased safe operating area (Figure 29). This rating is verified under clamped conditions so that the device is never subjected to an avalanche mode.
TYPICAL THERMAL RESPONSE
Figure 31. Typical Thermal Response (ZqJC(t)) for BUL45D2 1
0.01
10 0.1
0.01
t, TIME (ms) 0.1
1 100 1000
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
RqJC(t) = r(t) RqJC RqJC = 2.5°C/W MAX
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) RqJC(t) P(pk)
t1 t2
DUTY CYCLE, D = t1/t2 0.05
SINGLE PULSE 0.5
0.2 0.1
0.02
TO−220 CASE 221A
ISSUE AK
DATE 13 JAN 2022
SCALE 1:1
STYLE 1:
PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR
STYLE 2:
PIN 1. BASE 2. EMITTER 3. COLLECTOR 4. EMITTER
STYLE 3:
PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE
STYLE 4:
PIN 1. MAIN TERMINAL 1 2. MAIN TERMINAL 2 3. GATE 4. MAIN TERMINAL 2 STYLE 7:
PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE STYLE 10:
PIN 1. GATE 2. SOURCE 3. DRAIN 4. SOURCE STYLE 5:
PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN
STYLE 8:
PIN 1. CATHODE 2. ANODE
3. EXTERNAL TRIP/DELAY 4. ANODE
STYLE 6:
PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 9:
PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR
STYLE 11:
PIN 1. DRAIN 2. SOURCE 3. GATE 4. SOURCE
STYLE 12:
PIN 1. MAIN TERMINAL 1 2. MAIN TERMINAL 2 3. GATE 4. NOT CONNECTED
PACKAGE DIMENSIONS
98ASB42148B DOCUMENT NUMBER:
DESCRIPTION:
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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1 TO−220
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