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ドラム式電着ダイヤモンドワイヤ製造技術の開発

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ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖ〇㐀ᢏ⾡ࡢ㛤Ⓨ

ᙇ Ᏹ

1)

㸪㇂ Ὀᘯ

2)



᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

Development of drum-type manufacturing method for electroplated diamond

wire tools

Yu ZHANG

1)

and Yasuhiro TANI

2)



Diamond wire saws are widely used in slicing various kinds of hard and brittle materials, such as silicon, sapphire, etc. Electroplated diamond wire tools are used for high-efficiency slicing process, because of high abrasion resistance. However, low production efficiency of diamond wire tools causes high cost in the production process, because the electroplating rate is low. To solve the problems, a drum-type manufacturing method for electroplated diamond wire tools was developed in this study. Multiple diamond wire tools could be manufactured simultaneously at high speed in one machine. The mechanism of drum type electroplating unit was introduced, firstly. Then the electroplating characteristics, such as maximum current density, Ni deposition rate and uniformity of electroplated wires, were evaluated. Composite electroplating experiments using diamond abrasive were carried out and the effect of electroplating factors on the amount of electrodeposited diamond grains was discussed, too. It was found that turbulence flow of electroplating solution could improve amount of deposited diamond grains. Long diamond wire tools were manufactured and used to slice Si ingot, it was confirmed that the developed wire tools have high slicing performance equal to the commercially available diamond wire tool.

Key Words : Diamond wire tool, Wire sawing, Electroplating, Current density, Deposition rate, Slice E-mail㸸[email protected] (Y. Zhang)

 

᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹᧹

1)

❧࿨㤋኱Ꮫ⥲ྜ⛉Ꮫᢏ⾡◊✲ᶵᵓ

2)

❧࿨㤋኱Ꮫ⌮ᕤᏛ㒊ᶵᲔᕤᏛ⛉

1)

Research Organization of Science and Technology, Ritsumeikan University,

Kusatsu, Shiga, 525-8577, Japan

2)

Department of Mechanical Engineering, Ritsumeikan University,

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1. ⥴   ゝ

࢚ࢥࣈ࣮࣒ࡸ㟁ຊᾘ㈝⠇⣙➼ࡢ♫఍᝟ໃࡀୡ⏺୰࡟ᗈࡀࡾ㸪࢚ࢿࣝࢠ࣮ᨻ⟇࡟࠾ࡅࡿኴ㝧㟁ụࡸLED ࡢ㟂せᛶ

ࡀ㏆ᖺࡲࡍࡲࡍ㧗ࡲࡗ࡚࠸ࡿ㸬ࢩࣜࢥࣥኴ㝧㟁ụ࡟౑ࢃࢀࡿࢩࣜࢥ࢙࣮ࣥ࢘ࣁࡸLED ⏝ࡢࢧࣇ࢓࢖࢔ᇶᯈࡣ㸪࣐

ࣝࢳ࣡࢖ࣖࢯ࣮࡛࢖ࣥࢦࢵࢺࢆࢫࣛ࢖ࢩࣥࢢຍᕤࡍࡿࡇ࡜࡟ࡼࡾ〇㐀ࡉࢀࡿ㸬ࢫࣛ࢖ࢩࣥࢢຍᕤ࡟࠾࠸࡚ࡣ㸪ࣆ

࢔ࣀ⥺ࢆ㧗㏿㉮⾜ࡉࡏ࡞ࡀࡽຍᕤᾮ࡟GC ◒⢏ࢆᠱ⃮ࡉࡏࡓࢫ࣮ࣛࣜࢆ࠿ࡅࡿ◊☻ษ᩿ἲ࡜ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆ

࣡࢖ࣖ࡟ᅛ╔ࡋࡓᕤලࢆ㉮⾜ࡉࡏ࡚Ỉ⁐ᛶ◊๐ᾮࡢࡳࢆ࠿ࡅࡿ◊๐ษ᩿ἲࡀ࠶ࡿ㸦Webster and Tricard, 2004㸧㸬◊ ๐ษ᩿᪉ᘧࡣ◊☻ษ᩿᪉ᘧ࡟ẚ࡭࡚2㹼3 ಸ⛬ᗘࡢษ᩿⬟ຊࢆ᭷ࡍࡿࡓࡵ㸪⌧ᅾࢩࣜࢥࣥ㸪ࢧࣇ࢓࢖࢔㸪SiC ࡞࡝ ࡢ◳⬤ᮦᩱࡢษ᩿࡟◊๐ษ᩿᪉ᘧࡢᬑཬࡀ㐍ࢇ࡛࠸ࡿ㸬ᅛᐃ◒⢏࣡࢖ࣖᕤල࡟ࡣ㸪ࣞࢪࣥ࣎ࣥࢻࡲࡓࡣ㟁╔࡟ࡼ ࡾࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆᅛ╔ࡋࡓࡶࡢࡀ࠶ࡿ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡣ㸪ࣞࢪࣥ࣎ࣥࢻ࣡࢖ࣖᕤලࡼࡾ⪏⇕ ᛶ㸪⪏ᦶ⪖ᛶ࡟ඃࢀ㸪ࡑࡢຍᕤᢏ⾡࡟㛵ࡋ࡚◊✲ᡂᯝࡀከᩘሗ࿌ࡉࢀ࡚࠸ࡿ㸦Clark et al.,2003㸪Chen et al.,2014㸧㸬 ᕷ㈍ࡢ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල࡟㛵ࡋ࡚ࡣ㸪┤ᚄȭ100ȣm ࡢࣆ࢔ࣀ⥺࡟ᖹᆒ⢏ᚄ 10ȣm ⛬ᗘࡢࢲ࢖ࣖࣔࣥ ࢻ◒⢏ࢆ௜╔ࡋࡓࢩࣜࢥࣥࢫࣛ࢖ࢩࣥࢢ⏝ࡢࡶࡢ࡜㸪┤ᚄȭ160ȣm ࡢࣆ࢔ࣀ⥺࡟ᖹᆒ⢏ᚄ 30-40ȣm ⛬ᗘࡢࢲ࢖ ࣖࣔࣥࢻ◒⢏ࢆ௜╔ࡋࡓࢧࣇ࢓࢖࢔➼㧗◳ᗘᮦᩱࡢࢫࣛ࢖ࢩࣥࢢ⏝ࡢࡶࡢࡢ2 ✀㢮ࡀ୺࡟౑⏝ࡉࢀ࡚࠸ࡿ㸬ࡉࡽ ࡟ᮦᩱࣟࢫࢆపῶࡍࡿࡓࡵ࡟㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ⣽⥺໬ࡀ㐍ࡵࡽࢀ࡚࠸ࡿ㸬㏆ᖺ㸪㟁╔ࢲ࢖ࣖࣔࣥࢻ ࣡࢖ࣖᕤලࡢ〇㐀᪉ἲࡢᨵၿ➼࡛ࡑࡢ〇㐀ࢥࢫࢺࡀపୗࡋ࡚ࡁ࡚࠸ࡿࡀ㸪⏘ᴗ⏺࡟࠾࠸࡚ࡣ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡ ࢖ࣖᕤලࡢ౯᱁ࡢࡉࡽ࡞ࡿపῶࢆồࡵ࡚࠸ࡿ㸬ࡇࡢࡼ࠺࡟㔜せᛶࡀୖ᪼ࡋ࡚࠸ࡿ࡟ࡶ࠿࠿ࢃࡽࡎ㸪㟁╔ࢲ࢖ࣖࣔ ࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀᪉ἲ࡟㛵ࡋ࡚ࡣࡑࡢሗ࿌ࡀᑡ࡞࠸ࡢࡀ⌧≧࡛࠶ࡿ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀ࡣ㸪 㟁╔ࢲ࢖ࣖࣔࣥࢻ࣍࢖࣮ࣝ➼ࡢ〇㐀࡟⏝࠸ࡽࢀ࡚࠸ࡿỿ㝆ඹᯒἲ㸦ᴮᮏ௚㸪1989㸧࡛ࡣ࡞ࡃ㸪ศᩓࡵࡗࡁἲࡀ୍ ⯡ⓗ࡛࠶ࡿ㸬᪂ࡋ࠸㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀᪉ἲ࡟㛵ࡋ࡚ࡣ㸪ࣈࣛࢩࡵࡗࡁἲࢆ⏝࠸ࡓ〇㐀᪉ᘧ㸦༓ ⴥ௚㸪2003㸧㸪ᾮὶᘧ㟁╔ࡵࡗࡁἲࢆ⏝࠸ࡓ〇㐀᪉ᘧ㸦ㄶゼ㒊௚㸪2010㸧㸪ᅇ㌿ࢻ࣒ࣛᘧ⿦⨨࡟ࡼࡿ〇㐀᪉ᘧ㸦ㄶ ゼ㒊௚㸪2012㸧➼ࡀሗ࿌ࡉࢀ࡚࠸ࡿ㸬ࡋ࠿ࡋ㸪࠸ࡎࢀࡢ᪉ᘧ࡟࠾࠸࡚ࡶ࣡࢖ࣖᕤලࡢ࣐ࣝࢳ〇㐀ࡀ࡛ࡁࡎ〇㐀ࢥ ࢫࢺࡢపῶ࡟㝈⏺ࢆ⏕ࡌ࡚࠸ࡿ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀ࢥࢫࢺࡣ㸪ࡑࡢ〇㐀㏿ᗘ࡟┤⤖ࡋࡵࡗࡁ⓶ ⭷ࡢᡂ㛗㏿ᗘ࡟౫Ꮡࡍࡿࡓࡵ㸪ྠ᫬࡟ᩘᮏࡢ࣡࢖ࣖᕤලࡀ〇㐀࡛ࡁࡿᢏ⾡ࡲࡓࡣ㧗࠸ࡵࡗࡁ㟁ὶᐦᗘࡀᚓࡽࢀࡿ 㧗㏿ࡵࡗࡁᢏ⾡ࢆά࠿ࡋࡓ࣡࢖ࣖᕤලࡢ㧗㏿〇㐀ᢏ⾡ࡀᮃࡲࢀ࡚࠸ࡿ㸬 ᮏ◊✲࡛ࡣ㸪㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ࣐ࣝࢳ〇㐀໬࠿ࡘࡵࡗࡁ㟁ὶᐦᗘࡢྥୖ࡟ࡼࡿ㧗㏿〇㐀໬ࢆᐇ⌧ ࡍࡿࡓࡵ࡟㸪ࣜࣥࢢ≧ࡢ⟄ࡢ୰࡟ከᩘᮏࡢ࣡࢖ࣖࢆタ⨨ࡋ㸪ࢥ࢔࣮ࣟࢱ࡟ྲྀࡾ௜ࡅࡽࢀࡓࣇ࢕ࣥ࡟ࡼࡾ࣡࢖ࣖ㏆ ഐࡢࡵࡗࡁᾮࢆ⃭ࡋࡃᨩᢾࡍࡿ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀᪉ᘧࢆ⪃᱌ࡋࡓ㸬ࡲࡓ㸪ࡵࡗࡁࡢ㝈⏺㟁ὶᐦ ᗘࡸ࣡࢖ࣖ෇࿘ࡢࡵࡗࡁ⓶⭷ࡢ⫗ཌࡀᆒ୍࡟࡞ࡿࡓࡵࡢ࣡࢖ࣖ࠾ࡼࡧ㝧ᴟࡢ㓄⨨➼࡟ࡘ࠸᳨࡚ウࡋࡓ㸬ࡉࡽ࡟㸪 ࣡࢖ࣖࡢ࿘᪉ྥ࡟ᆒ୍࡟◒⢏ࢆඹᯒࡉࡏࡿࡓࡵ࡟㸪ࡵࡗࡁᾮࡢὶࢀࢆไᚚࡋ࣡࢖ࣖࡢ࿘ᅖ࡟ࡵࡗࡁᾮࡀᆒ୍࡟ὶ ࢀࡿࡼ࠺࡟࣡࢖ࣖࡢ๓᪉࡟㞀ᐖ≀ࢆタ⨨ࡋࡓ㸬ࡇࡢࢻ࣒ࣛᘧ⿦⨨ࢆ⏝࠸࡚ヨసࡋࡓ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල ࡣ㸪ᕷ㈍ࡢ࣡࢖ࣖᕤල࡜ྠ➼࡞ษ᩿⬟ຊࢆ᭷ࡍࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡓࡢ࡛ሗ࿌ࡍࡿ㸬 2. ࢻ࣒ࣛᘧࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල〇㐀᪉ᘧࡢᥦ᱌ 2࣭1 ࢻ࣒ࣛᘧࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල〇㐀᪉ᘧࡢᴫᛕ࠾ࡼࡧ⡆᫆ࡵࡗࡁᵴ࡟ࡼࡿ᳨ド ⌧ᅾ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀࡟࠾࠸࡚ࡣ㸪ࡵࡗࡁᾮ࡟ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆᠱ⃮ࡉࡏࡓ㟁Ẽࢽࢵࢣࣝ ศᩓࡵࡗࡁἲࡀ⏕⏘⌧ሙ࡛ࡼࡃ฼⏝ࡉࢀ࡚࠸ࡿ㸬ࡵࡗࡁ⓶⭷ࡢᡂ㛗ࢆ㧗㏿໬ࡍࡿࡓࡵ࡟ࡣ㸪ࡵࡗࡁ㟁ὶᐦᗘࢆ㧗 ࡃࡍࡿࡇ࡜ࡀᚲ㡲࡛࠶ࡿ㸬㧗࠸ࡵࡗࡁ㟁ὶᐦᗘࢆᐇ⌧ࡍࡿࡓࡵ࡟㝜ᴟ௜㏆ࡢᣑᩓᒙ㸦㔠ᒓ࢖࢜ࣥḞஈᒙ㸧ࢆᖖ࡟ ⷧࡃࡋ࡞ࡅࢀࡤ࡞ࡽ࡞࠸㸦ᕝᓮ㸪1969㸧㸬ࡑࡢᡭẁ࡜ࡋ࡚㝜ᴟ㏆ഐ࡟㝧࢖࢜ࣥࢆ౪⤥ࡍࡿࡇ࡜ࡀ࡛ࡁࡿࡼ࠺࡞ࢪ࢙ ࢵࢺὶࡵࡗࡁἲࡸࣈࣛࢩࡵࡗࡁἲࡀሗ࿌ࡉࢀ࡚࠸ࡿ㸬ⴭ⪅ࡽࡣࣈࣛࢩࡵࡗࡁᢏ⾡ࢆά⏝ࡋ㸪࣮ࣟࣝࣈࣛࢩࡢᅇ㌿ ࡟ࡼࡾ㝧࢖࢜ࣥࡀῶᑡࡍࡿ㝜ᴟ㏆ഐࡢࡵࡗࡁᾮࢆᨩᢾࡋ㸪ᣑᩓᒙࢆⷧࡃࡍࡿຠᯝࢆ☜ㄆࡋ࡚࠸ࡿ㸦㇂㸪᱒㔝㸪2013㸧㸬 ࡇࢀࡣ2 ᮏࣈࣛࢩࡲࡓࡣࣇ࢕ࣥࢆ௜ࡅࡓ⩚᰿㌴ࡢ㛫࡟࣡࢖ࣖࢆ㏻ࡍᵓ㐀࡛࠶ࡾ㸪ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㧗㏿ 〇㐀ࢆᐇ⌧ࡋࡓ㸬2 ᮏࡢ⩚᰿㌴ࡢ୰ኸ㒊࡟࣡࢖ࣖࢆタ⨨ࡍࡿࣈࣛࢩ᪉ᘧ࡛ࡣ㸪ྠ᫬࡟ከᩘᮏࡢ㟁╔ࢲ࢖ࣖࣔࣥࢻ

(3)

࣡࢖ࣖᕤලࢆ〇㐀ࡍࡿࡓࡵ࡟ࡣከᩘࡢ⩚᰿㌴ࡀᚲせ࡜࡞ࡾ㸪〇㐀⿦⨨ࡢタ⨨㠃✚ࡀ኱ࡁࡃ࡞ࡿ㸪ᾘ㈝㟁ຊࡀ኱ࡁ ࡃ࡞ࡿ࡜࠸ࡗࡓၥ㢟Ⅼࡀ࠶ࡗࡓ㸬 ᮏ◊✲࡛ࡣ㸪ࣈࣛࢩࡵࡗࡁᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀ᢏ⾡ࢆᨵⰋࡋ㸪ࢥࣥࣃࢡࢺ࡛࠶ࡾ࡞ࡀࡽ㧗࠸ ࡵࡗࡁ㟁ὶᐦᗘࡀᚓࡽࢀࡿࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල〇㐀᪉ᘧࢆᥦ᱌ࡍࡿ㸬ᅗ1(a)ࡣ 3 ᮏࡢ࣡࢖ࣖࢆ ྠ᫬࡟ࡵࡗࡁࡍࡿࢻ࣒ࣛᘧࡵࡗࡁᵴࡢእほࢆ♧ࡍ㸬࣡࢖ࣖࡀ࡯ࡰ✵Ẽࡀᕳ㎸ࡳࡢ࡞࠸ࡵࡗࡁᵴෆࢆ㉮⾜ࡋ࡞ࡀࡽ㸪 ࣡࢖ࣖ࡟ࡵࡗࡁࡍࡿᵓ㐀࡛࠶ࡿ㸬ࡵࡗࡁᵴࡢୖୗ㒊ࡢ⤥㟁ࣉ࣮࣮ࣜ㸦㝜ᴟ㸧ࡀ࣡࢖ࣖ࡟᥋ゐࡋ⤥㟁ࡍࡿ㸬ࡵࡗࡁ ᾮࡣࢱࣥࢡ࠿ࡽ࣏ࣥࣉ࡟ࡼࡾ྾㎸ࡳ౪⤥ཱྀࡼࡾࡵࡗࡁᵴෆ࡟ὀධࡉࢀ㸪᤼ฟཱྀ࠿ࡽࢱࣥࢡ࡟ᡠࡾᚠ⎔ࡉࡏࡿ㸬ᅗ 1(b)ࡣࢻ࣒ࣛᘧࡵࡗࡁᵴࡢ᩿㠃ࢆ♧ࡍ㸬⩚᰿㌴㸦ࢥ࢔࣮ࣟࢱ㸧࡜ࡵࡗࡁᵴእቨࡢ㛫࡟ࣜࣥࢢ≧ࡢὶ㊰ࢆᙧᡂࡋ㸪 ὶ㊰࡟࣡࢖ࣖࡸࢽࢵࢣࣝ࣌ࣞࢵࢺࢆධࢀࡓࢳࢱࣥࣂࢫࢣࢵࢺ㸦㝧ᴟ㸧ࢆタ⨨ࡍࡿ㸬ࣜࣥࢢ≧ࡢὶ㊰࡟ࡣ」ᩘᮏࡢ ࣡࢖ࣖࡀ⡆༢࡟タ⨨࡛ࡁࡿࡓࡵ㸪ྠ᫬࡟ከᩘᮏࡢ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢస〇ࡀྍ⬟࡜࡞ࡿ㸬ᩘᯛࡢࣇ࢕ ࣥࡀྲྀࡾ௜ࡅࡽࢀࡓ⩚᰿㌴ࢆࡵࡗࡁᵴୖ㒊ࡢ࣮ࣔࢱ࡟ࡼࡾᅇ㌿ࡋ㸪ᵴෆࡢࡵࡗࡁᾮࢆᨩᢾࡍࡿ㸬ࡵࡗࡁᾮࡀᙉຊ ࡟ᨩᢾࡉࢀࡿࡇ࡜࡟ࡼࡾ࣡࢖ࣖ௜㏆ࡢᣑᩓᒙࡀⷧࡃ࡞ࡾ㧗࠸ࡵࡗࡁ㟁ὶᐦᗘࡀᚓࡽࢀࡿ࡜⪃࠼ࡽࢀࡿ㸬 ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㐃⥆〇㐀⿦⨨ࢆసࡿ๓࡟㸪ᅗ2 ࡟♧ࡉࢀࡿ⡆᫆ⓗ࡞ࢻ࣒ࣛᘧࡵࡗࡁᵴ ࢆస〇ࡋ㸪ࢻ࣒ࣛᘧ⿦⨨ࡢࡵࡗࡁ≉ᛶࢆ᳨ドࡋࡓ㸬ࡵࡗࡁᵴࡢእቨ࡜ࡋ࡚ỗ⏝ࡢࣅ࣮࢝ࢆ⏝࠸㸪ࣅ࣮࢝ࡢୗ㒊࡟ タ⨨ࡋࡓ࣍ࢵࢺࣉ࣮ࣞࢺ࡟ࡼࡾࡵࡗࡁᾮࢆຍ ࡋࡓ㸬㝧ᴟ࡜ࡋ࡚⣧ࢽࢵࢣࣝ〇ࡢ୸Წ㸦ȭ3mm㸧ࢆ౑⏝ࡋࡓ㸬ࡼ ࡾᆒ୍࡟࣡࢖ࣖ࡟⤥㟁࡛ࡁࡿࡼ࠺࡟ࡵࡗࡁᵴࡢෆഃ࡟⿵ຓ㟁ᴟ࡜ࡋ࡚ࢳࢱࣥ〇ࡢ㔠ᒓࣃ࢖ࣉࡶタ⨨ࡋࡓ㸬ࣇ࢕ࣥ ࡢඛ➃࡜㔠ᒓࣃ࢖ࣉࡢෆഃࡢ㊥㞳ࡣ࠾ࡼࡑ10mm ࡛࠶ࡾ㸪㝜ᴟࡢ࣡࢖ࣖ㸦ȭ0.25mm㸧࡜㝧ᴟࡢࢽࢵࢣࣝᲬࢆࣇ࢕ ࣥࡢඛ➃࡜㔠ᒓࣃ࢖ࣉෆഃࡢ୰㛫࡟タ⨨ࡋࡓ㸬࣮ࣔࢱࡢࢩࣕࣇࢺࡣୖ㒊࡛ᨭᣢࡋ㸪࣮ࣔࢱ࡟ࡼࡾ⩚᰿㌴ࢆᅇ㌿ࡋ㸪

Fig.1 Schematic of drum type plating unit

(4)

ࡵࡗࡁᾮࢆᨩᢾࡍࡿ㸬㔠ᒓࣃ࢖ࣉୖࡢࡵࡗࡁᾮࡢቃ⏺ᒙཌࡉࢆ⌮ㄽⓗ࡟ィ⟬ࡍࡿ࡜1mm ௨ୗ࡛࠶ࡾ㸦ຍ⸨㸪1989㸧㸪 ࣡࢖ࣖࡣὶࢀࡿࡵࡗࡁᾮࡢ୰ኸ㒊௜㏆㸦ቨ࡟ࡼࡿᙳ㡪ࡀ࡞࠸㡿ᇦ㸧࡟タ⨨ࡋࡓ㸬࡞࠾㸪ࢻ࣒ࣛᘧ⡆᫆ࡵࡗࡁᵴࢆ ⏝࠸ࡓᇶ♏ᐇ㦂࡛ࡣ㸪࣡࢖ࣖࡣ㉮⾜ࡉࡏࡎࢽࢵࢣࣝ୸Წ࡜ྠࡌࡃୖୗࡢ἞ල࡟ᅛᐃࡋࡓ㸬 ࣈࣛࢩࡵࡗࡁᘧࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල〇㐀⿦⨨࡟࠾࠸࡚ࡣ㸪2 ᮏࡢ⩚᰿㌴ࡀ㏫᪉ྥ࡟ᅇ㌿ࡋࡓሙྜࡵࡗࡁᾮ ࡀ࣡࢖ࣖࡢ∦ഃ࡟ᙜࡓࡿࡓࡵ◒⢏ࡢᯒฟࡀ೫ࡿࡢ࡟ᑐࡋ㸪2 ᮏࡢ⩚᰿㌴ࡀྠ᪉ྥ࡟ᅇ㌿ࡍࢀࡤ࣡࢖ࣖࡢ඲㠃ࡀࡼ ࡾᆒ୍࡟ࡵࡗࡁᾮࡀᙜࡓࡾ࣡࢖ࣖ࡟ᯒฟࡋࡓ◒⢏ࡢศᩓᛶࡀྥୖࡍࡿࡇ࡜ࡀศ࠿ࡗ࡚࠸ࡿ㸦᱒㔝㸪㇂㸪2011㸧㸬ᮏ ◊✲࡛㛤Ⓨࡋࡓࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀⿦⨨࡟࠾࠸࡚ࡶࡵࡗࡁᾮࡀ୍᪉ྥ࡟ὶࢀࡿࡓࡵ◒⢏ ࡢ೫ᯒ⌧㇟ࡀ⏕ࡌࡿࡀ㸪➨3 ❶࡛ࡑࡢゎỴ᪉ἲࢆヲ⣽࡟㏙࡭ࡿ㸬࡞࠾㸪◒⢏ࢆධࢀ࡞࠸ሙྜ㸪࣡࢖ࣖࡢ෇࿘᪉ྥ ࡟࠾ࡅࡿࡵࡗࡁ⓶⭷ࡢᡂ㛗㏿ᗘ࡟㛵ࡋ࡚ࡣ㸪ᅗ3(a)࡟♧ࡉࢀࡿࡼ࠺࡟࣡࢖ࣖࡢ෇࿘᪉ྥ࡟ 8 ಶᡤࡢࡵࡗࡁ⓶⭷ࡢ ཌࡉࢆ ᐃࡋࡓ⤖ᯝ㸦ᅗ3(b)㸧㸪ࡑࡢࡤࡽࡘࡁࡀᑡ࡞࠸ࡇ࡜ࡀ☜ㄆࡉࢀ࡚࠸ࡿ㸬ࡋࡓࡀࡗ࡚㸪࣡࢖ࣖࡢ෇࿘࡟ᯒฟ ࡋࡓ◒⢏ࡢศᩓᛶࡀᝏࡃ࡞ࡿཎᅉࡀࡵࡗࡁ⓶⭷ࡢᡂ㛗㏿ᗘ࡟ࡼࡿࡶࡢ࡛ࡣ࡞࠸ࡇ࡜ࡀࢃ࠿ࡿ㸬 2࣭2 ࢻ࣒ࣛᘧࡵࡗࡁᵴࡢࡵࡗࡁ≉ᛶ ࡵࡗࡁᐇ㦂ࢆ⾜࠺๓࡟ⰺ⥺࡛࠶ࡿࣆ࢔ࣀ⥺ࡢ๓ฎ⌮࡜ࡋ࡚㸪᭷ᶵ⁐๣࡟ࡼࡿ⬺⬡Ὑίࢆ⾜ࡗࡓᚋ㸪10vol%ࡢሷ 㓟⁐ᾮࡼࡾࣆ࢔ࣀ⥺⾲㠃ࡢἜ⬡ࡸ㜵㗵⏝ࡢ㯤㖡⭷ࢆ᏶඲࡟ྲྀࡾ㝖࠸ࡓ㸬⾲1 ࡣࡵࡗࡁᐇ㦂ࡢᇶᮏ᮲௳ࢆ♧ࡍ㸬㟁 ╔ᛂຊࡀᑠࡉࡃ㸪㧗࠸ࡵࡗࡁ㟁ὶᐦᗘࡀᚓࡽࢀࡿࡼ࠺࡟ࢫࣝࣇ࢓࣑ࣥ㓟ࢽࢵࢣࣝᾎࢆ౑⏝ࡋࡓ㸬ࢻ࣒ࣛᘧࡵࡗࡁ ᵴࡢࡵࡗࡁ≉ᛶࡀㄪ࡭ࡸࡍ࠸ࡼ࠺࡟㸪ᐇ㝿ࡢ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢࡵࡗࡁᒙࡼࡾࡵࡗࡁ⓶⭷ࢆཌࡃࡋࡓ㸬 ࡲࡎ㸪㝧ᴟࡢࢽࢵࢣࣝᲬ࡜㝜ᴟࡢ࣡࢖ࣖ࡜ࡢ㟁ᴟ㛫㊥㞳࡟ࡼࡿ㝈⏺㟁ὶᐦᗘ㸦ᅗ4(a)࡟♧ࡉࢀࡿࡼ࠺࡞ࡵࡗࡁ↝ ࡅࡀ⏕ࡌ࡞࠸᭱኱ࡢࡵࡗࡁ㟁ὶᐦᗘ㸧ࡢኚ໬ࢆㄪ࡭ࡓ㸬ᅗ4(b)࡟♧ࡉࢀࡿࡼ࠺࡟㔠ᒓࣃ࢖ࣉ࡟㏻㟁ࡏࡎࢽࢵࢣࣝ Წࡢࡳ࡟㏻㟁ࡋࡓሙྜ࡟ࡣࢽࢵࢣࣝᲬ࡜࣡࢖ࣖࡢ㊥㞳ࡀ㛗ࡃ࡞ࡿ࡟ࡘࢀ࡚㝈⏺㟁ὶᐦᗘࡀୗࡀࡗࡓ㸬୍᪉㸪㔠ᒓ ࣃ࢖ࣉ࡟ࡶ㏻㟁ࡋࡓሙྜ࡟ࡣ㸪ࢽࢵࢣࣝᲬ࡜࣡࢖ࣖࡢ㊥㞳࡟ࡼࡿ㝈⏺㟁ὶᐦᗘࡢኚ໬ࡀ࡯࡜ࢇ࡝ぢࡽࢀࡎ㧗࠸㟁

Fig.3 Variation of thickness of plated layer in circumferential direction of wire caused by the rotating core rotor

(5)

ὶᐦᗘࢆ⥔ᣢ࡛ࡁࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬ࡇࢀࡣࢽࢵࢣࣝᲬ࡜࣡࢖ࣖ㛫ࡢ㟁ᴟ㛫㊥㞳ࡀ኱ࡁࡃ࡞ࡿ࡟ࡘࢀ㸪ࡵࡗࡁᾮ ࡢ㟁Ẽ᢬ᢠࡀቑ࠼ࢽࢵࢣࣝᲬ࠿ࡽ࣡࢖ࣖ࡬ࡢ㟁Ẽ౪⤥ࡀᑡ࡞ࡃ࡞ࡗࡓࡓࡵ࡛࠶ࡿ㸬ࡑࢀ࡟ᑐࡋ࡚㔠ᒓࣃ࢖ࣉ࡟ࡶ ㏻㟁ࡋࡓሙྜࡣࡵࡗࡁ࡟ᚲせ࡞㟁Ẽ㔞ࡀ࣡࢖ࣖ࡟༑ศ࡟౪⤥࡛ࡁࡓ࡜⪃࠼ࡽࢀࡿ㸬 ḟ࡟㸪⩚᰿㌴ࡢᅇ㌿㏿ᗘࡀࡵࡗࡁࡢ㝈⏺㟁ὶᐦᗘࡸࡵࡗࡁ⓶⭷ࡢᡂ㛗㏿ᗘ࡟୚࠼ࡿᙳ㡪ࢆㄪ࡭ࡓ㸬ᅗ5(a) ࡟♧ ࡉࢀࡿࡼ࠺࡟⩚᰿㌴ࡢᅇ㌿㏿ᗘࢆ100rpm ࠿ࡽ 200rpm ࡟ቑຍࡍࡿ࡜㝈⏺㟁ὶᐦᗘࡀ⣙ 2 ಸ࡟ྥୖࡍࡿࡇ࡜ࡀศ࠿ ࡗࡓ㸬ࡵࡗࡁᾮࡀ⃭ࡋࡃᨩᢾࡉࢀࡿ࡜࣡࢖ࣖ௜㏆ࡢᣑᩓᒙࡀⷧࡃ࡞ࡾ࣡࢖ࣖ࡬ࡢNi2+౪⤥ࡀᨵၿࡉࢀࡓࡓࡵ㝈⏺ 㟁ὶᐦᗘࡀྥୖࡋࡓ࡜⪃࠼ࡽࢀࡿ㸬ࡋ࠿ࡋ㸪ᅇ㌿㏿ᗘࡀ200rpm ௨ୖ࡟࡞ࡿ࡜㝈⏺㟁ὶᐦᗘࡀపୗࡍࡿഴྥࡀ⌧ ࢀࡓ㸬ࡇࢀࡣ㸪⩚᰿㌴ࡀ㧗㏿࡟ᅇ㌿ࡍࡿ࡜ࡵࡗࡁᾮࡢᨩᢾࡀ⃭ࡋࡃ࡞ࡾ㸪ᅗ5(b)࡟♧ࡉࢀࡿࡼ࠺࡟ࢽࢵࢣࣝᲬᚋ ᪉ࡢࡵࡗࡁᾮ㸦㉥ᯟࡢ୰㸧࡟✵Ẽࡀᕳࡁ㎸ࡲࢀࡓࡓࡵ࡜⪃࠼ࡽࢀࡿ㸬ᕳࡁ㎸ࡲࢀࡓ✵ẼࡀNi2+ࡢ౪⤥ࢆጉࡆ㸪࣡ ࢖ࣖࡢ↝ࡅࡀⓎ⏕ࡋࡓ㸬ࡲࡓ㸪ࡵࡗࡁ⓶⭷ࡢᡂ㛗㏿ᗘࡣ㟁ὶᐦᗘ࡟࡯ࡰẚ౛ࡍࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡿ㸬 ᅗ1 ࡟♧ࡉࢀࡿࡼ࠺࡟⩚᰿㌴࡜ࡵࡗࡁᵴࡢእቨࡀᙧᡂࡉࢀࡓࣜࣥࢢ≧ࡢὶ㊰࡟ከᩘᮏࡢ࣡࢖ࣖࢆྠ᫬࡟タ⨨ࡍ ࡿࡇ࡜࡟ࡼࡾ㸪ࢻ࣒ࣛᘧࡵࡗࡁᵴࢆ⏝࠸࡚ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖࡢ࣐ࣝࢳ〇㐀ࡀྍ⬟࡛࠶ࡿ㸬」ᩘᮏࡢ࣡࢖ࣖ࡟ྠ ᫬࡟㟁Ẽࢆὶࡋࡓሙྜ㸪࣡࢖ࣖ㛫࡟㟁Ẽⓗ࡞ᖸ΅ࡀ⏕ࡌ㸪ࡵࡗࡁ⭷ཌࡢᆒ୍ᛶࡀຎࡿࡇ࡜ࡀ⪃࠼ࡽࢀࡿ㸬ࡑࡇ࡛㸪 ࡵࡗࡁ⭷ཌࡢᆒ୍ᛶࢆㄪ࡭ࡿࡓࡵ㸪ᅗ6(a)࡟♧ࡍࡼ࠺࡟ࡵࡗࡁᵴ࡟ 2 ᮏࡢ࣡࢖ࣖࢆྠ᫬࡟タ⨨ࡋ㸪ࡑࢀࡒࢀࡢ࣡ ࢖ࣖ࡟ᯒฟࡋࡓࡵࡗࡁ⓶⭷ࡢ෇࿘᪉ྥࡢཌࡉࡤࡽࡘࡁࢆㄪᰝࡋࡓ㸬ᅗ6(b)࡟♧ࡍࡼ࠺࡟㸪1 ᮏࡎࡘ㏻㟁ࡋࡓሙྜ ࡟ࡣࡵࡗࡁᾮࡀ୍᪉ྥ࡟ὶࢀ࡚ࡶ࣡࢖ࣖࡢ෇࿘᪉ྥࡢ⭷ཌࡢࡤࡽࡘࡁࡣ࡯࡜ࢇ࡝࡞࠿ࡗࡓ㸬ࡑࢀࡣ㸪࣡࢖ࣖ㝃㏆ ࡟ࡣ㸪Ni2+ࡀ༑ศ࡟౪⤥ࡉࢀ㸪2 ᮏࡢ࣡࢖ࣖ㛫࡟㟁Ẽⓗ࡞ᖸ΅ࡀ࡞࠿ࡗࡓࡓࡵ࡜⪃࠼ࡽࢀࡿ㸬ࡑࢀ࡟ᑐࡋ࡚ 2 ᮏ 

Fig.4 Effect of anode configuration on limiting current density

(6)

ࡢ࣡࢖ࣖ࡟ྠ᫬࡟㏻㟁ࡋࡓሙྜ㸪࣡࢖ࣖ㛫㊥㞳࡟ࡼࡗ࡚ࡵࡗࡁ⓶⭷ࡢཌࡉࡤࡽࡘࡁࡀ኱ࡁࡃ࡞ࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬 ≉࡟࣡࢖ࣖྠኈࡀ᥋㏆ࡋࡓሙྜ㸦࣡࢖ࣖ㛫㊥㞳㸸2mm㸧࡛ࡣ㸪ࡵࡗࡁ⓶⭷ࡢཌࡉࡤࡽࡘࡁࡀ᭱ࡶ኱ࡁࡃ࡞ࡗࡓ㸬 ᅗ7 ࡣࡵࡗࡁᚋࡢ࣡࢖᩿ࣖ㠃ࡢ୍౛ࢆ♧ࡍ㸬1 ᮏࡎࡘ㏻㟁ࡋࡓሙྜ࡟ࡣ࣡࢖ࣖࡢ෇࿘࡟࠾ࡅࡿ⭷ཌࡣ࡯ࡰᆒ୍࡜ ࡞ࡗࡓࡀ㸪2 ᮏࡢ࣡࢖ࣖ࡟ྠ᫬࡟㏻㟁ࡍࡿ࡜࣡࢖ࣖࡢ᩿㠃ࡀ࣒࢝ᙧ≧ࢆ࿊ࡋ࡚࠸ࡿࡇ࡜ࡀ☜ㄆࡉࢀࡿ㸬2 ᮏࡢ࣡࢖ ࣖ࡟ྠ᫬࡟㏻㟁ࡍࡿ࡜࣡࢖ࣖ㛫ࡢ㟁Ẽⓗ࡞ྲྀࡾྜ࠸ࡀ」㞧࡜࡞ࡾ㸪࣡࢖ࣖ࡟ᯒฟࡍࡿࡵࡗࡁ⓶⭷ࡀ෇࿘᪉ྥ࡛୙ ᆒ୍࡜࡞ࡗࡓ࡜᥎ᐹࡋࡓ㸬࣡࢖ࣖ㛫㊥㞳ࡀᑠࡉࡃ࡞ࡿ࡯࡝ࡵࡗࡁ⭷ཌࡢᆒ୍ᛶࡣࡉࡽ࡟ᝏ໬ࡋࡓ㸬࣡࢖ࣖ㛫㊥㞳 ࡀ28mm ࡢሙྜ࡟ࡣ⭷ཌࡢ᭱኱࡜᭱ᑡࡢᕪࡀ 8.9ȣm ࡛࠶ࡗࡓࡢ࡟ᑐࡋ㸪2mm ࡢሙྜ࡟ࡣ 37.2ȣm ࡜࡞ࡗࡓ㸬࣡ ࢖ࣖ㛫㊥㞳ࡀ2mm ࡢሙྜ㸪⭷ཌࡢ᭱኱࡜᭱ᑡࡢᕪࡀᖹᆒ⭷ཌࡢ 5 ๭⛬ᗘ࡜࡞ࡗ࡚࠾ࡾ㸪ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤ ලࡢᛶ⬟࡟኱ࡁࡃᙳ㡪ࢆ୚࠼ࡿ࡜ண᝿ࡉࢀࡿ㸬࣡࢖ࣖ㛫㊥㞳ࡀ28mm ࡟࡞ࡿ࡜㸪࣡࢖ࣖ㛫ࡢ㟁Ẽⓗ࡞ྲྀྜ࠸ࡀ㍍ ῶࡋᖹᆒ⭷ཌࡢ1 ๭௨ୗ࡟཰ࡲࡾ㸪ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢᛶ⬟࡬ࡢᙳ㡪ࡀ࡯࡜ࢇ࡝࡞ࡃ࡞ࡗࡓ࡜⪃࠼ࡽࢀࡿ㸬 ࡞࠾㸪ྠ᫬࡟ᩘᮏࡢ࣡࢖ࣖᕤලࢆ〇㐀ࡍࡿࢻ࣒ࣛᘧࡵࡗࡁᵴࢆタィࡍࡿ㝿㸪⤥㟁ࣉ࣮࣮ࣜࡢタ⨨ࢫ࣮࣌ࢫ➼ࢆ⪃ ៖ࡍࢀࡤ࣡࢖ࣖ㛫㊥㞳ࢆ50mm ௨ୗ࡟ࡍࡿࡇ࡜ࡀ஦ᐇୖᅔ㞴࡛࠶ࡿࡓࡵ㸪࣡࢖ࣖ㛫㊥㞳࡟ࡼࡿࡵࡗࡁ⭷ཌࡢᙳ㡪 ࡀ࡯࡜ࢇ࡝࡞࠸࡜⪃࠼ࡽࢀࡿ㸬 2࣭3 ࣡࢖ࣖ࡟ᯒฟࡍࡿ◒⢏ࡢศᕸ ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆࡵࡗࡁᾮ࡟ศᩓࡋࡓ」ྜࡵࡗࡁࡢᐇ㦂᮲௳ࢆ⾲2 ࡟♧ࡍ㸬ୖ㏙ࡢࡼ࠺࡟ᨩᢾࣇ࢕ࣥࢆྲྀࡾ ௜ࡅࡓእቨࢆ⩚᰿㌴࡜㏫᪉ྥ࡟ᅇ㌿ࡉࡏࢀࡤ㸪࣡࢖ࣖ࡬ࡢ◒⢏ࡢᯒฟࡣᆒ୍࡟࡞ࡿ࡜ண᝿ࡉࢀࡓࡀ㸪እቨࢆᅇ㌿

Fig.6 Thickness distribution of plated layer around wires

(7)

ࡉࡏࡿ࡟ࡣᵓ㐀ࡀ」㞧࡜࡞ࡾᾘ㈝㟁ຊࡶቑຍࡍࡿࡓࡵ㸪⩚᰿㌴ࡢࡳࢆᅇ㌿ࡉࡏ࡚ᆒ୍࡟◒⢏ࢆᯒฟࡉࡏࡿࡇ࡜ࡀ ࡛ࡁ࡞࠸࠿᳨ウࡋࡓ㸬ᅗ8(a)࡟♧ࡍࡼ࠺࡟㸪ࡵࡗࡁᾮࡀ୍᪉ྥ࠿ࡽὶࢀࡿࡓࡵࡵࡗࡁᾮ࡜࣡࢖ࣖࡀࡪࡘ࠿ࡿ㠃࡟ ࡣ◒⢏ࡀᯒฟࡏࡎࡵࡗࡁᾮ࡟ὶࡉࢀࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬ࡑࢀ࡟ᑐࡋ࡚ࡵࡗࡁᾮࡢὶࢀ࡟ᑐࡋ࡚࣡࢖ࣖࡢᚋ᪉࡟ࡣ ࡵࡗࡁᾮࡢ 㸦஘ὶ㸧ࡀ⏕ࡌ㸦ᮾ㸪1999㸧㸪ᩘከࡃࡢ◒⢏ࡀ௜╔ࡋࡓ㸬ࡋࡓࡀࡗ࡚㸪࣡࢖ࣖࡢ࿘ᅖ࡟ࡵࡗࡁᾮࡢ஘ ὶࢆ⏕ࡌࡉࡏࡿࡇ࡜ࡀ࡛ࡁࢀࡤ㸪◒⢏ࡢ௜╔ࢆᆒ୍໬࡟ࡉࡏࡿࡇ࡜ࡀ࡛ࡁࡿ࡛ࡣ࡞࠸࠿࡜⪃࠼ࡓ㸬ࡑࡇ࡛㸪࣡࢖ ࣖ࿘ᅖࡢࡵࡗࡁᾮࡢὶࢀࢆไᚚࡍࡿࡓࡵ࡟࣡࢖ࣖࡢ๓᪉࡟ࡵࡗࡁᾮࡢὶࢀ࡟ᑐࡍࡿ㞀ᐖ≀ࢆタ⨨ࡍࡿࡇ࡜࡟ࡋࡓ㸬 2 ḟඖὶయゎᯒࢯࣇࢺ㸦Flowsquare3.1b㸧࡟ࡼࡾ㞀ᐖ≀ࡢᙧ≧ࡸ఩⨨ࡢ᭱㐺໬ࢆ⾜ࡗࡓ⤖ᯝ㸪࣡࢖ࣖࡢ๓᪉࡟ 2 ᮏ ࡢᰕ≧㞀ᐖ≀ࢆタ⨨ࡍࡿࡇ࡜࡛࣡࢖ࣖ࿘ᅖ࡟஘ὶࢆᙧᡂࡍࡿࡇ࡜ࡀ࡛ࡁࡓ㸦ὸ἟㸪1977㸧㸬ࡵࡗࡁᾮࡢὶࢀࢆไᚚ ࡍࡿࡇ࡜࡟ࡼࡾ㸪ᅗ8(b)࡟♧ࡉࢀࡿࡼ࠺࡟࣡࢖ࣖࡢ࿘ᅖ࡟◒⢏ࡀᆒ୍࡟௜╔࡛ࡁࡿࡇ࡜ࡀ☜࠿ࡵࡽࢀࡓ㸬 3. ࢻ࣒ࣛᘧࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㐃⥆〇㐀⿦⨨ 3࣭1 㐃⥆〇㐀⿦⨨ࡢ㛤Ⓨ 㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀ᕤ⛬ࡣ㸪ⰺ⥺ࡢάᛶ໬ฎ⌮ᕤ⛬㸪ୗᆅࡵࡗࡁᕤ⛬㸪」ྜࡵࡗࡁᕤ⛬㸪ᚋࡵ ࡗࡁᕤ⛬㸪Ὑίᕤ⛬➼࡛ᵓᡂࡉࢀࡿ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ⣲ᮦ࡜ࡍࡿࣆ࢔ࣀ⥺ࡣ㜵㗵ࡢࡓࡵ࡟㌾ࡽ࠿ ࠸㯤㖡ࡵࡗࡁࡀ᪋ࡉࢀ࡚࠸ࡿࡓࡵ㸪ࡑࡢ࠺࠼࡟ࢽࢵࢣࣝࡵࡗࡁࡀᡂ㛗ࡍࡿ࡜ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ౑⏝᫬࡟  

Fig. 8 Uniformity in abrasive distribution with obstacles

(8)

ࡵࡗࡁ⓶⭷ࡀ๤㞳ࡉࢀࡸࡍ࠸㸬ࡑࡢࡓࡵ㸪ࢽࢵࢣࣝࡵࡗࡁ⓶⭷࡜ⰺ⥺ࡢᐦ╔ᙉᗘࢆྥୖࡉࡏࡿࡓࡵ࡟㸪᭷ᶵ⁐๣ ࡟ࡼࡿ⬺⬡Ὑίࢆ⾜ࡗࡓᚋ㸪࢔ࣝ࢝ࣜ㟁ゎ➼࡛㯤㖡ᒙࢆྲྀࡾ㝖ࡃ࡞࡝ࡢ๓ฎ⌮ࡀ⾜ࢃࢀࡿ㸬ࡑࡋ࡚㸪㟢ฟࡋࡓࣆ ࢔ࣀ⥺࡜ࡵࡗࡁ⓶⭷ࡢᐦ╔ᛶࢆྥୖࡍࡿࡓࡵ࡟ሷ㓟ࡼࡾ࣡࢖ࣖ⾲㠃ࡢάᛶ໬ࢆ⾜ࡗ࡚࠿ࡽ࢘ࢵࢻᾎࡸ࣡ࢵࢺᾎ࡟ ࡼࡾࢽࢵࢣࣝࢫࢺࣛ࢖ࢡࡵࡗࡁ㸦ୗᆅࡵࡗࡁ㸧ࢆ᪋ࡋࡓᚋ㸪ࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆᅛ╔ࡉࡏࡿ」ྜࡵࡗࡁࢆ⾜࠺㸬 ࡑࡢᚋ㸪◒⢏ࡢಖᣢຊࢆྥୖࡉࡏࡿࡓࡵ࡟ᚋࡵࡗࡁ㸦◒⢏ࡢಖᣢᙉᗘࢆ㧗ࡵࡿᇙࡵ㎸ࡳࡵࡗࡁ㸧ࢆ᪋ࡍ㸬᭱ᚋ࡟ ⣧Ỉ࡛࣡࢖ࣖࢆὙίࡋ㸪㜵㗵ᮦࢆሬᕸࡍࡿ㸬 ๓❶࡛ࡣ㸪⡆᫆ⓗ࡞ࡵࡗࡁᵴࢆ⏝࠸࡚ࢻ࣒ࣛᘧࡵࡗࡁᵴ࡟ࡼࡿ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀ࡀྍ⬟࡛࠶ ࡿࡇ࡜ࢆ☜ㄆࡋࡓ㸬ᮏ⠇࡛ࡣ㸪㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࢆ㐃⥆ⓗ࡟〇㐀ࡍࡿ⿦⨨ࢆᥦ᱌ࡍࡿ㸬㟁╔ࢲ࢖ࣖࣔ ࣥࢻ࣡࢖ࣖᕤල〇㐀⿦⨨࡛᭱ࡶ㔜せ࡜࡞ࡿࡵࡗࡁᵴࡣ㸪࣡࢖ࣖᕤලࡢ〇㐀㏿ᗘࡸရ㉁࡟኱ࡁࡃᙳ㡪ࡍࡿ㸬ࢻ࣒ࣛ ᘧࡵࡗࡁᵴࢆ౑⏝ࡍࡿࡇ࡜࡟ࡼࡾ㧗࠸ࡵࡗࡁ㟁ὶᐦᗘࡀᚓࡽࢀࡿࡓࡵ㸪࣡࢖ࣖᕤල㐃⥆〇㐀⿦⨨ࡢࡍ࡭࡚ࡢࡵࡗ ࡁᵴࡣᅗ 9(a)࡟♧ࡉࢀࡿࢻ࣒ࣛᘧࡵࡗࡁᵴ࡟ࡋࡓ㸬࣏ࣥࣉ࡟ࡼࡾࡵࡗࡁᾮࢱࣥࢡ࠿ࡽࡵࡗࡁᾮࢆ㏦ࡾฟࡋ㸪ࡵࡗ ࡁᵴୖ㒊ࡢὶධཱྀ࠿ࡽࡵࡗࡁᵴෆ࡟ࡵࡗࡁᾮࢆὀධࡋ㸪ୗ㒊ࡢὶฟཱྀࡼࡾࡵࡗࡁᾮࢱࣥࢡ࡟ᡠࡍᵓ㐀࡛࠶ࡿ㸬⡆ ᫆ࡵࡗࡁᵴ࡜ྠࡌࡃୖ㒊࡟タ⨨ࡋࡓ࣮ࣔࢱ࡟ࡼࡾ⩚᰿㌴ࢆᅇ㌿ࡋ㸪ࡵࡗࡁᾮࢆᨩᢾࡍࡿ㸬ࡵࡗࡁᵴୖୗ㒊࡟タ⨨ ࡋࡓࢫࢸࣥࣞࢫ㗰〇ࡢࣉ࣮࣮ࣜ࡟ࡼࡾ࣡࢖ࣖ㸦㝜ᴟ㸧࡟⤥㟁ࡍࡿ㸬㟁Ẽࡵࡗࡁ⏝ࢽࢵࢣࣝ࣌ࣞࢵࢺࢆ඘ሸࡋࡓࢳ ࢱࣥࣂࢫࢣࢵࢺࢆྍ⁐ᛶ㝧ᴟ࡜ࡋ࡚౑⏝ࡋࡓ㸬ࡲࡓ㸪ࢳࢱࣥ〇ࣃ࢖ࣉࢆࡵࡗࡁᵴࡢෆቨ࡟タ⨨ࡋ㸪୙⁐ᛶࡢ⿵ຓ 㟁ᴟ࡜ࡋ࡚౑⏝ࡋࡓ㸬ࢳࢱࣥࣂࢫࢣࢵࢺ࡜ࢳࢱࣥࣃ࢖ࣉࡢୖ㒊ࡼࡾ㟁Ẽ౪⤥ࢆ⾜ࡗࡓ㸬ࡵࡗࡁᵴࡢ୰ኸ࡟እᚄࡀ ȭ90mm ࡢࣉࣛࢫࢳࢵࢡ〇෇ᰕ࡟ 6 ಶࡢࣇ࢕ࣥࢆྲྀࡾ௜ࡅࡓ⩚᰿㌴ࢆタ⨨ࡋࡓ㸬ࣇ࢕ࣥࡢඛ➃࠿ࡽࣉࣛࢫࢳࢵࢡ 〇෇ᰕࡲ࡛ࡢ㊥㞳ࡣ10mm ࡜ࡋࡓ㸬෇⟄ᐜჾࡢෆᚄࡣȭ130mm ࡛࠶ࡿࡀ㸪ཌࡉ 1mm ࡢࢳࢱࣥࣃ࢖ࣉࢆ౑⏝ࡋࡓ ࡓࡵࣇ࢕ࣥࡢඛ➃࡜ࢳࢱࣥࣃ࢖ࣉෆቨ࡜ࡢ㊥㞳ࡣ 9mm ࡛࠶ࡿ㸬ࢻ࣒ࣛᘧࡵࡗࡁᵴࡢ㧗ࡉ࡟ࡘ࠸࡚ࡣ㸪ࡵࡗࡁ࡛ ࡁࡿ᭷ຠ㧗ࡉࡀ350mm ࡛࠶ࡿࡀ㸪550mm ࡲ࡛ᘏ㛗࡛ࡁࡿࡼ࠺࡟タィࡋࡓ㸬ࢻ࣒ࣛᘧࡵࡗࡁᵴ࡛ࡣࡵࡗࡁᾮࡀ࡯ ࡰᐦ㛢ࡉࢀࡿࡓࡵ㸪᭷ᐖ࢞ࢫࡢ᤼ฟࡀᑡ࡞ࡃసᴗ⎔ቃࡀࡼ࠸㸬ࡇࡢࢻ࣒ࣛᘧࡵࡗࡁᵴࡣ㸪ෆ㒊ᐜ✚ࡀ⣙2L ࡛࠶ ࡾ㸪୍⯡ⓗ࡞ࡵࡗࡁᵴ࡟ẚ࡭࡚ࡵࡗࡁᾮࡢ౑⏝㔞ࡀᑡ࡞࠸࡜࠸࠺㛗ᡤࡀ࠶ࡿ㸬ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖ ᕤල〇㐀⿦⨨ࡢ඲ㇺࢆᅗ9(b)࡟♧ࡍ㸬࣡࢖ࣖࡢᕳฟ㒊㸪⬺⬡㸪㓟Ὑ࣭άᛶ໬㸪๓ࡵࡗࡁ㸦1 ᵴ㸧㸪」ྜࡵࡗࡁ㸦1 ᵴ㸧㸪ᚋࡵࡗࡁ㸦3 ᵴ㸧㸪㜵㗵๣ሬᕸ㒊㸪࣡࢖ࣖࡢᕳྲྀ㒊㸪ࡵࡗࡁᾮࡢ ᗘࡸࢻ࣒ࣛࡢᅇ㌿ไᚚ࡞࡝ࢆ⾜࠺ࢥࣥࢺ ࣮ࣟࣛ㒊࡛ᵓᡂࡉࢀࡿ㸬ྛࡵࡗࡁᵴ࡟ࡣࡵࡗࡁᾮࢆ⵳✚ࡍࡿࢱࣥࢡ㸦ᐜ㔞㸸10L㸧ࡀࡘ࠸࡚࠾ࡾ㸪ಶู࡟ࡵࡗࡁ ᾎࡢ⟶⌮ࢆྍ⬟࡟ࡋࡓ㸬࢘ࢵࢻᾎࡣ㸪ᙉ㓟ᾎ࡛࠶ࡾ㝜ᴟ௜㏆࡟኱㔞ࡢỈ⣲࢞ࢫࢆⓎ⏕ࡋ㸪㝜ᴟ௜㏆࡟࠾࠸࡚㑏ඖ 㞺ᅖẼ࡛ᕤලẕᮦࡢ⾲㠃㓟໬≀ࢆ㑏ඖࡋ࡞ࡀࡽࡵࡗࡁࡍࡿࡇ࡜ࡀྍ⬟࡛㸪ẕᮦ࡜ࡵࡗࡁ⓶⭷࡜ࡢᐦ╔ᛶࡀⰋࡃ࡞ ࡿ㸬ࡑࡢࡓࡵ㸪ࢫࢺࣛ࢖ࢡࡵࡗࡁᕤ⛬࡟ࡣ࢘ࢵࢻᾎࢆ㑅ᢥࡋࡓ㸬◒⢏ࢆᯒฟࡉࡏࡿᕤ⛬ࡢ」ྜࡵࡗࡁᾎ࡜◒⢏ࡢ ಖᣢຊࢆ㧗ࡵࡿᚋࡵࡗࡁᕤ⛬࡟ࡣ㸪㟁╔ᛂຊࡀᑠࡉࡃᡂ⭷㏿ᗘࡀ㧗࠸ࢫࣝࣇ࢓࣑ࣥ㓟ࢽࢵࢣࣝᾎࢆ㑅ᢥࡋࡓ㸬ࡲ ࡓ㸪㧗࠸ᡂ⭷㏿ᗘࢆ⥔ᣢࡍࡿࡓࡵሷᇶᛶⅣ㓟ࢽࢵࢣࣝ࡜࢔࣑ࢻ◲㓟ࢆ⏝࠸࡚」ྜࡵࡗࡁᾎ࡜ᚋࡵࡗࡁᾎࡢpH ࢆ 4 ⛬ᗘ࡟࡞ࡿࡼ࠺࡟⟶⌮ࡋࡓ㸬

(9)

3࣭2 ࡵࡗࡁ᮲௳࡟ࡼࡿ㟁╔≉ᛶࡢᙳ㡪 㛤Ⓨࡋࡓࢻ࣒ࣛᘧࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㐃⥆〇㐀⿦⨨ࢆ⏝࠸࡚⡆᫆ࡵࡗࡁᵴ࡜ẚ㍑ࡋ࡞ࡀࡽࡵࡗࡁᵴࡢࡵ ࡗࡁ≉ᛶࢆㄪ࡭ࡓ㸬ᅗ10(a)࡟♧ࡉࢀࡿࡼ࠺࡟⩚᰿㌴ᅇ㌿㏿ᗘࡢቑຍ࡟ࡘࢀ࡚ࡵࡗࡁࡢ㝈⏺㟁ὶᐦᗘࡀྥୖࡋ㸪⡆ ᫆ࡵࡗࡁᵴ࡜ྠᵝࡢഴྥ࡟࡞ࡿࡇ࡜ࡀ☜࠿ࡵࡽࢀࡓ㸬࡞࠾㸪ᮏࡵࡗࡁᵴࡣ࡯ࡰ✵Ẽࡢᕳ㎸ࡳࡀ࡞࠸ࡓࡵ㸪⩚᰿㌴ ࡢᅇ㌿㏿ᗘࡢୖ᪼࡟ࡼࡿ㝈⏺㟁ὶᐦᗘࡢపୗࡀ࡞࠸ࡇ࡜ࡀࢃ࠿ࡗࡓ㸬ࡋ࠿ࡋ㸪㐃⥆〇㐀⿦⨨ࡢࢻ࣒ࣛᘧࡵࡗࡁᵴ ࢆ⏝࠸ࡓሙྜ࡟ࡣ㸪⡆᫆ࡵࡗࡁᵴࡼࡾ㝈⏺㟁ὶᐦᗘࡀ1/2 ࡯࡝ࡲ࡛పୗࡋࡓ㸬⡆᫆ࡵࡗࡁᵴ࡟౑⏝ࡉࢀࡓ࣡࢖ࣖ ࡣ㛗ࡉࡀ 100mm ⛬ᗘ࡛࠶ࡾ࣡࢖ࣖ࡟ὶࢀࡿ㟁ὶࡀᑠࡉ࠸ࡓࡵ㸪࣡࢖ࣖࡢ㟁Ẽ᢬ᢠ࡟ࡼࡿⓎ⇕㔞ࡀᑡ࡞࠸㸬ࡑࢀ ࡟ᑐࡋ࡚㸪㐃⥆〇㐀⿦⨨ࡢࡵࡗࡁᵴ࡛ࡣ࣡࢖ࣖࡢ㟁ᴟ㛫㊥㞳ࡀ 350mm ࡜࡞ࡗࡓࡓࡵ㸪⡆᫆ࡵࡗࡁᵴ࡜ྠࡌ㟁ὶ ᐦᗘ࡛ࡵࡗࡁࢆ⾜ࡗࡓሙྜ࣡࢖ࣖ࡟ὶࢀࡿ㟁ὶࡀ3.5 ಸ࡯࡝኱ࡁࡃ࡞ࡾⓎ⇕㔞ࡣ 3.52 ࡟ẚ౛ࡋከࡃ࡞ࡿ㸬ࡲࡓ㸪 ⤥㟁㒊࡜ࡵࡗࡁᾮࡢᾮ㠃ࡢ㛫ࡀ✵Ẽ୰࡟ᭀ㟢ࡉࢀࡓࡓࡵ࣡࢖ࣖ࡟ὶࢀࡿ㟁ὶ㸦ᅗ10(b)㸧ࡀ᭱ࡶ኱ࡁࡃ㸪Ⓨ⏕ࡋࡓ ⇕ࡀ㎿㏿࡟Ⓨᩓ࡛ࡁࡎ࣡࢖ࣖ↝ࡅ࡟⮳ࡗࡓ࡜⪃࠼ࡽࢀࡿ㸬ࡇࡢࡼ࠺࡟ࡣ࣡࢖ࣖࡢ㟁Ẽ᢬ᢠ࡟ࡼࡾ⏕ࡌࡿ⇕ࡀཎᅉ ࡛㐃⥆〇㐀ࡵࡗࡁᵴࡢ㛗ࡉࡀไ㝈ࡉࢀࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬ࡵࡗࡁᾮ୰࡟࡚࣡࢖ࣖ࡬ࡢ⤥㟁ࡀ࡛ࡁࢀࡤ㸪⤥㟁ࡀศ ᩓࡉࢀⓎ⇕ࡀᑡ࡞ࡃ࡞ࡾࡵࡗࡁᵴࢆࡶࡗ࡜㛗ࡃࡍࡿࡇ࡜ࡀྍ⬟ࡔ࡜⪃࠼ࡽࢀࡿ㸬㠀᥋ゐ⤥㟁᪉ᘧࢆ⏝࠸ࢀࡤࡇࡢ ၥ㢟ࡀゎỴ࡛ࡁࡿ࡜⪃࠼ࡽࢀࡿࡀ௒ᚋࡢㄢ㢟࡜ࡍࡿ㸬 㛗ࡉࡀ350mm ࡜ 550mm ࡢ 2 ✀㢮ࡢࡵࡗࡁᵴ㸦ᅗ 11(a)㸧ࢆ⏝࠸㸪ࢻ࣒ࣛᘧࡵࡗࡁᵴࡢ㛗ࡉ࡟ࡼࡿࡵࡗࡁ⭷ཌࡢ ศᕸࢆㄪ࡭ࡓ㸬ᯒฟࡋࡓࡵࡗࡁ⓶⭷ࡢཌࡉศᕸࢆ ᐃࡍࡿࡓࡵ࡟ࣆ࢔ࣀ⥺ࢆ೵Ṇࡋ࡚90 ⛊㛫ࡢࡵࡗࡁࢆ⾜ࡗࡓ㸬 ࡵࡗࡁࡢ㟁ὶᐦᗘࡀ100A/dm2ࡢሙྜ࡟ࡣ㸪㛗ࡉࡀ350mm ࡢࡵࡗࡁᵴࡢሙྜ 1.32A ࡢ㟁ὶࡀὶࢀࡿࡀ㸪㛗ࡉࡀ 550mm ࡢࡵࡗࡁᵴ࡛ࡣ 2.07A ࢆὶࡍᚲせࡀ࠶ࡿ㸬๓㏙ࡋࡓࡼ࠺࡟࣡࢖ࣖࡢ㟁Ẽ᢬ᢠ࡟ࡼࡿⓎ⇕➼ࡢཎᅉ࡛㛗ࡉࡀ 550mm ࡢࡵࡗࡁᵴࡣ㝈⏺㟁ὶᐦᗘࡀ⣙ 90A/dm2࡜࡞ࡗࡓ㸬ᮏᐇ㦂࡛ࡣ㸪ࡵࡗࡁࡢᏳᐃᛶࢆ⪃៖ࡋ㸪2 ✀㢮ࡢࡵࡗ ࡁᵴࢆ⏝࠸࡚㟁ὶᐦᗘࢆྠࡌࡃ80A/dm2୍ᐃ࡟ࡋࡓᐇ㦂࡜㸪㛗ࡉࡀ350mm ࡢࡵࡗࡁᵴࢆ⏝࠸࡚㝈⏺㟁ὶᐦᗘ࡟ ㏆࠸170A/dm2࡜ࡋࡓᐇ㦂ࢆ⾜ࡗࡓ㸬ᅗ11(b)࡟ࡣࡵࡗࡁᵴࡢ㧗ࡉ᪉ྥ࡟࠾ࡅࡿࡵࡗࡁᚋࡢ࣡࢖ࣖ┤ᚄࡀ♧ࡉࢀ㸪 ࡵࡗࡁᵴࡢୖୗ㒊࡛⭷ཌࡀ኱ࡁࡃ୰ኸ㒊࡛ᑠࡉࡃ࡞ࡗ࡚࠸ࡿࡇ࡜ࡀศ࠿ࡿ㸬⤥㟁㒊௜㏆ࡢ㟁ὶ㞟୰ࡀ኱ࡁࡃ࡞ࡾ ᯒฟࡋࡓࢽࢵࢣࣝ㔞ࡀከࡃ࡞ࡿࡀ㸪ࡵࡗࡁᵴࡢ୰ኸ㒊࡛ࡣ㟁ὶࡀᑠࡉ࠸ࡓࡵࡵࡗࡁ⓶⭷ࡀⷧࡃ࡞ࡗࡓ࡜᥎ ࡉࢀ ࡿ㸬ࡲࡓ㸪ୖ㒊ࡣୗ㒊ࡼࡾࡵࡗࡁ⓶⭷ࡀࡸࡸཌࡃ࡞ࡗ࡚࠸ࡿ㸬ࡇࢀࡣ㸪㝧ᴟࡢ⤥㟁㒊ࡀࡵࡗࡁᵴࡢୖ㒊ࡔࡅタ⨨

Fig.11 Diameter of wire deposited at various height form the bottom of plating bath

(10)

ࡉࢀ࡚࠾ࡾ㸪ୖ㒊ࡢ㟁Ẽ㞟୰ࡀୗ㒊ࡼࡾ኱ࡁ࠸ࡓࡵ࡛࠶ࡿ㸬㛗ࡉࡀ 550mm ࡢࡵࡗࡁᵴࢆ౑ࡗࡓሙྜ࡟ࡣ㸪ࡵࡗ ࡁᵴࡢୖୗ㒊㸦⤥㟁Ⅼ࡟㏆࠸㸧ࡢࡵࡗࡁ⓶⭷ࡀཌ࠸ࡀ㸪ࡵࡗࡁᵴࡢ୰ኸ㒊ࡢࡵࡗࡁ⓶⭷ࡀୖ㒊ࡢ2/3 ࡯࡝ࡢཌࡉ ࡋ࠿࡞ࡃࡵࡗࡁ⭷ཌࡢࡤࡽࡘࡁࡀ኱ࡁ࠸㸬ࡑࢀ࡟ᑐࡋ࡚㸪㛗ࡉࡀ350mm ࡢሙྜ࡟ࡣ㸪550mm ࡢࡵࡗࡁᵴ࡜ྠᵝ ࡞⭷ཌศᕸ࡜࡞ࡿࡀ㸪ࡵࡗࡁ⭷ཌࡀࡼࡾᆒ୍࡛࠶ࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬ᐇ㝿࡟࣡࢖ࣖᕤලࡢ〇㐀ᕤ⛬࡛ࡣ㸪࣡࢖ࣖ ࡀ୍ᐃࡢ㏿ᗘ࡛ࡵࡗࡁᵴࢆ㏻㐣ࡍࡿࡓࡵ㸪ࡵࡗࡁᵴࡢ㧗ࡉ᪉ྥ࡟ࡼࡿࡵࡗࡁ⭷ཌࡢ୙ᆒ୍࡜࠸࠺ၥ㢟ࡀ࣡࢖ࣖᕤ ලࡢရ㉁࡟ᙳ㡪ࢆ୚࠼ࡿࡇ࡜ࡣ࡞࠸㸬ࡋࡓࡀࡗ࡚㸪ࡵࡗࡁᵴࢆ㛗ࡃࡍࡿࡇ࡜ࡣ㸪ࡵࡗࡁ㟁ὶᐦᗘࢆపୗࡉࡏࡿࡓ ࡵ㸪Ni ࡢᯒฟ㔞ࡀᑡ࡞ࡃ࣡࢖ࣖᕤලࡢ㧗㏿〇㐀࡟ྥ࠿࡞࠸ࡇ࡜ࡀศ࠿ࡗࡓ㸬ࡵࡗࡁᵴࡢᩘࢆቑࡸࡏࡤࡵࡗࡁ㟁ὶ ᐦᗘࡀపୗࡏࡎ㸪࣡࢖ࣖᕤලࡢ〇㐀㏿ᗘࡀྥୖ࡛ࡁࡿ㸬 ⡆᫆ࡵࡗࡁᵴࢆ⏝࠸࡚◒⢏ࡢ௜╔≉ᛶ࡟ࡘ࠸᳨࡚ウࡋࡓ⤖ᯝࢆ฼⏝ࡋ㸪㐃⥆〇㐀⿦⨨ࡢ」ྜࡵࡗࡁᵴ࡟㏻㐣ࡍ ࡿ࣡࢖ࣖ㝃㏆࡟஘ὶࢆᙧᡂࡍࡿࡼ࠺࡟࣡࢖ࣖࡢ๓᪉࡟2 ᮏࡢ㞀ᐖ≀ࢆタ⨨ࡋࡓ㸬࡞࠾㸪ᮏᐇ㦂࡟౑⏝ࡋࡓࡵࡗࡁ ᵴ㧗ࡉࡣ350mm ࡛࠶ࡿ㸬ᅗ 12 ࡟ࡣࡵࡗࡁ㟁ὶᐦᗘࢆኚ໬ࡉࡏࡓሙྜࡢ◒⢏௜╔≧ែࢆ♧ࡍ㸬࠸ࡎࢀࡢ㟁ὶᐦᗘ ࡟࠾࠸࡚ࡶ࣡࢖ࣖ࡟௜╔ࡋࡓ◒⢏ࡢศᩓᛶࡀࡼ࠸ࡇ࡜ࡀ☜ㄆ࡛ࡁࡿ㸬ࡵࡗࡁࡢ㟁ὶᐦᗘࢆኚ໬ࡋࡓ㝿ࡢ࣡࢖ࣖ࡟ ᯒฟࡋࡓ◒⢏ࡢᐦᗘࢆᅗ13(a)࡟♧ࡍ㸬ᯒฟࡋࡓ◒⢏ࡢ㔞ࡣ㟁ὶᐦᗘ࡟ẚ౛ࡍࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬㟁ὶᐦᗘࡀ኱ࡁ ࡃ࡞ࡿ࡟ࡘࢀ㸪ࡵࡗࡁ⓶⭷ࡢᡂ㛗㏿ᗘࡀ㧗ࡃ࡞ࡾ㸪ࡼࡾ▷࠸᫬㛫࡟◒⢏ࢆᅛ╔ࡍࡿࡇ࡜ࡀ࡛ࡁࡓࡓࡵ࡜⪃࠼ࡽࢀ ࡿ㸬ࡲࡓ㸪⩚᰿㌴ࡢᅇ㌿㏿ᗘࢆኚ໬ࡋࡓ㝿ࡢ࣡࢖ࣖ࡟ᯒฟࡋࡓ◒⢏ࡢᐦᗘࢆᅗ13(b)࡟♧ࡍ㸬⩚᰿㌴ࡢᅇ㌿㏿ᗘࡀ ቑ࠼ࡵࡗࡁᾮࡢὶࢀࡀ㏿ࡃ࡞ࡿ࡜㸪᏶඲࡟ᅛ╔ࡋ࡚࠸࡞࠸◒⢏ࡀ⃭ࡋࡃὶືࡍࡿࡵࡗࡁᾮࡸࡵࡗࡁᾮ୰ࡢ◒⢏ࡼ ࡾ⾪✺ࡉࢀ࡚ὶࡉࢀ࡚ࡋࡲ࠺ࡓࡵ◒⢏ࡢ௜╔㔞ࡀῶᑡࡋࡓ࡜⪃࠼ࡽࢀࡿ㸬ࡋࡓࡀࡗ࡚㸪⩚᰿㌴ࡢᅇ㌿ࢆ㏿ࡃࡍࡿ ࡇ࡜࡟ࡼࡾ㸪ࡵࡗࡁ㟁ὶᐦᗘࢆྥୖࡉࡏࡿࡇ࡜ࡀ࡛ࡁࡿࡀ㸪࣡࢖ࣖ࡟ᯒฟࡋࡓ◒⢏ࡢ㔞ࡣపୗࡋ࡚ࡋࡲ࠺㸬⩚᰿ ㌴ࡢᅇ㌿㏿ᗘ࡜ࡵࡗࡁ㟁ὶᐦᗘ࡟㛵ࡋ࡚ࡣ᭱㐺࡞」ྜࡵࡗࡁ᮲௳ࡀ࠶ࡿࡇ࡜ࡀࢃ࠿ࡗࡓ㸬࡞࠾㸪ᚋࡵࡗࡁᕤ⛬࡟ 㛵ࡋ࡚ࡣ◒⢏ࡢᯒฟࡀ࡞࠸ࡓࡵ㸪⩚᰿㌴ࡢᅇ㌿ࡀ㏿࠸࡯࡝㧗࠸ࡵࡗࡁ㟁ὶᐦᗘࡀᚓࡽࢀࡿࡓࡵዲࡲࡋ࠸㸬

Fig.13 Effects of current density or rotating speed of core rotor on diamond density of wire tools

(11)

4. స〇ࡋࡓ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢษ᩿≉ᛶ ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㐃⥆⿦⨨ࢆ⏝࠸࡚5m/min ࡢ〇㐀㏿ᗘ࡛㛗ࡉ 500mࡢࢲ࢖ࣖࣔࣥࢻ࣡࢖ ࣖᕤලࢆヨసࡋࡓ㸬ࢩࣥࢢࣝ࣡࢖ࣖࢯ࣮㸦WSD-K2㸪ओࢱ࢝ࢺࣜ♫〇㸧ࢆ⏝࠸࡚⾲ 3 ࡟♧ࡉࢀࡿษ᩿ᐇ㦂᮲௳࡛ ከ⤖ᬗࢩࣜࢥࣥ࢖ࣥࢦࢵࢺࡢࢫࣛ࢖ࢩࣥࢢࢆ⾜࠸㸪㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢษ᩿≉ᛶࢆホ౯ࡋࡓ㸬࣮࣡ࢡ ࣮ࣟࣛ࡟0.3mm ࡢ࣡࢖ࣖࣆࢵࢳ࡛ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࢆ 3 ᕳࡋ㸪2 ᯛࡢࢩࣜࢥ࢙࣮ࣥ࢘ࣁࢆษࡾฟࡋࡓ㸬◊ ๐ᾮ࡟㛵ࡋ࡚ࡣỈ⁐ᛶ◊๐ᾮ㸦MC-80C㸪ࢺࣛࢫࢥ୰ᒣओ♫〇㸧ࢆỈ࡛ 30 ಸ࡟ᕼ㔘ࡋࡓࡶࡢࢆ⏝࠸ࡓ㸬 ᅗ14(a)ࡣヨసࡋࡓࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල࡟ࡼࡾษ᩿ࡉࢀࡓࢩࣜࢥ࢙࣮ࣥ࢘ࣁࡢ෗┿ࢆ♧ࡍ㸬ከ⤖ᬗࢩࣜ ࢥࣥ࢖ࣥࢦࢵࢺ࠿ࡽ࢙࣮࢘ࣁࡢ๭ࢀࢆ⏕ࡌࡿࡇ࡜࡞ࡃษࡾฟࡍࡇ࡜ࡀ࡛ࡁࡓ㸬ᅗ14(b)࡟ࡣษࡾฟࡋࡓ࢙࢘ ࣮ࣁࡢ⾲㠃⢒ࡉࢆ♧ࡍ㸬ヨసࡋࡓ࣡࢖ࣖᕤලࢆ⏝࠸࡚ษ᩿ࡉࢀࡓࢩࣜࢥ࢙࣮ࣥ࢘ࣁࡢ⾲㠃⢒ࡉࡣ㸪ᕷ㈍ࡢ࣡ ࢖ࣖᕤල࡟ࡼࡾษ᩿ࡋࡓ࢙࣮࢘ࣁ࡜ྠ⛬ᗘ࡛࠶ࡿࡇ࡜ࡀࢃ࠿ࡿ㸬ࡲࡓ㸪ᅛ╔ࡋࡓ◒⢏ࡢᐦᗘࡀ㧗࠸࣡࢖ࣖᕤ ලࢆ౑⏝ࡋࡓሙྜ㸪࢙࣮࢘ࣁࡢ⾲㠃⢒ࡉࡀࡼࡃ࡞ࡿࡇ࡜ࡀ☜ㄆࡉࢀࡿ㸬ࡇࢀࡣ㸪࣡࢖ࣖᕤලࡢ◒⢏ᐦᗘࡀ㧗 ࠸࡯࡝◒⢏ࡢᖹᆒษ㎸ࡳ῝ࡉࡀᑠࡉࡃ࡞ࡾ࢙࣮࢘ࣁࡢ⾲㠃⢒ࡉࡀྥୖࡍࡿࡓࡵ࡛࠶ࡿ㸬౑⏝ࡋࡓࢲ࢖ࣖࣔࣥ ࢻ࣡࢖ࣖᕤලࡢษ᩿๓ᚋࡢ෗┿ࢆᅗ15 ࡟♧ࡍ㸬◒⢏ࡢඛ➃࡟そࢃࢀࡓࢽࢵࢣࣝ⓶⭷ࡣ࡞ࡃ࡞ࡗ࡚࠸ࡿࡀ㸪 ◒⢏ࡢ⬺ⴠ➼ࡢ࣡࢖ࣖᕤලࡢᛶ⬟࡟኱ࡁࡃᙳ㡪ࡍࡿࢲ࣓࣮ࢪࡀ࡞࠸ࡇ࡜ࡀ☜ㄆࡉࢀࡿ㸬ࡋࡓࡀࡗ࡚㸪ࢻ࣒ࣛ ᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල㐃⥆〇㐀⿦⨨ࢆ⏝࠸࡚㧗㏿࡟࣡࢖ࣖᕤලࢆ〇㐀ࡍࡿࡇ࡜ࡀྍ⬟࡛࠶ࡿࡇ࡜ ࡜㸪〇㐀ࡉࢀࡓࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡀ㧗࠸◒⢏ಖᣢຊࢆ᭷ࡍࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡓ㸬 5. ⤖   ㄒ ᮏ◊✲࡛ࡣ㸪ࡵࡗࡁࡢ㟁ὶᐦᗘࢆྥୖࡍࡿࡇ࡜࡟ࡼࡾ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀㏿ᗘࢆ㧗ࡵࡿࡇ࡜࡜ 㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල〇㐀ࡢ࣐ࣝࢳ໬ࢆ┠ⓗ࡜ࡋ㸪ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤල〇㐀ἲࢆᥦ᱌ࡋ ࡓ㸬ࡲࡎ㸪⡆᫆ࢻ࣒ࣛᘧࡵࡗࡁᵴࢆ⏝࠸࡚࣡࢖ࣖ࡬ࡢࡵࡗࡁ≉ᛶࢆㄪᰝࡋࡓ㸬ࡲࡓ㸪ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ ࣡࢖ࣖᕤල〇㐀⿦⨨ࢆ㛤Ⓨࡋ㸪㝈⏺㟁ὶᐦᗘ㸪◒⢏ࡢ௜╔≧ែ➼࡟ࡘ࠸᳨࡚ウࡋࡓ㸬㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤ ලࢆヨసࡋ㸪ከ⤖ᬗࢩࣜࢥࣥࡢษ᩿ᐇ㦂ࢆ⾜ࡗࡓ㸬ᚓࡽࢀࡓ⤖ᯝࡣ㸪௨ୗࡢ㏻ࡾ࡛࠶ࡿ㸬

Fig.14 Photo and surface roughness of sliced silicon wafer

(12)

(1) ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻᕤලࡢ〇㐀⿦⨨ࡢࡵࡗࡁᵴ࡟࠾࠸࡚ࡣ㸪ࡵࡗࡁᾮࡀ⃭ࡋࡃᨩᢾࡉࢀ㸪100A/dm2 ௨ୖࡢࡵࡗࡁ㟁ὶᐦᗘࡀᐇ⌧࡛ࡁ㸪㧗㏿࡟㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ〇㐀ࡀྍ⬟࡛࠶ࡿࡇ࡜ࡀ᫂ࡽ࠿ ࡟࡞ࡗࡓ㸬 (2) ࢻ࣒ࣛᘧࡵࡗࡁᵴࢆ⏝࠸࡚ྠ᫬࡟ᩘᮏࡢ࣡࢖ࣖ࡬ࡢࡵࡗࡁࡀ࡛ࡁࡿࡇ࡜ࡀ☜ㄆࡉࢀࡓ㸬ᩘ༑ mm ⛬ᗘࡢ㛫 㝸࡟࣡࢖ࣖࢆタ⨨ࡍࢀࡤ࣡࢖ࣖ㛫࡟㟁Ẽⓗ࡞ྲྀࡾྜ࠸ࡀ࡞ࡃ㸪࣡࢖ࣖࡢ෇࿘࡟ᆒ୍࡞ࡵࡗࡁ⓶⭷ࡀᚓࡽࢀ ࡿ㸬 (3) ࣡࢖ࣖࡢ๓᪉࡟㞀ᐖ≀ࢆタ⨨ࡍࡿࡇ࡜࡟ࡼࡾ㸪࣡࢖ࣖࡢ࿘ᅖ࡟஘ὶࡀᙧᡂࡉࢀ࣡࢖ࣖ࡟ᯒฟࡋࡓ◒⢏ࡢศ ᩓᛶࢆྥୖ࡛ࡁࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬 (4) ࡵࡗࡁ㟁ὶᐦᗘࡀ㧗࠸࡯࡝⩚᰿㌴ࡢᅇ㌿㏿ᗘࡀప࠸࡯࡝㸪◒⢏ࡢᯒฟ㔞ࡀከࡃ࡞ࡿࡇ࡜ࡀศ࠿ࡗࡓ㸬⩚᰿ ㌴ࡢᅇ㌿ᩘࢆ㧗ࡃࡍࡿࡇ࡜࡟ࡼࡾ㧗࠸ࡵࡗࡁ㟁ὶᐦᗘࡀᚓࡽࢀࡿࡀ㸪」ྜࡵࡗࡁᕤ⛬࡟ࡣ⩚᰿㌴ࡢᅇ㌿㏿ ᗘ࡜ࡵࡗࡁ㟁ὶᐦᗘࢆ⥲ྜⓗ࡟⪃៖ࡍࡿᚲせࡀ࠶ࡿ㸬 (5) ࢻ࣒ࣛᘧ㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㐃⥆〇㐀⿦⨨ࢆ⏝࠸࡚ヨసࡋࡓ࣡࢖ࣖᕤලࡣ㸪ᕷ㈍ရ࡜ྠ➼ࡢษ ᩿⬟ຊࢆ᭷ࡍࡿࡇ࡜ࡀ☜࠿ࡵࡽࢀࡓ㸬 ᭱ᚋ࡟㸪ᮏ◊✲ࢆ⾜࠺࡟ᙜࡓࡗ࡚ᐇ㦂࡟༠ຊࡉࢀࡓ❧࿨㤋኱ᏛࡢඖᏛ⏕࣭᳿⪷ࡳࡻ࠺Ặ㸪Mohd Aizat Ặ࡟ᚰ ࡼࡾឤㅰࡋࡲࡍ㸬ࡲࡓ㸪ྎ‴ࡢỤಙ᭷㝈බྖ㸦FACT㸧ࡼࡾࢲ࢖ࣖࣔࣥࢻ◒⢏ࢆࡈᥦ౪࠸ࡓࡔࡁࡲࡋࡓ㸬ࡇࡇ࡟ ῝ࡃឤㅰࡢពࢆ⾲ࡋࡲࡍ㸬 ᩥ ᩥ   ⊩ ὸ἟ᙉ㸪ὶయࡢྍど໬ࣁࣥࢻࣈࢵࢡ㸪ᮅ಴᭩ᗑ (1977), pp.277-279. ᮾ᫛㸪ὶయຊᏛ㸪ᮅ಴᭩ᗑ (1999), pp.81-83.

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༓ⴥᗣ㞞, ㇂Ὀᘯ, ᴮᮏಇஅ, 㟁╔ࢲ࢖ࣖࣔࣥࢻ࣡࢖ࣖᕤලࡢ㧗㏿〇㐀ἲࡢ㛤Ⓨ, ᪥ᮏᶵᲔᏛ఍ㄽᩥ㞟 C ⦅㸪 Vol.69, No.680 (2003), pp.303-309.

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Table 1 Basic electroplating condition
Fig. 7 Cross section of two wires plated in parallel
Fig. 9 Continuous manufacturing system of diamond wire tools
Table 3 Schematic diagram and conditions of slicing test.

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