Study on strategic alliance of the semiconductor company : From the view
of Japanese company's competitiveness issues and business area.
5 5 6 6 9 10 11 14
16 16 17 18 20 22 24 26 28
30 31 31 32 35 35 36 37 38
DRAM 41
42 42 44 46
46 47 49 51
DRAM 52
54 54 55 56
DRAM 61
62
65 65 68 68 69 70 72 72 74 74 75 76 81 89 91 91 93 95
98 99 103 103
105 107 107 107 109 110 111 111 112 113 114
119
UMC 119
UMC 119
SOC 120
UMC 121
TSMC 124
TSMC 124
125
TSMC 128
131
TSMC 134
TSMC 134
MPU 134
TSMC 135
137 138 138 139 140 142 142 143
144 145 153 154 156 156 157
< > 161
IT
30 IT
1 1980
2
DRAM3
1 (1994)
2 (1996) p.130-133
3 DRAM(Dynamic Random Access Memory)
1990
2000
DRAM 2003 2010 NEC
DRAM
4 1990 DRAM
LSI5 Large Scale
Integrated Circuit 2000
DRAM NEC DRAM
DRAM 2011 3
5143
1
4 Joint Electron Device
Engineering Council, JEDEC SEMI
SEMI http://www.semi.org/jp/Standards))
5 LSI LSI
IC 2005
p.116
5569
6 1
300 1100
7 DRAM
2012 2 4480
8
2013 3 1675 626
1339
9 3 NEC
2013 1500
3 10
6 2012 2 27
http://www.tsr-net.co.jp/news/flash/1217131_1588.html
7 2012 2 27
8 2013 6 1
DRAM
9 2013 5 9 2013 3
http://japan.renesas.com/media/ir/event/pdf/presentation/2013_q4_presen.pdf
10
http://www.kantei.go.jp/jp/headline/seicho_senryaku2013.html
TSMC
2000
DRAM
LSI
LSI LSI
MPU
11
TSMC
2001
1960 1980
1990
11 (2008)
Vol.42 No.2 pp.19-32
DRAM
2002
12
12 2002 2002 3
2011
13
IBM
13 2011 R&D
62 3 p.225-240
TSMC
1999 2000 2003
Make or Buy
Williamson 1985
14 2005
15
2010
TSMC UMC
14 Williamson, Oliver , The Free Press,
p.90-95.
15 (2005)
2005 10 p.183-205
IP
1998
16
7
16 1998
1990
1985
Dornbusch, Fischer, and Samuelson(1977)
17
2002 18
17 Dornbusch, Fischer and Samuelson (1977) "Comparative Advantage, Trade, and Payments in a Ricardian Model of a Continuum of Goods", American Economic Review, Vol.67, No.5 pp.823-839.
18 2002 2002 3
DRAM
Smith,1776
19
19 Smith, Adam 1776 An Inquiry into the Nature and Causes of the Wealth of Nations , 2008
Allow,1976
20
20 Arrow, Kenneth 1974 The limits of organization 1976
21
2003 22
23
21 2003 3 p.30
22 2003 p.134-141
23 JEITA
http://semicon.jeita.or.jp/word/word.html
Chandler, 1990
24
TI
1987 2
20 30
25
24 Chandler, Alfred D.,Jr.(1990 Scale and Scope: The Dynamics of Industrial Capitalism , Harvard University Press
1993
25 (1987)
p.97
Coase 1937 26 1975 27
1937 coordination
uncertainty
1975
1985
26 -405.
27 Williamson, Oliver E.(1975) Markets and Hierarchies: Analysis and Anti-Trust Implications , New York: Free Press 1980
)
1998
28
28 1998
Marshall, 1920 29
Porter, 1986
29 Marshall Alfred (1920) (8th ed.), Macmillan and Co., London
1985 2 p.200-201
30 1998
31
McKendrick, Doner & Haggard 2000 HDD
et al. 2000
32
et al.. 2000 HDD
HDD IT
HDD
30 Porter, Michael E. (1986) , , The Free Press.
(1989) p.35-36
31 Porter Michael E. (1998) , , Harvard Business School Press.
1999 <II> p.70
32 McKendrick, David G., Doner, Richard F., Haggard Stephan (2000)
. Stanford Business Books. p.42-64
TSMC
LSI LSI
IP 33
33 IP Intellectual Property Core LSI
2006
34
DVD
IT
IT
2008
34 2006
RIETI Discussion Paper Series 06-J-043
35
DRAM 1980 DRAM 9
DRAM
CCD CMOS
MPU FPGA
MPU
IT
35 2008
08-E-001
IT
1985 1998
20
1980
IBM
Moore, 1995
36
Grove, 1996
37
36 Moore, Gordon E. [ ], [ ] (1995) p.105-106
37 Grove, Andrew S. (1996)
Doubleday Business Press. p12-13
1947
IC Integrated Circuit
IC)
IC)
IC) MPU
MCU
MPU Micro-Processing Unit
MPU
IC
MPU
IC
DSP Digital Signal Processor
Micro Controller Unit
IT
IC
IC
IC
1970
LSI LSI
LSI
LSI
1
LSI
IC LSI
LSI DVD
LSI
LSI LSI
LSI
DRAM DRAM
1 DRAM
LSI
LSI LSI
LSI IC
IC LSI
LSI
LSI
LSI 1972 MPU
MPU MPU
MPU IC 1980
LSI ASIC
Application Specific Integrated Circuit IC
LSI ASIC
ASIC
LSI LSI
ASIC
ASIC
LSI LCD
DSP Digital Signal Processor
LSI
LSI 1
IC LSI 1
LSI 1 LSI
LSI
SOC System On a Chip
MPU
LSI
DRAM NAND NOR
DRAM
NAND DRAM
NOR NAND
NAND
DRAM
20
20
1948
38 IBM
39
IT
1980
38 (1996) p34-40
39 (1998) p.102-109
80 90
DRAM 1980 90
MPU
1990
DRAM
1990 2000 5 2010 2012 5
10
1980 1985 1990 1995 2000 2005 2010
1 TI NEC NEC
2 NEC
3 NS TI ST TI
4 NEC TI
5 TI ST Micro
6 NEC
7 TI TI ST Micro
8 FCI
9 NS Philips
10 NEC
1985 P104 1999 P72
IC 2000 P29 IC 2003 P43
IC 2009 P251 2010 HIS 2012 12 5 )
1990 DRAM 3
MPU
2000 3
2000
2010 2
2010 13.3%
9.2% 4.3% TI 4.3% 3.9%
5 35% 40
2005 2010 CDMA LSI
SOC
41
2009 2
2010 9
MPU DRAM
SOC GLOBALFOUNDRIES TSMC
2008 2009
2010
40 2012 2012 12 5 IHS
IS06-PR313
(http://www.ihs.com/news-analysis/industry-economic/index.aspx)
41 (QUALCOMM) 1985
CDMA
42
50%
43
0 50000 100000 150000 200000 250000 300000 350000
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
2000
LSI LSI
TSMC
42 2012 11 13 WSTS 2012
WSTS HP http://semicon.jeita.or.jp/statistics/wsts.html))
43 2009 IC p.316
1982 8 70%
44 MPU
5 70
2006
45
DRAM MPU
1 75%
44 (1982) p.12-14
45 (2006) IC
p.212-218
92.8%
78.7%
DRAM 81.9%
74.4%
91.7%
ASIC 55.0%
Barney, 2003
46
MPU
MPU
MPU
Grove, 1995
47
1987 1994
48 2 20 30
46 Barney, Jay B. , Gaining and Sustaining Competitive Advantage ,
(2003) p.198-199
47 Grove, Andrew S. (1995) Vintage Press. p.15-32.
48 (1987)
p.97
49
ST
DRAM DRAM
SK 2
DRAM
2 5
DRAM
2008 DRAM
DRAM
49 p.103 (1994)
p.26
DRAM
42%
SK 23%
12%
13%
4% 2%
4%
2011
28%
16% 16%
11%
10%
7%
5% 7%
2006
1980 90
1980
1990
1980
1,000 90 10
2000
50
50 NVIDIA
GPU ( )
MPU
TSMC
2011 TSMC
145 2
2 UMC 3
2008 AMD
2009 2 UMC 200mm
SEMI World Fab Forecast February 2012 (URL http://www.semi.org/jp/node/16481)) 2012
0 500 1000 1500 2000 2500 3000 3500 4000 4500
2009 2010 2011 2012 2013
DRAM
MPU
TSMC UMC 6
2011
1 TSMC 14,533 48.8% 13,332
2 UMC 3,604 12.1% 3,824
3 3,580 12.0% 3,520
4 SMIC 1,319 4.4% 1,554
5 613 2.1% 509
6 IBM 545 1.8% 500
7 516 1.7% 505
8 483 1.6% 512
9 470 1.6% 390
10 431 1.4% 149
26,094 87.7% 24,795
3,660 12.3% 3,510
29,754 100.0% 28,305
1 TSMC 5
6
3
X
2006 2008
5 2009 3
2003
51 TSMC UMC
51 2003
9 p.129-136
TSMC 2012 2
UMC
1970 DRAM
1980 NEC
50%
1980
1990
DRAM DRAM
1980 90
DRAM DRAM
1990
LSI
2000
DRAM
1999
1999 NEC
DRAM 2002
11 2 NEC DRAM NEC
2003 4 3 4
2010 NEC
2 0 1 2 2 NEC
D R A M
L S I
NEC
2008
2012 2
2008 2009
DRAM
2003
NEC 3
2012 12 500
8 1500 52
2000
52 2012 2 8
2006 DRAM
53 (2006)
UMC UMC
UMC 1984
NMB
2012 8 54 UMC 1998 UMC
UMC 2009 75 55
UMC
53 (2006)
RIETI Discussion Paper Series 06-J-043 2006 5
54 UMC 2012 8 21
2012 09 24 HP (http://www.umcj.com/)
55 UMC 2009
http://www.umcj.com/Japanese/investor/settlement.asp
56
2012 2 2013
57
4 2012 7
3 1 9
LSI 58
TSMC UMC
2011
59 High-k/Metal
gate
High-k/Metal gate
56 LSI
2012 2 8 2012 10 13
57 CEO 2012 8 20
p.16-17
58 2012 2 8
59 (2011)
CPU 2011
CPU CPU
CPU ARM
CPU
ARM 60
ARM
60 ARM T. Brown 2010 8 24
MPU DRAM
CPU LSI
DRAM
DRAM 1980 DRAM
90% 1980
MPU
DRAM DRAM 1980
DRAM
1990 DRAM
1990 DRAM
DRAM DRAM
DRAM
2012 2 DRAM
61
2003 NEC DRAM
1990
DRAM 1 DRAM 2000
2009 3
300 2012 2
61 2013 2 27
2013 3 1
1966
1970 IT
IT 1973
62 ITRI ITRI
NSC ITRI
63
1999 2000
64 1970
1979 ITRI
UMC UMC
UMC 1995 2000
TSMC 1987 ITRI
TSMC UMC TSMC
65 TSMC
62 ITRI
ITRI http://www.itri.org.tw/
63 2009 p.122-130
64 1999
65 2004
57 4 p.76
TSMC
ITRI
TSMC
2 UMC 3
ITRI IBM
2000 LED Light
Emitting Diode IT
IT 1990
2000
TSMC UMC
1990
66
2005
67
66 2009 p.122-130
67 2005
2005 10 pp.83 205
2000
TSMC
TSMC 450mm
28nm n 10 1
68
KPMG (Matuszak &
Steger, 2012)
69
2012 450mm 20nm
45% 450mm
20nm 26%
40 450mm
20nm
68
2007
69 G. Matuszak & R. Steger (2012) "Global Semiconductor Survey: A more optimistic outlook for 2013" KPMG LLP, pp11.
TSMC 450mm
2001 300mm
TSMC 450mm
70 1
1 1
70 450mm SEMI
http://www.semi.org/jp/News/MailMaga/ctr_041704
(mm) 300mm 450mm
1x1 68,184 134,357 1.97
2x2 16,896 35,857 2.12
4x4 4,144 9,197 2.22
6x6 1,804 4,081 2.26
8x8 1,012 2,281 2.25
10x10 624 1,449 2.32
14x14 308 729 2.37
18x18 180 429 2.38
TSMC 450mm
300mm 450mm
450mm 100
TSMC
450mm 300mm
450mm
450mm
TSMC
TSMC 450mm
TSMC 450mm
28nm
1
LSI IC 300mm
28nm 20nm
450mm 20nm
TSMC TSMC 28nm
28nm
TSMC 28nm 71
28nm
28nm 300
1 5 LSI
28nm
71
LSI IP
SMC SMC
UMC UMC
TSMC TSMC SMC
UMC TSMC
SMC UMC TSMC
IBM IBM IBM IBM UMC
TSMC
UMC ST Micro ST Micro ST Micro ST Micro ST Micro
130 90 65 45/40 32/25 22/20
Nanometer Nanometer Nanometer Nanometer Nanometer Nanometer
TSMC
28nm
TSMC TSMC
2009
TSMC 4
2
HTC 3
72 TSMC
3
(%) (%) (%) (%) (%) (%)
2 0 0 9 197 0.0 6.9 88 0.0 5.9 189 0.0 24.4
2 0 1 0 276 40.1 6.8 127 44.3 4.6 170 -10.1 23.6
2 0 1 1 316 14.5 7.6 170 33.9 3.7 134 -21.2 25.0
2 0 1 2 388 22.8 7.8 138 -18.8 5.1 131 -2.2 2.6
TS MC HTC
72 TSMC 2013 4 17
DRAM DRAM
ITRI 1990 5 DRAM
DRAM
DRAM
DRAM DRAM
DRAM
DRAM 5 1995
16M 64M DRAM
1998 256M DRAM IBM
73 1994
16M DRAM
DRAM 2012 8
12 1996
64M DRAM 2002 2003
DRAM
2009 2012 3
2006
DRAM
DRAM DRAM
DRAM
73
40 2012 12 31
DRAM
DRAM DRAM
2000 EMS
DRAM
2000
COCN
74
21 IT
DRAM
DRAM DRAM DRAM
LSI NEC 3
LSI
4
50 70 100
75 LSI
74 COCN
(COCN) JEITA 2007
- p.iii p.63 www.cocn.jp/common/pdf/4handotai.pdf
75 (3) 2012 12 28
http://japan.renesas.com/edge_ol/special/03/index.jsp
TSMC UMC
IP LSI
TSMC UMC
TSMC UMC
2010 10
DRAM
76
2014
77
2000
1960 1980
1990 DRAM
76
http://www.toshiba.co.jp/about/ir/jp/finance/segment.htm LCD
http://www.samsung.com/us/aboutsamsung/investor_relations.html
77 2013 12 20
ITRI DRAM
DRAM
DRAM
DRAM
MPU
2012
DRAM DRAM
7,858
DRAM 2,196
TSMC 13,640 4,472
UMC 3,058 228
DRAM 1,006
MPU 42,561 8,781
7858 TSMC
TSMC 1 3640
TSMC
UMC 2
3 3058 TSMC
TSMC UMC
2012 2 9
DRAM 1006
TSMC
2010 2012 3
2009 2011
3
TSMC UMC
100.0 100.0 100.0 100.0 100.0 100.0
32.4 24.3 47.7 22.1 63.2
35.6 8.5 31.8
34.3 11.4 23.6
32.4 24.3
3 3
2 TSMC
47.7
TSMC
TSMC
UMC 22.1 2
2 UMC TSMC TSMC
TSMC
DRAM
TSMC UMC
TSMC 12 UMC 14 15%
35 34 3
TSMC
IP IP
IP 78 LSI
IP
LSI LSI
UMC TSMC IP
IP
IP EDA
EDA EDA
EDA
-2.7 -9.8
LSI IP
IP EDA
IP
IP
78 2006 90 2006
5 pp.43-45
3
3
3
3
3
TSMC UMC
ROA 20.6 5.0 17.7
ROE 25.6 6.1 25.0
20.9 31.9 79.4 74.8 15.4 67.8
ROA Return On Asset
79
ROA
79 ROA
ROA ROA
2 ROA
2 ROA
3.8 13.6 10%
NEC
19
8 9
DRAM
LSI
LSI
2012 19 11
ROA
ROA TSMC ROA
ROA 5%
80 TSMC ROA 20.6%
TSMC ROA
80 (2002) 2002 5
14 02-8M
ROA 1992 2001 3%
ROA TSMC
ROA
UMC ROA5% UMC TSMC
TSMC
UMC ROA
ROA
ROE Return On Equity
81 ROA
ROE
ROE
ROE
2 ROE ROE TSMC
25.6 ROE TSMC 25.0%
TSMC 3
25 UMC ROE 6.1
2 ROE
5
2012 3
2265 2013 3 1339
1578 7 2012
81 ROE
20.9 31.9
TSMC 79.4 UMC 74.8 7
TSMC
79.4 UMC 74.8% 50
1
TSMC UMC
387 2,632 20,861 3,704 46,450
2,950 17,760
3
3
3
387 3 2632
UMC 3 3704 1
TSMC
300mm 450mm
TSMC
7858 3
1940
25% 2671
122% TSMC 1 7911
131% UMC 4420
145% 4420
109% 3 1
ROA
LSI
2012 12 500
8 1500
3 387
LSI
1940 1553
3
ROA
3 2671
2632 40
TSMC
3 2 861
86% 7911
14%
TSMC ROA ROE
TSMC
4 6450 TSMC 2 2 8691
62% 1 7760
TSMC
UMC 3 3704 4420
716 UMC
761 1096
DRAM
DRAM
DRAM
5 5
5
5
5 (1)
(1)
2008 2009
2011 2010 2012
-8,000 -3,000 2,000
-2,000 3,000 8,000
2008 2008
2011 2010 2011 2011 2011 2012 2011 2012
8,000 8,000 --3,0003,0003,000 2,000
2,000
2010 1,000
2011
1000
2008 5 2010
2012 2013 3
2013
4 (2)
(2)
2008
2009 2011 2010
-8,000 -3,000 2,000
-2,000 2008 3,000 8,000
2011 2010 2011
8,000 8,000 --3,0003,0003,000 2,000 2,000
2008 2009 2000
1000 2011
2009 1000 DRAM
2009
2009 2010
TSMC
TSMC 5 (3)
(3) TSMC
2008
2009
2010 2011
2012
-8,000 -3,000 2,000
-2,000 3,000 8,000
2010
TSMC
TSMC
TSMC 2009
7000
TSMC 2008 2012
2012 7000
TSMC
TSMC
TSMC
UMC
UMC 5 (4)
(4) UMC
2009 2008
2011 2010 2012
-8,000 -3,000 2,000
-2,000 02009 2,000 4,000 6,000 8,000
2010 2010 2011 2010 2011 2012 2012
--3,0003,0003,000 2,000
2,000 00
UMC
UMC
1000 2000
2010
UMC CMOS IC
5 (5)
(5)
2008
2009
2010
2011
2012
-20,000 -15,000 -10,000 -5,000 0
0 5,000 10,000 15,000 20,000
0 0 0 0
2009 2010
31.8%
23%
(5)
2009 1 2010
3 1 5 7000
3
TSMC 5
450mm
MPU
82
3 4
A B C D
82 2013 1 17 2012 4 2012
,CEO
0
0 TSMC
UMC A
B
D C
FCF
5 TSMC
A UMC B TSMC
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D
D A
IP
IP
ARM IP
DRAM DRAM
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DRAM
DRAM 1 1 DRAM
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DRAM
DRAM DRAM
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LSI
DRAM 20nm
Thorough Silicon Via, TSV
DRAM LSI
IP LSI
DRAM
SOC DRAM
ARM IP
IP LSI
2012
83
LSI
SOC IP
83 2012 2012 11 6
2000
DRAM SOC SOC
TSMC
TSMC UMC
IP
1975
1998
84
84 1998
1985
1985
85
2006 3
86
85 Williamson, Oliver E. (1985) p.90-95
86 2006 p.19-28
2
k-
k
Willamson 1985 P93
G C
C G
2
C
(Efficient Boundary)
87
G 88
1975
87 2010 1985)
(G1) (G2) (C1)
(C2) ( (2010)
TCM
68 )
88 1985
G
k
89
G C
C G
G k
k
C G
k k
k C G
20
TSMC
89 2008
p.65-68
2007
90
k-
k-
' k k'
Willamson 1985 P93
G
C G' C
C G
1985
90 (2007) 7 2007 7
pp.41
91
G G
k k
C+ G C+ G'
k k
3
C
91 Williamson, Oliver E. (1985) p.91-92.
C G
C
C G
2000
1980 5
1990 1998
3 1990 2000
DRAM
92 LSI
LSI
LSI
DRAM
92 80 DRAM 5 NEC
2001 DRAM NEC
1990 DRAM
2005
93
Cf Gf
G
C
C G
93 2005
2005 10 pp.183 205
Gf G
Cf Gf
94
TSMC UMC
Cf
94
k
Gf G
Cf Gf
k
C G
Ci Gi
Ci Gi
Ci Gi k
k
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k
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I
IP
k
LSI
k k
k k
1998
95
2004
96 TSMC
TSMC
97
TSMC
2013 TSMC
TSMC 98 TSMC
99
95 1998 p133-135
96 2004
Discussion Paper Series #04-08
97 TSMC SUMCO
98 2012 5 29
99 http://www.tel.co.jp/about/tech/index.htm
2012 3 11
100 TSMC
TSMC 450mm TSMC
(Alchian & Demsetz(1972)) (Ross(1973))
(Jensen & Meckling(1976))101 2000 102
GPS
100
2012 3 11
101 Jensen, M.C. & Meckling 308-310.
102 2000
36 4 pp.418
LSI 103
32nm 28nm TSMC UMC 3
TSMC 28nm
28nm
103 2010 Phone4 A4CPU
45nm 2011 10 Phone4S
A5CPU 32nm 2012
Phone5 28nm
A4CPU A5CPU
1
TSMC 28nm
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17 HP
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106
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105 2008 3 17 HP
106 PTI UMC 3 28nm TSV
2011 5 30 HP
(http://www.elpida.com/ja/news//2011/05-30.html)
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2012 5 TSMC
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4 108 TSMC LSI
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2011
TSMC TSMC
2000
1978 MC6801 MC6801
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108 2012 5 29
TSMC LSI
2012 5 24
1 4000
CPU ROM 2K RAM 128 16
CVT ABS
2000 10%
50 70
100 90%
LSI ECU Electrical Control Unit
ECU M RAM 192K
LSI ECU SOC
ECU
ECU ECU
ECU
ECU
20 109
109 -40 200 95% 50G 15 25kV
20 1ppm 100 1
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32 65nm 90nm 16
130nm 180nm
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100
ECU
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32 2013
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115 2010 5 11
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1980 DRAM 90
2008
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1973 ITRI
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2009
2011
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2012 7
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