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175 / J176 / MMBF J175 / MMBFJ1 76 / MMBFJ177 — P-Channe l Switch
J175 / J176 / MMBFJ175 / MMBFJ176 / MMBFJ177 P-Channel Switch
Ordering Information
Figure 1. J175 / J176 Device Package Figure 2. MMBFJ175 / 176 / 177 Device Package
Part Number Marking Package Packing Method
J175 - D26Z J175 TO-92 3L Tape and Reel
J176-D74Z J176 TO-92 3L Ammo
MMBFJ175 6W SOT-23 3L Tape and Reel
MMBFJ176 6X SOT-23 3L Tape and Reel
MMBFJ177 6Y SOT-23 3L Tape and Reel
1. Drain
1 2 3 1
2 3 Straight Lead Bent Lead
TO-92
Bulk Packing Tape & Reel Ammo Packing
2. Gate
3. Source SOT-23
Mark: 6W / 6X / 6Y G
D S
Note: Source & drain are interchangeable.
Description
This device is designed for low-level analog switching
sample-and-hold circuits and chopper-stabilized
amplifiers. Sourced from process 88.
J175 / MMBFJ1 76 / MMBFJ177 — P-Channe l Switch
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Absolute Maximum Ratings
(1),(2)Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera- ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi- tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at T
A= 25°C unless otherwise noted.
Notes:
1. These ratings are based on a maximum junction temperature of 150 ° C.
2. These are steady-state limits. ON Semiconductor should be consulted on applications involving pulsed or low- duty cycle operations.
Thermal Characteristics
Values are at T
A= 25°C unless otherwise noted.
Note:
3. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (3.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size.
Symbol Parameter Value Unit
V
DGDrain-Gate Voltage -30 V
V
GSGate-Source Voltage 30 V
I
GFForward Gate Current 50 mA
T
J, T
STGOperating and Storage Junction Temperature Range -55 to + 150 ° C
Symbol Parameter
Max.
J175 / J176
(3)Unit
MMBFJ175 / MMBFJ176 / MMBFJ177
(3)P
DTotal Device Dissipation 350 225 mW
Derate Above 25 ° C 2.8 1.8 mW/ ° C
R
θJCThermal Resistance, Junction to Case 125 ° C/W
R
θJAThermal Resistance, Junction to Ambient 357 556 ° C/W
175 / J176 / MMBF J175 / MMBFJ1 76 / MMBFJ177 — P-Channe l Switch Electrical Characteristics
Values are at T
A= 25°C unless otherwise noted.
Note:
4. Pulse test: pulse width ≤ 300 μ s, duty cycle ≤ 2.0%.
Symbol Parameter Conditions Min. Max. Unit
Off Characteristics
V
(BR)GSSGate-Source Breakdown Voltage I
G= 1.0 μ A, V
DS= 0 30 V
I
GSSGate Reverse Current V
GS= 20 V, V
DS= 0 1.0 nA
V
GS(off)Gate-Source Cut-Off Voltage V
DS= -15 V, I
D= -10 nA J175 /
MMBFJ175 3.0 6.0
V J176 /
MMBFJ176 1.0 4.0
MMBFJ177 0.8 2.5
On Characteristics
I
DSSZero-Gate Voltage Drain Current
(4)V
DS= -15 V, I
GS= 0
J175 /
MMBFJ175 -7.0 -60.0
mA J176 /
MMBFJ176 -2.0 -25.0 MMBFJ177 -1.5 -20.0
r
DS(on)Drain-Source On Resistance V
DS≤ 0.1 V, V
GS= 0
J175 /
MMBFJ175 125
Ω J176 /
MMBFJ176 250
MMBFJ177 300
J175 / MMBFJ1 76 / MMBFJ177 — P-Channe l Switch Typical Performance Characteristics
Figure 3. Common Drain-Source Figure 4. Parameter Interactions
Figure 5. Transfer Characteristics Figure 6. Transfer Characteristics
Figure 7. Normalized Drain Resistance vs.
Bias Voltage
Figure 8. Output Conductance vs. Drain Current
-5 -4 -3
-2 -1
0 -20
-16
-12
-8
-4
0
V - DRAIN-SOURCE VOLTAGE (V)
I - DRAIN CURRENT (mA)
DS
D
1.0 V
2.5 V 2.0 V 0.5 V
1.5 V V = 0 VGS
T = 25°C TYP V = 4.5 VGS(off)
A
3.0 V 3.5 V
r - DRAIN "ON" RESISTANCE (ΩΩ)
1 2 5 10
1 5 10 50 100
10 50 100 500 1,000
V - GATE CUTOFF VOLTAGE (V)
g - TRANSCONDUCTANCE (mmhos)
GS (OFF)
fs
I , g @ V = 15V, V = 0 PULSED r @ -100 mV, V = 0 V @ V = - 15V, I = - 1.0 μAGS(off)
DSS
r
D
IDSS
DS DS
GS
DS
DS GS fs
DS
DS gfs
0 1 2 3 4
-32
-24
-16
-8
0
V - GATE-SOURCE VOLTAGE (V)
I - DRAIN CURRENT (mA)
GS
D
V = - 4.5 VGS(off)
25°C V = - 15 VDS
V = 2.5 VGS(off) 125°C
- 55°C
25°C 125°C - 55°C
0 1 2 3 4
0 4 8 12 16
V - GATE-SOURCE VOLTAGE (V)
I - DRAIN CURRENT (mA)
GS
D
V = - 4.5 VGS(off)
25°C V = - 15 VDS
V = 2.5 VGS(off) 125°C
- 55°C
25°C - 55°C 125°C
0 0.2 0.4 0.6 0.8 1
1 2 5 10 20 50 100
V /V - NORMALIZED GATE-SOURCE VOLTAGE (V)
r - NORMALIZED RESISTANCE
GS
DS
r = DS
V @ 5.0V, 10 GS(off) μA
r DS
________
V GS(off)
V GS 1 -
GS(off)
( Ω) Ω) Ω) Ω) Ω)
0.01 0.1 1 10
1 10 100 1000
I - DRAIN CURRENT (mA)
g - OUTPUT CONDUCTANCE ( mhos)
D
os
V = - 4.5VGS(off) f = 1.0 kHz
μ
V = - 2.5VGS(off)
-20V -10V
-10V -20V
-5.0V -5.0V
_
_ _ _
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175 / J176 / MMBF J175 / MMBFJ1 76 / MMBFJ177 — P-Channe l Switch Typical Performance Characteristics (Continued)
Figure 9. Transconductance vs. Drain Current Figure 10. Capacitance vs. Voltage
Figure 11. Noise Voltage vs. Frequency Figure 12. Channel Resistance vs. Temperature
Figure 13. Power Dissipation vs.
Ambient Temperature
0.1 1 10 100
0.1 0.5 1 5 10
I - DRAIN CURRENT (mA)
g - TRANSCONDUCTANCE (mmhos)
D
fs
V = 2.5VGS(off)
V = -15V f = 1.0 kHz
DG
V = 6.0VGS(off) - 55°C
25°C 125°C 25°C
_ _ _ _
0 4 8 12 16 20
1 5 10 100
V - GATE-SOURCE VOLTAGE (V) C (C ) - CAPACITANCE (pF)rs
GS
is
C (V = -15V)is DS
C (V = -15V)rs DS f = 0.1 - 1.0 MHz
0.01 0.1 1 10 100
1 5 10 50 100
f - FREQUENCY (kHz) e - NOISE VOLTAGE (nV / Hz)n
V = - 15V
BW = 6.0 Hz @ f = 10 Hz, 100 Hz = 0.2f @ f ≥ 1.0 kHz DG
I = 5.0 mAD
I = - 0.2 mAD
√
-50 0 50 100 150
10 50 100 500 1000
T - AMBIENT TEMPERATURE ( C) r - DRAIN "ON" RESISTANCEDS
A o
(Ω)
V = 2.5VGS(off) V = 4.5VGS(off) V = 8.0VGS(off)
V = -100 mV V = 0
DS GS
0 25 50 75 100 125 150
0 50 100 150 200 250 300 350
TEMPERATURE ( C) P - POWER DISSIPATION (mW)D
o
TO-92
SOT-23
J175 / MMBFJ1 76 / MMBFJ177 — P-Channe l Switch Physical Dimensions
Figure 14. 3-Lead, TO-92, Molded, 0.2 In Line Spacing Lead Form
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175 / J176 / MMBF J175 / MMBFJ1 76 / MMBFJ177 — P-Channe l Switch Physical Dimensions (Continued)
Figure 15. 3-LEAD, SOT23, JEDEC TO-236, LOW PROFILE LAND PATTERN RECOMMENDATION
NOTES: UNLESS OTHERWISE SPECIFIED A) REFERENCE JEDEC REGISTRATION
TO-236, VARIATION AB, ISSUE H.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE INCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR EXTRUSIONS.
D) DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.
E) DRAWING FILE NAME: MA03DREV10 3
1 2
SEE DETAIL A
SEATING PLANE
SCALE: 2X
GAGE PLANE
(0.55) (0.93)
1.20 MAX
C
0.10 0.00
0.10 C
2.40±0.30 2.92±0.20
1.30 +0.20 -0.15
0.60 0.37
0.20 A B 1.90
0.95 (0.29)
0.95
1.40
2.20
1.00 1.90
0.25 0.23
0.08
0.20 MIN
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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