[final version]Animal Testing Law Moe Honjo
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This Product Change Notification is to announce that ON Semiconductor is expanding Assembly and Test Operations of Cebu former Fairchild Semiconductor for SSOT3 package to
Parts from new Assembly and Test sites can be identified through product marking which follow ON Semiconductor marking format.. Change Category: Wafer Fab Change, Assembly Change,
The Current Material Last Delivery Date may be subject to change based on build and depletion of the current (unchanged) material inventory.. Product Category: Active components
This Product Change Notification is intended to informed the customer that the Wettable Flank leadframe design and plating process are being enhanced, as tabulated below, in order
In case of any differences between the English and Japanese version, the English version shall
Orders received after the Current Material Last Order Date expiration are to be considered as orders for new changed material as described in this PCN.. Orders for
Title of Change: TSSOP 16 Additional Assembly and Test Site (AUTO PARTS) Proposed Changed Material First Ship.. Date: 13 Jan 2022 or earlier if approved
Orders received after the Current Material Last Order Date expiration are to be considered as orders for new changed material as described in this PCN.. Orders for